JPH0479134B2 - - Google Patents
Info
- Publication number
- JPH0479134B2 JPH0479134B2 JP60016633A JP1663385A JPH0479134B2 JP H0479134 B2 JPH0479134 B2 JP H0479134B2 JP 60016633 A JP60016633 A JP 60016633A JP 1663385 A JP1663385 A JP 1663385A JP H0479134 B2 JPH0479134 B2 JP H0479134B2
- Authority
- JP
- Japan
- Prior art keywords
- adhesive
- tip
- coating agent
- pin rod
- coating
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- H10W72/013—
-
- H10W72/0113—
-
- H10W72/30—
-
- H10W72/073—
-
- H10W72/07337—
Landscapes
- Die Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP60016633A JPS61177731A (ja) | 1985-02-01 | 1985-02-01 | 半導体装置用塗布剤供給治具 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP60016633A JPS61177731A (ja) | 1985-02-01 | 1985-02-01 | 半導体装置用塗布剤供給治具 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS61177731A JPS61177731A (ja) | 1986-08-09 |
| JPH0479134B2 true JPH0479134B2 (cg-RX-API-DMAC10.html) | 1992-12-15 |
Family
ID=11921762
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP60016633A Granted JPS61177731A (ja) | 1985-02-01 | 1985-02-01 | 半導体装置用塗布剤供給治具 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS61177731A (cg-RX-API-DMAC10.html) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| FR2672428B1 (fr) * | 1991-02-04 | 1993-05-28 | Schiltz Andre | Procede et dispositif d'insertion de puces dans des logements d'un substrat par tete d'encollage. |
| JP5494119B2 (ja) * | 2010-03-30 | 2014-05-14 | 富士通株式会社 | フラックスピン，フラックス転写装置及びフラックス転写方法 |
| JP7653011B2 (ja) | 2020-11-20 | 2025-03-28 | 日亜化学工業株式会社 | デバイスの製造方法、及び、発光装置 |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS58146570U (ja) * | 1982-03-29 | 1983-10-01 | 株式会社東芝 | 接着剤塗布装置 |
-
1985
- 1985-02-01 JP JP60016633A patent/JPS61177731A/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS61177731A (ja) | 1986-08-09 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| LAPS | Cancellation because of no payment of annual fees |