JPH1068696A - Method for inspecting accuracy of printing position of conductor pattern - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a method for inspecting the accuracy of the printing position of a conductor pattern characterized in that positional accuracy can be simply confirmed without performing measurement and quality control is easy and production efficiency is enhanced. SOLUTION: Reference holes 12 for inspecting positional accuracy are formed to a green sheet 2 at least at two predetermined places along with a guide hole 8 and a via-hole 6 by the same perforation process and ring-shaped marks 14 for inspecting positional accuracy are applied to the conductor pattern 10 at the predetermined positions corresponding to the forming places of the respective reference holes 12 and, at a time of the printing of the conductor pattern 10 formed by silver paste, the inspection marks 14 are also printed on the green sheet 12 at the same time to confirm the shift of printing positions on the basis of the axial shift of the marks 14 for inspecting positional accuracy and the reference holes 12. Since the shift of printing positions is shown as the eccentricity of the inspection marks 14 to the reference holes 12, the shift quantity is visiually and easily confirmed and a printing position can be easily confirmed with high accuracy without performing measurement.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

[0001] 1. Field of the Invention [0002] The present invention relates to a method for inspecting the printing position accuracy of a conductor pattern formed on a green sheet of a sheet laminated chip electronic component.

[0002]

2. Description of the Related Art In general, a sheet laminated chip electronic component manufactured by laminating a large number of dielectric sheets (green sheets) is known. This sheet laminated chip electronic component is formed by forming a plurality of conductor patterns of a predetermined shape on a green sheet of a predetermined size by screen printing or the like using a silver paste, and forming a plurality of types of green sheets having different conductor patterns. A predetermined number of sheets are sequentially laminated, cut at predetermined positions and separated into individual pieces.

If it is necessary to electrically connect the conductor patterns of the upper and lower sheets to be laminated, via holes are formed in the green sheet in advance at the predetermined positions of the conductor pattern printing portions so as to penetrate the front and back. At the time of printing, a silver paste is pressed into the via hole to be filled, and the conductor patterns of the upper and lower sheets are electrically connected to each other via the silver paste in the via hole.

In order to satisfy desired characteristics as an electronic component, the mutual positional relationship between the via hole and the conductor pattern needs to be determined with extremely high precision. However, when the conductor pattern is printed on the via hole, the via hole is printed. Cannot be directly measured and inspected because their positions are hidden. Therefore, conventionally, the positional accuracy is managed as described below.

That is, as shown in the drilling step of FIG. 3A, when a via hole 4 is punched and formed in a green sheet 2 by a press drilling machine, a transparent film 6 is stacked on the green sheet 2 and The green sheet 2 and the transparent film 6 are simultaneously drilled with the guide holes 8 and the via holes 4 sequentially. Here, the guide holes 8 are used for positioning and fixing the green sheets 2 on the table of the screen printing machine or for positioning when the green sheets 2 are laminated, and are formed at four corners.
Subsequent to the formation of the guide hole 8, the via hole 4 is formed.

Next, as shown in the printing step of FIG. 1B, the transparent film 6 is separated from the green sheet 2 and
The green sheet 2 is fixed to a table of a printing machine, and a silver paste is pattern-printed on the surface thereof to form a conductor pattern 10 on the green sheet 2.

Then, as shown in the inspection step of FIG. 1C, the transparent film 6 is again superimposed on the green sheet 2 with the guide hole 8 as a reference, and the via hole 4 formed in the transparent film 6 and the The dimensions x and y between the conductor pattern 10 and the edge portion of the conductor pattern 10 that can be seen through the transparent film 6 are measured to check the printing position of the conductor pattern 10 for deviation, and their relative positional relationship is within a specified positional tolerance. Check if it fits.

That is, the transparent film 6 is formed as a measuring gauge by superimposing the transparent film 6 on the green sheet 2 and simultaneously drilling the via hole 4, and is hidden by the printing of the conductor pattern 10. The position of the via hole 4 is pseudo-determined in the via hole 4 of the transparent film 6 previously formed as a measuring gauge, and the positional accuracy is managed.

[0009]

However, in the above-described conventional position accuracy control method, the transparent film 6 is superimposed again on the green sheet 2 after the conductor pattern 10 is printed, and the via holes formed in the transparent film 6 are formed. 4
If the dimension between the conductor pattern 10 and the edge portion of the conductor pattern 10 that can be seen through the transparent film 6 is not measured, the mutual deviation cannot be confirmed, and the dimension measurement work is complicated and time-consuming. In addition, in order to improve the yield of chip electronic components, it is necessary to inspect each green sheet to confirm the quality, and therefore, improvement has been required in terms of production efficiency.

[0010] The present invention has been made in view of such circumstances, and an object of the present invention is to easily confirm positional accuracy for each green sheet without measuring using a gauge such as a transparent film. It is an object of the present invention to provide a method for inspecting the print position accuracy of a conductor pattern, which can perform quality control easily and improve production efficiency.

[0011]

In order to achieve the above object, a method for inspecting a printed position of a conductor pattern according to the present invention comprises a via hole 4 formed in a green sheet 2 of a sheet-stacked chip electronic component; The green sheet 2
At the same step of pressing and forming the via holes 4 in the green sheet 2 in inspecting the positional deviation from the conductor pattern 10 printed thereon, at least a predetermined hole 12 for positional accuracy inspection is formed in the green sheet 2. Are formed in the conductor pattern 10 at positions corresponding to the positions where the respective reference holes 12 are formed.
2, a ring-shaped position accuracy verification mark 14 having an inner diameter larger than the permissible position tolerance of printing deviation is added to the green sheet 2, and printed on the green sheet 2.
And inspecting the printing position deviation of the conductor pattern by the deviation of the coaxiality with the position accuracy verification mark 14,
Since the deviation of the printing position appears as the eccentricity of the verification mark 14 with respect to the reference hole 12, the amount of the deviation is easy to visually recognize, and the printing position accuracy can be considerably improved only by visual inspection without strict measurement. And can be easily confirmed.

Preferably, the difference between the inner diameter of the position accuracy verification mark 14 and the diameter of the reference hole 12 is set equal to the maximum permissible position tolerance of the printing position deviation. If the reference hole 12 exists in the mark 14, the printing position accuracy falls within the allowable position tolerance. Therefore, it is only necessary to visually confirm that the reference hole 12 exists in the verification mark 14. Position accuracy can be checked with extremely simple work.

[0013]

Preferred embodiments of the present invention will be described below in detail with reference to the accompanying drawings. The same components as those in the related art are denoted by the same reference numerals, and detailed description thereof is omitted.

FIG. 1 is a view showing one embodiment of a method for inspecting the printing position accuracy of a conductor pattern according to the present invention. As shown in the drilling step of FIG. 3A, the reference hole 12 for position accuracy inspection is formed at least at two predetermined positions in the green sheet 2 together with the guide hole 8 and the via hole 4 in the same drilling step. Here, in this illustrated example, four reference holes 12 are formed at four corners of the green sheet 2 so as to be located inside the guide holes 8, the guide holes 8 have a diameter of 5 mm, and the via holes 4 and the reference holes 12 are formed. Has a diameter of 1 mm.

On the other hand, as shown in the printing process of FIG. 1B, a ring-shaped positional accuracy verification mark 14 is newly formed on the conductor pattern 10 at a predetermined position corresponding to each of the above-mentioned reference holes 12. Are added, and when the conductor pattern 10 is printed with the silver paste, the verification mark 1 is used.
4 is also printed on the green sheet 2 at the same time. Here, the inner diameter of the position accuracy verification mark 14 is set to be at least larger than the diameter of the reference hole 12 by at least the maximum allowable dimensional tolerance of the printing deviation.

The deviation of the printing position is confirmed by the deviation of the coaxiality between the position accuracy verification mark 14 and the reference hole 12. In other words, the deviation of the printing position appears as the eccentricity of the verification mark 14 with respect to the reference hole 12, so that the deviation amount can be easily visually recognized, and the printing position can be confirmed with considerably high accuracy and without measurement. In particular, if the difference between the inner diameter of the position accuracy verification mark 14 and the diameter of the reference hole 12 is set to be equal to the maximum permissible position tolerance of the printing position deviation, the printing is performed if the reference hole 12 exists in the verification mark 14. Since the position accuracy falls within the allowable position tolerance, the quality of the position accuracy can be reliably confirmed by an extremely simple operation of merely confirming that the reference hole 12 exists in the verification mark 14. .

FIG. 2 is a flowchart showing the above-mentioned work procedure more specifically. As shown in the figure, first, a square green sheet 2 as a work is placed on an XY table of a press drilling machine (s10), fixed at a predetermined position with a stainless steel frame (s20), and then at four corners thereof. A positioning guide hole 8 having a diameter of 5 mm is punched out at a predetermined position (s30).

Next, four reference holes 12 for position accuracy inspection are formed at a predetermined position inside each of the guide holes 8 to have a diameter of 1 mm (s40), and then a large number of via holes 4 are also formed at a predetermined diameter of 1 mm. The green sheet 2 is removed from the XY table by punching and forming at a location (s60).

Then, the green sheet 2 on which the drilling process has been completed is transferred onto an XY table of a screen printing machine, and a guide hole 8 is inserted into a guide pin of a positioning jig fixed on the table and locked. (S70),
Test printing is performed (s80).

Next, the positional deviation of the printing position is inspected from the coaxiality between the printed verification mark 14 and the reference hole 12 (s90).
Corrected by adjusting the Y table (s100, s11
0), test printing is performed again (s80), and this initial setting loop operation (s80 to s11) is performed until there is no misalignment.
Repeat 0). Then, when the positional deviation has disappeared, mass production printing is started (s120), and the positional deviation of the printed mass-produced green sheet 2 is checked for the verification mark 1 in the same manner as described above.
Inspection is performed based on the coaxiality between the reference hole 12 and the reference hole 12. In this case, when the reference hole 12 is not included in the verification mark 14, it is excluded as a defective product (s130).

Therefore, in the method for inspecting the printing position accuracy of a conductor pattern according to the present invention, which is performed as described above, the displacement of the printing position is determined by using the ring-shaped position accuracy verification mark 14 and the position accuracy inspection reference hole 12. Since the inspection is performed with the coaxiality of the inspection mark, the positional deviation is checked by using the verification mark 14 and the reference hole 12.
It is possible to easily confirm the accuracy of the accuracy without directly visually observing the eccentricity and measuring the dimensions, and also to adjust the initial setting of the printing position with high accuracy.

Therefore, not only the adjustment of the initial setting of the printing position can be easily performed, but also the printing position accuracy of the mass-produced green sheets 2 can be easily confirmed individually, and the quality can be easily checked. Management can be performed easily and reliably. Therefore, even when manufacturing the sheet laminated chip electronic component, it is possible to prevent the defective green sheet 2 from being mixed as much as possible, and to improve the yield of the sheet laminated chip electronic component. As a result, the production efficiency can be improved as much as possible in conjunction with the simplification of printing position accuracy management.

[0023]

As described above in detail, according to the method for inspecting the printing position accuracy of a conductor pattern according to the present invention, the displacement of the printing position is determined by using a ring-shaped position accuracy verification mark and a position accuracy inspection reference hole. Inspection is performed with the coaxiality of the reference mark, so that the positional deviation appearing as eccentricity between the verification mark and the reference hole can be visually grasped and the accuracy can be easily checked without measuring the dimension. As a result, not only can the initial setting of the printing position be easily adjusted, but also the printing position accuracy can be easily checked individually for mass-produced green sheets, and quality control can be easily performed. Moreover, it can be performed reliably.

Therefore, even when manufacturing a sheet-stacked chip electronic component, it is possible to prevent as much as possible a defective green sheet from being mixed in, and to improve the yield of the sheet-stacked chip electronic component. I can plan,
The production efficiency can be improved as much as possible in conjunction with the simplification of the printing position accuracy management.

[Brief description of the drawings]

FIG. 1 is a view showing one embodiment of a method for inspecting a printing position accuracy of a conductor pattern according to the present invention.

FIG. 2 is a flowchart showing a work procedure of a printing position accuracy inspection method of a conductor pattern according to the present invention.

FIG. 3 is a diagram illustrating a conventional method for inspecting the printing position accuracy of a conductor pattern.

Claims (2)

[Claims] 1. A printed pattern accuracy inspection of a conductor pattern for inspecting a positional deviation between a via hole 4 formed in a green sheet 2 of a sheet laminated chip electronic component and a conductor pattern 10 printed on the green sheet 2. In the same step of press-punching and forming the via holes 4 in the green sheet 2, at least two predetermined reference holes 12 for position accuracy inspection are formed in the green sheet 2, and A ring-shaped position accuracy verification mark 14 having a larger inner diameter than the diameter of the reference hole 12 is added to a position corresponding to the formation position of each of the reference holes 12. The printed position is printed on the green sheet 2 and the printing position deviation of the conductor pattern is detected by the deviation of the coaxiality between the reference hole 12 and the position accuracy verification mark 14. Inspecting the printed position accuracy of the conductor pattern. 2. The conductor according to claim 1, wherein a difference between an inner diameter of the position accuracy verification mark and a diameter of the reference hole is set to be equal to a maximum allowable position tolerance of a printing position shift. Inspection method for pattern printing position accuracy.