JPH0478171B2 - - Google Patents

Info

Publication number
JPH0478171B2
JPH0478171B2 JP59226692A JP22669284A JPH0478171B2 JP H0478171 B2 JPH0478171 B2 JP H0478171B2 JP 59226692 A JP59226692 A JP 59226692A JP 22669284 A JP22669284 A JP 22669284A JP H0478171 B2 JPH0478171 B2 JP H0478171B2
Authority
JP
Japan
Prior art keywords
aluminum
layer
semiconductor substrate
plate
silicon semiconductor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP59226692A
Other languages
English (en)
Japanese (ja)
Other versions
JPS61105849A (ja
Inventor
Hiroaki Sakamoto
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nihon Inter Electronics Corp
Original Assignee
Nihon Inter Electronics Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nihon Inter Electronics Corp filed Critical Nihon Inter Electronics Corp
Priority to JP59226692A priority Critical patent/JPS61105849A/ja
Publication of JPS61105849A publication Critical patent/JPS61105849A/ja
Publication of JPH0478171B2 publication Critical patent/JPH0478171B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H10W72/073—
    • H10W72/01325—
    • H10W72/01361—
    • H10W72/01365—
    • H10W72/07302—
    • H10W72/07336—
    • H10W72/347—
    • H10W72/352—
    • H10W72/381—
    • H10W72/944—
    • H10W90/736—

Landscapes

  • Wire Bonding (AREA)
  • Die Bonding (AREA)
JP59226692A 1984-10-30 1984-10-30 半導体装置の製造方法 Granted JPS61105849A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP59226692A JPS61105849A (ja) 1984-10-30 1984-10-30 半導体装置の製造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP59226692A JPS61105849A (ja) 1984-10-30 1984-10-30 半導体装置の製造方法

Publications (2)

Publication Number Publication Date
JPS61105849A JPS61105849A (ja) 1986-05-23
JPH0478171B2 true JPH0478171B2 (OSRAM) 1992-12-10

Family

ID=16849155

Family Applications (1)

Application Number Title Priority Date Filing Date
JP59226692A Granted JPS61105849A (ja) 1984-10-30 1984-10-30 半導体装置の製造方法

Country Status (1)

Country Link
JP (1) JPS61105849A (OSRAM)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5072312A (en) * 1988-03-15 1991-12-10 Siemens Aktiengesellschaft Thyristor with high positive and negative blocking capability

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5936822B2 (ja) * 1979-01-19 1984-09-06 三菱電機株式会社 圧接形半導体装置

Also Published As

Publication number Publication date
JPS61105849A (ja) 1986-05-23

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Legal Events

Date Code Title Description
EXPY Cancellation because of completion of term