JPH048571Y2 - - Google Patents
Info
- Publication number
- JPH048571Y2 JPH048571Y2 JP1984043297U JP4329784U JPH048571Y2 JP H048571 Y2 JPH048571 Y2 JP H048571Y2 JP 1984043297 U JP1984043297 U JP 1984043297U JP 4329784 U JP4329784 U JP 4329784U JP H048571 Y2 JPH048571 Y2 JP H048571Y2
- Authority
- JP
- Japan
- Prior art keywords
- conductor
- wire
- coil
- winding
- insulation
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000004020 conductor Substances 0.000 claims description 29
- 238000009413 insulation Methods 0.000 claims description 23
- 238000004804 winding Methods 0.000 claims description 23
- 239000002131 composite material Substances 0.000 claims description 18
- 239000011248 coating agent Substances 0.000 claims description 2
- 238000000576 coating method Methods 0.000 claims description 2
- 239000010410 layer Substances 0.000 description 11
- 239000011229 interlayer Substances 0.000 description 6
- 239000000853 adhesive Substances 0.000 description 5
- 230000001070 adhesive effect Effects 0.000 description 5
- 230000000694 effects Effects 0.000 description 3
- 238000001035 drying Methods 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 239000011295 pitch Substances 0.000 description 1
- 229920000728 polyester Polymers 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 230000000452 restraining effect Effects 0.000 description 1
- 230000017105 transposition Effects 0.000 description 1
Landscapes
- Insulated Conductors (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4329784U JPS60156612U (ja) | 1984-03-28 | 1984-03-28 | 電機巻線用複合線 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4329784U JPS60156612U (ja) | 1984-03-28 | 1984-03-28 | 電機巻線用複合線 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS60156612U JPS60156612U (ja) | 1985-10-18 |
| JPH048571Y2 true JPH048571Y2 (US20070244113A1-20071018-C00087.png) | 1992-03-04 |
Family
ID=30554842
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP4329784U Granted JPS60156612U (ja) | 1984-03-28 | 1984-03-28 | 電機巻線用複合線 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS60156612U (US20070244113A1-20071018-C00087.png) |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS4919072A (US20070244113A1-20071018-C00087.png) * | 1972-06-10 | 1974-02-20 | ||
| JPS5836506B2 (ja) * | 1980-11-20 | 1983-08-09 | 富士通株式会社 | 半導体記憶装置 |
| JPS5926814B2 (ja) * | 1976-01-12 | 1984-06-30 | エヌ・テ−・エヌ東洋ペアリング株式会社 | ダンパ装置 |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5836506U (ja) * | 1981-09-02 | 1983-03-09 | 昭和電線電纜株式会社 | 集合エナメル線 |
| JPS5926814U (ja) * | 1982-08-10 | 1984-02-20 | 三菱電機株式会社 | 紙巻線 |
-
1984
- 1984-03-28 JP JP4329784U patent/JPS60156612U/ja active Granted
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS4919072A (US20070244113A1-20071018-C00087.png) * | 1972-06-10 | 1974-02-20 | ||
| JPS5926814B2 (ja) * | 1976-01-12 | 1984-06-30 | エヌ・テ−・エヌ東洋ペアリング株式会社 | ダンパ装置 |
| JPS5836506B2 (ja) * | 1980-11-20 | 1983-08-09 | 富士通株式会社 | 半導体記憶装置 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS60156612U (ja) | 1985-10-18 |
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