JPH048446U - - Google Patents
Info
- Publication number
- JPH048446U JPH048446U JP4757690U JP4757690U JPH048446U JP H048446 U JPH048446 U JP H048446U JP 4757690 U JP4757690 U JP 4757690U JP 4757690 U JP4757690 U JP 4757690U JP H048446 U JPH048446 U JP H048446U
- Authority
- JP
- Japan
- Prior art keywords
- lead
- island
- resin
- chip package
- relay
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000004065 semiconductor Substances 0.000 claims description 4
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
- H01L2224/491—Disposition
- H01L2224/4912—Layout
- H01L2224/49171—Fan-out arrangements
Landscapes
- Lead Frames For Integrated Circuits (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP4757690U JP2519651Y2 (ja) | 1990-05-07 | 1990-05-07 | 樹脂封止型マルチチップパッケージのリードフレーム |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP4757690U JP2519651Y2 (ja) | 1990-05-07 | 1990-05-07 | 樹脂封止型マルチチップパッケージのリードフレーム |
Publications (2)
Publication Number | Publication Date |
---|---|
JPH048446U true JPH048446U (US07714131-20100511-C00024.png) | 1992-01-27 |
JP2519651Y2 JP2519651Y2 (ja) | 1996-12-11 |
Family
ID=31563627
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP4757690U Expired - Lifetime JP2519651Y2 (ja) | 1990-05-07 | 1990-05-07 | 樹脂封止型マルチチップパッケージのリードフレーム |
Country Status (1)
Country | Link |
---|---|
JP (1) | JP2519651Y2 (US07714131-20100511-C00024.png) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2008147589A (ja) * | 2006-12-13 | 2008-06-26 | Toyota Motor Corp | 電子部品 |
JP2013058542A (ja) * | 2011-09-07 | 2013-03-28 | Dainippon Printing Co Ltd | リードフレームおよびその製造方法 |
WO2019203139A1 (ja) * | 2018-04-19 | 2019-10-24 | ローム株式会社 | 半導体装置 |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5010967A (US07714131-20100511-C00024.png) * | 1973-05-28 | 1975-02-04 | ||
JPH01308058A (ja) * | 1988-06-06 | 1989-12-12 | Hitachi Ltd | 電子装置 |
-
1990
- 1990-05-07 JP JP4757690U patent/JP2519651Y2/ja not_active Expired - Lifetime
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5010967A (US07714131-20100511-C00024.png) * | 1973-05-28 | 1975-02-04 | ||
JPH01308058A (ja) * | 1988-06-06 | 1989-12-12 | Hitachi Ltd | 電子装置 |
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2008147589A (ja) * | 2006-12-13 | 2008-06-26 | Toyota Motor Corp | 電子部品 |
JP2013058542A (ja) * | 2011-09-07 | 2013-03-28 | Dainippon Printing Co Ltd | リードフレームおよびその製造方法 |
WO2019203139A1 (ja) * | 2018-04-19 | 2019-10-24 | ローム株式会社 | 半導体装置 |
JPWO2019203139A1 (ja) * | 2018-04-19 | 2021-03-18 | ローム株式会社 | 半導体装置 |
US11227822B2 (en) | 2018-04-19 | 2022-01-18 | Rohm Co., Ltd. | Semiconductor device |
Also Published As
Publication number | Publication date |
---|---|
JP2519651Y2 (ja) | 1996-12-11 |
Similar Documents
Legal Events
Date | Code | Title | Description |
---|---|---|---|
EXPY | Cancellation because of completion of term |