JPH049621B2 - - Google Patents

Info

Publication number
JPH049621B2
JPH049621B2 JP59128974A JP12897484A JPH049621B2 JP H049621 B2 JPH049621 B2 JP H049621B2 JP 59128974 A JP59128974 A JP 59128974A JP 12897484 A JP12897484 A JP 12897484A JP H049621 B2 JPH049621 B2 JP H049621B2
Authority
JP
Japan
Prior art keywords
wire
aluminum alloy
thin
aluminum
producing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP59128974A
Other languages
English (en)
Japanese (ja)
Other versions
JPS619536A (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP59128974A priority Critical patent/JPS619536A/ja
Publication of JPS619536A publication Critical patent/JPS619536A/ja
Publication of JPH049621B2 publication Critical patent/JPH049621B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/01—Manufacture or treatment
    • H10W72/011—Apparatus therefor
    • H10W72/0115—Apparatus for manufacturing bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/01—Manufacture or treatment
    • H10W72/011—Apparatus therefor
    • H10W72/0116—Apparatus for manufacturing strap connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/01—Manufacture or treatment
    • H10W72/015—Manufacture or treatment of bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/531—Shapes of wire connectors
    • H10W72/536—Shapes of wire connectors the connected ends being ball-shaped
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/531—Shapes of wire connectors
    • H10W72/5363—Shapes of wire connectors the connected ends being wedge-shaped
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/551—Materials of bond wires
    • H10W72/552—Materials of bond wires comprising metals or metalloids, e.g. silver
    • H10W72/5524—Materials of bond wires comprising metals or metalloids, e.g. silver comprising aluminium [Al]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/851—Dispositions of multiple connectors or interconnections
    • H10W72/874—On different surfaces
    • H10W72/884—Die-attach connectors and bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/731—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors
    • H10W90/736—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors between a chip and a stacked lead frame, conducting package substrate or heat sink
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink

Landscapes

  • Continuous Casting (AREA)
  • Wire Bonding (AREA)
JP59128974A 1984-06-21 1984-06-21 ボンディングワイヤ用アルミ合金細線の製造方法 Granted JPS619536A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP59128974A JPS619536A (ja) 1984-06-21 1984-06-21 ボンディングワイヤ用アルミ合金細線の製造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP59128974A JPS619536A (ja) 1984-06-21 1984-06-21 ボンディングワイヤ用アルミ合金細線の製造方法

Publications (2)

Publication Number Publication Date
JPS619536A JPS619536A (ja) 1986-01-17
JPH049621B2 true JPH049621B2 (enExample) 1992-02-20

Family

ID=14998007

Family Applications (1)

Application Number Title Priority Date Filing Date
JP59128974A Granted JPS619536A (ja) 1984-06-21 1984-06-21 ボンディングワイヤ用アルミ合金細線の製造方法

Country Status (1)

Country Link
JP (1) JPS619536A (enExample)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61136654A (ja) * 1984-12-08 1986-06-24 Nippon Light Metal Co Ltd アルミニウム極細線の製造方法
JPH0654787B2 (ja) * 1985-06-24 1994-07-20 住友電気工業株式会社 ボンデイングワイヤ
JPS62228446A (ja) * 1985-11-29 1987-10-07 Nippon Mining Co Ltd 半導体配線材料用アルミニウム合金
JPS62235451A (ja) * 1986-04-03 1987-10-15 Nippon Mining Co Ltd 半導体配線材料用Ａｌ合金
JPS62235452A (ja) * 1986-04-03 1987-10-15 Nippon Mining Co Ltd 半導体配線材料用Ｂ含有Ａｌ合金
JPS62240733A (ja) * 1986-04-11 1987-10-21 Nippon Mining Co Ltd 半導体配線材料用ｂ含有アルミニウム合金
JPS63206198A (ja) * 1987-02-20 1988-08-25 Kubota Ltd エンジン発電機

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS49134546A (enExample) * 1973-04-30 1974-12-25
JPS6038228B2 (ja) * 1978-11-10 1985-08-30 逸雄 大中 金属細線の製造方法

Also Published As

Publication number Publication date
JPS619536A (ja) 1986-01-17

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