JPH0482184B2 - - Google Patents
Info
- Publication number
- JPH0482184B2 JPH0482184B2 JP61273280A JP27328086A JPH0482184B2 JP H0482184 B2 JPH0482184 B2 JP H0482184B2 JP 61273280 A JP61273280 A JP 61273280A JP 27328086 A JP27328086 A JP 27328086A JP H0482184 B2 JPH0482184 B2 JP H0482184B2
- Authority
- JP
- Japan
- Prior art keywords
- chip
- substrate
- adhesive
- bonding
- bump
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 239000000758 substrate Substances 0.000 claims description 69
- 239000000853 adhesive Substances 0.000 claims description 24
- 230000001070 adhesive effect Effects 0.000 claims description 24
- 238000000034 method Methods 0.000 claims description 14
- 239000011248 coating agent Substances 0.000 claims description 3
- 238000000576 coating method Methods 0.000 claims description 3
- 230000001678 irradiating effect Effects 0.000 claims description 2
- 238000001514 detection method Methods 0.000 description 10
- 238000003825 pressing Methods 0.000 description 8
- 238000010586 diagram Methods 0.000 description 3
- 239000002313 adhesive film Substances 0.000 description 2
- 239000003795 chemical substances by application Substances 0.000 description 2
- 238000006073 displacement reaction Methods 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 238000010276 construction Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 238000005286 illumination Methods 0.000 description 1
- QSHDDOUJBYECFT-UHFFFAOYSA-N mercury Chemical compound [Hg] QSHDDOUJBYECFT-UHFFFAOYSA-N 0.000 description 1
- 229910052753 mercury Inorganic materials 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 239000013307 optical fiber Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/50—Tape automated bonding [TAB] connectors, i.e. film carriers; Manufacturing methods related thereto
Landscapes
- Wire Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP61273280A JPS63127541A (ja) | 1986-11-17 | 1986-11-17 | チップの接合方法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP61273280A JPS63127541A (ja) | 1986-11-17 | 1986-11-17 | チップの接合方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS63127541A JPS63127541A (ja) | 1988-05-31 |
| JPH0482184B2 true JPH0482184B2 (ko) | 1992-12-25 |
Family
ID=17525645
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP61273280A Granted JPS63127541A (ja) | 1986-11-17 | 1986-11-17 | チップの接合方法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS63127541A (ko) |
Families Citing this family (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE69009259T2 (de) * | 1989-02-02 | 1994-10-13 | Matsushita Electric Ind Co Ltd | Verfahren zum Zusammensetzen von Halbleiteranordnungen. |
| JPH02234447A (ja) * | 1989-03-07 | 1990-09-17 | Nec Corp | 半導体集積回路素子の接続方法 |
| US5766972A (en) * | 1994-06-02 | 1998-06-16 | Mitsubishi Denki Kabushiki Kaisha | Method of making resin encapsulated semiconductor device with bump electrodes |
| JP2005028202A (ja) * | 2003-07-07 | 2005-02-03 | Hitachi Industries Co Ltd | テーブル平行度調整装置とそれを用いたディスペンサ |
| JP4835530B2 (ja) * | 2007-07-25 | 2011-12-14 | パナソニック電工株式会社 | 床材 |
| JP2010034585A (ja) * | 2009-11-06 | 2010-02-12 | Toray Eng Co Ltd | チップ実装装置における平行度調整方法 |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS60262430A (ja) * | 1984-06-08 | 1985-12-25 | Matsushita Electric Ind Co Ltd | 半導体装置の製造方法 |
-
1986
- 1986-11-17 JP JP61273280A patent/JPS63127541A/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS63127541A (ja) | 1988-05-31 |
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