JPH0474489A - Printed circuit board - Google Patents

Abstract

PURPOSE:To easily and rapidly confirm a silk printing deviation of a printed circuit board by forming a plurality of circularly conductive patterns of the same shape out of a product region, and adding silk ring marks having larger different sizes than those of the patterns concentrically with the patterns. CONSTITUTION:A copper foil is etched to form surface mounting pads 2, through hole lands 3, and circularly conductive patterns 1a-1d of the same size are simultaneously formed. They are silk-printed, and silk ring marks 10a-10d are formed concentrically on the peripheries of the patterns 1a-1d simultaneously with the sink 8. Gaps DELTAa-DELTAd between the patterns 1a-1d and the marks 10a-10d are set under the condition of DELTAa < DELTAb < DELTAc < DELTAd, thereby rapidly and accurately conforming the silk printing deviations.

Description

DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a printed wiring board, and particularly to a printed wiring board that requires highly accurate silk printing.

[Conventional technology]

In the conventional printed wiring board, as shown in Fig. 5, if the silk 8 is covered with the surface mounting pad 2 and the through-hole land 3 due to the misalignment of the silk printing, the appearance of the entire product area is checked to see if there is any misalignment of the silk printing. I was judging.

[Problem to be solved by the invention]

In the conventional printed wiring board described above, it is difficult to confirm the amount of silk printing deviation. In addition, because the gap between the pad/through-hole land and the silk differs depending on the mounted component, even with the same amount of silk printing deviation, there are areas where silk fogging occurs and areas where it does not occur, making it difficult to judge whether it is good or bad. .

An object of the present invention is to provide a printed wiring board in which the amount of deviation in silk printing can be confirmed and whether the board is good or bad can be easily determined.

[Means to solve the problem]

The present invention provides a printed wiring board that is subjected to solder resist printing and silk printing after forming a conductive pattern, by forming a plurality of circular conductive patterns of the same shape outside the product area, and forming a plurality of circular conductive patterns larger than the circular conductive patterns and having a size smaller than the circular conductive patterns. Different silk ring marks are attached concentrically to each of the circular conductive patterns to form a silk printing misalignment confirmation mark.

〔Example〕

Next, embodiments of the present invention will be described with reference to the drawings.

FIGS. 1(a) to 1(c) are plan views showing the order of steps for explaining the manufacturing method of the first embodiment of the present invention.

In the first embodiment, as shown in FIG. 1 (a), first, the surface mounting pad 2,
At the same time as through hole land 3 is formed, circular conductive patterns 1a to 1d of the same size are formed.

Next, as shown in FIG. 1(b), solder resist (hereinafter referred to as SR) is printed, and SR5 is applied to the surface mounting pads around each of the surface mounting pads 2 and through-hole lands 3. An SR area 6 and a non-SR area 7 of through hole land are formed. At this time, circular conduction pattern 1
No SR area is provided around a to 1d.

Next, as shown in Figure 1(c), silk printing is applied,
Simultaneously with the silk 8, silk ring marks 10a to 10d are formed concentrically around the circular conductive patterns 1a to 1d.

FIG. 2 is a partially enlarged plan view of the silk ring mark and circular conductive pattern shown in FIG. 1(C).

As shown in FIG. 2, the size relationship of each of the silk ring marks 10a to 10d formed by silk printing is larger than that of the circular conductive patterns 1a to 1d, and 1
Set in the order of 0a<10b<10c<10d. By setting in this way, the circular conductive patterns 1a to 1d
silk ring mark 10a corresponding to the outer diameter of
The inner diameter gap Δa~Δd of ~10d is Δa×Δb〈
ΔC<Δd.

FIG. 3 is a plan view of a silk ring mark and a circular conductive pattern, illustrating a method for checking the amount of deviation in silk printing.

As shown in FIG. 3, if the silk ring marks 10a to lod shift in the direction of the arrow during silk printing,
The silk ring mark 10c is in a state of circumscribing the circular conductive pattern IC, but the silk ring marks 10a, 1
It can be observed that 0b are overlapped by circular conductive patterns la and lb, respectively.

In this way, the gaps Δa~ between the circular conductive patterns 1a to 1d and the silk ring marks 10a to 10d, respectively.
By setting Δd as Δa x Δb x ΔC<Δd, it is possible to quickly and accurately check the amount of silk printing deviation.

FIGS. 4(a) and 4(b) are plan views showing the order of steps for explaining the manufacturing method of the second embodiment of the present invention.

In the second embodiment, first, as shown in FIG. 1(a), circular conductive patterns 1a to 1d are formed.

Next, by SR printing, non-SR areas 6 of surface mounting pads and non-SR areas 7 of through-hole lands are formed, and at the same time, non-SR areas 9a to 9d of circular conductive patterns are formed. The shape of the non-SR areas 9a to 9d of the circular conductive pattern is circular, and the size is the same as that of the circular conductive pattern 1a.
It is assumed that the size is greater than or equal to 1d, and 9a = 9b = 9c = 9d.

Next, as shown in Figure 4(b), silk printing is applied,
At the same time as silk 8 is formed, silk ring marks 10a to 10d are made to open and open non-SR areas 9a to 9d of the circular conductive pattern.
are formed in concentric circles. Silk ring mark 10a-1
The relationship in size of 0d is the same as in the first embodiment shown in FIG. 1(c).

In this way, the same effect as in the first embodiment can be obtained by forming silk ring marks concentrically around the non-SR area of the circular conduction pattern.

In this example, one block is made up of four circular conductive patterns, but the number of circular conductive patterns can be set arbitrarily.
By combining multiple pieces per board, it is possible to handle printed wiring boards that require high-precision silk printing.

〔Effect of the invention〕

As explained above, the present invention forms a plurality of circular conductive patterns of the same shape outside the product area, and creates silk ring marks that are larger than the circular conductive patterns and have different sizes in a circle concentric with each circular conductive pattern. By attaching the mark to the screen as a silk-printing deviation check mark, it is possible to easily and quickly check the amount of silk-printing deviation on a printed wiring board and judge whether it is good or bad.

2...Surface mounting pad, 3...Through hole land, 5...5R16...Non-SR of surface mounting pad
Area, 7... Non-SR area of through hole land,
8... Silk, 9a, 9b, 9c, 9d... Non-SR area of circular conduction pattern, 10a, 10b, 10C,
10d... Silk ring mark.

Claims (1)

[Claims] In a printed wiring board that is subjected to solder resist printing and silk printing after forming a conductive pattern, a plurality of circular conductive patterns of the same shape are formed outside the product area, and a silk ring that is larger than the circular conductive patterns and has a different size is used. A printed wiring board characterized in that a mark is provided in a concentric circle shape with each of the circular conductive patterns to serve as a silk-printing misalignment confirmation mark.