JPH0474460U - - Google Patents

Info

Publication number
JPH0474460U
JPH0474460U JP11813490U JP11813490U JPH0474460U JP H0474460 U JPH0474460 U JP H0474460U JP 11813490 U JP11813490 U JP 11813490U JP 11813490 U JP11813490 U JP 11813490U JP H0474460 U JPH0474460 U JP H0474460U
Authority
JP
Japan
Prior art keywords
lead
pellet
island
bonding
bent portion
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP11813490U
Other languages
English (en)
Other versions
JP2518247Y2 (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1990118134U priority Critical patent/JP2518247Y2/ja
Publication of JPH0474460U publication Critical patent/JPH0474460U/ja
Application granted granted Critical
Publication of JP2518247Y2 publication Critical patent/JP2518247Y2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/484—Connecting portions
    • H01L2224/48463—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond
    • H01L2224/48465—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond the other connecting portion not on the bonding area being a wedge bond, i.e. ball-to-wedge, regular stitch

Landscapes

  • Lead Frames For Integrated Circuits (AREA)

Description

【図面の簡単な説明】
第１図は、本考案の第一の実施例を示すリード
フレームの主要部の斜視図、第２図ａ，ｂはそれ
ぞれ第１図に示すリードフレーム主要部の平面図
およびペレツトをマウントしボンデイング接続し
た状態の主要部平面図、第３図は第２図ｂに示す
Ａ−Ａ線断面図、第４図は本考案の第二の実施例
を示すリードフレーム主要部の斜視図、第５図は
本考案の第三の実施例を示すリードフレーム主要
部の斜視図である。 １……リード片、２……ペレツトアイランド、
３……切り欠き部、４，４Ａ，４Ｂ……ボンデイ
ンググリード部、５，５Ａ……折り曲げ部、６…
…ペレツト、７……電極パツド、７……ボンデイ
ングワイヤ、９……樹脂封止材。

Claims (1)

  1. 【実用新案登録請求の範囲】 １ 半導体ペレツトを搭載するペレツトアイラン
    ドと、ボンデイングリード部を端部に形成したフ
    レームの基準面になるリード片と、前記ペレツト
    アイランドを前記リード片に対し段差を設け且つ
    前記ペレツトアイランドを支持する折り曲げ部と
    を有し、前記折り曲げ部および前記ボンデイング
    リード部間に切り欠き部を形成したことを特徴と
    するリードフレーム。 ２ リード片の端部に形成したボンデイングリー
    ド部および折り曲げ部と、前記折り曲げ部に結合
    され且つ前記リード片よりも下に段差をもつて形
    成されるペレツトアイランドとを有し、前記ボン
    デイングリード部および前記折り曲げ部間に切り
    欠き部を形成することを特徴とするリードフレー
    ム。
JP1990118134U 1990-11-09 1990-11-09 リードフレーム Expired - Lifetime JP2518247Y2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1990118134U JP2518247Y2 (ja) 1990-11-09 1990-11-09 リードフレーム

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1990118134U JP2518247Y2 (ja) 1990-11-09 1990-11-09 リードフレーム

Publications (2)

Publication Number Publication Date
JPH0474460U true JPH0474460U (ja) 1992-06-30
JP2518247Y2 JP2518247Y2 (ja) 1996-11-27

Family

ID=31866043

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1990118134U Expired - Lifetime JP2518247Y2 (ja) 1990-11-09 1990-11-09 リードフレーム

Country Status (1)

Country Link
JP (1) JP2518247Y2 (ja)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2012195502A (ja) * 2011-03-17 2012-10-11 Yazaki Corp モジュールの端子構造
CN111916420A (zh) * 2019-05-08 2020-11-10 三菱电机株式会社 半导体装置及其制造方法

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5460563A (en) * 1977-10-21 1979-05-16 Mitsubishi Electric Corp Lead frame for semiconductor device

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5460563A (en) * 1977-10-21 1979-05-16 Mitsubishi Electric Corp Lead frame for semiconductor device

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2012195502A (ja) * 2011-03-17 2012-10-11 Yazaki Corp モジュールの端子構造
CN111916420A (zh) * 2019-05-08 2020-11-10 三菱电机株式会社 半导体装置及其制造方法

Also Published As

Publication number Publication date
JP2518247Y2 (ja) 1996-11-27

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