JPH0474442U - - Google Patents

Info

Publication number
JPH0474442U
JPH0474442U JP11813390U JP11813390U JPH0474442U JP H0474442 U JPH0474442 U JP H0474442U JP 11813390 U JP11813390 U JP 11813390U JP 11813390 U JP11813390 U JP 11813390U JP H0474442 U JPH0474442 U JP H0474442U
Authority
JP
Japan
Prior art keywords
image sensor
integrated circuit
circuit device
semiconductor element
glass cap
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP11813390U
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP11813390U priority Critical patent/JPH0474442U/ja
Publication of JPH0474442U publication Critical patent/JPH0474442U/ja
Pending legal-status Critical Current

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  • Solid State Image Pick-Up Elements (AREA)

Description

【図面の簡単な説明】[Brief explanation of the drawing]

第1図は本考案の一実施例の縦断面図、第2図
は第1図のガラスキヤツプ1の概略斜視図、第3
図は従来のキヤツプを使用したイメージセンサー
半導体集積回路装置の縦断面図である。 1……ガラスキヤツプ、2……キヤツプ端部凸
部、3……半導体素子、4……パツケージ、5…
…外部リード、6……ワイヤ。
FIG. 1 is a longitudinal sectional view of an embodiment of the present invention, FIG. 2 is a schematic perspective view of the glass cap 1 shown in FIG. 1, and FIG.
The figure is a longitudinal sectional view of an image sensor semiconductor integrated circuit device using a conventional cap. DESCRIPTION OF SYMBOLS 1...Glass cap, 2...Cap end protrusion, 3...Semiconductor element, 4...Package, 5...
...External lead, 6...Wire.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 表面端部に複数個の凸部を有するガラスキヤツ
プをイメージセンサ用半導体素子を内臓したパツ
ケージ表面に実装したことを特徴とするイメージ
センサー集積回路装置。
An image sensor integrated circuit device characterized in that a glass cap having a plurality of convex portions at the edge of the surface is mounted on the surface of a package containing a semiconductor element for an image sensor.
JP11813390U 1990-11-09 1990-11-09 Pending JPH0474442U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP11813390U JPH0474442U (en) 1990-11-09 1990-11-09

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP11813390U JPH0474442U (en) 1990-11-09 1990-11-09

Publications (1)

Publication Number Publication Date
JPH0474442U true JPH0474442U (en) 1992-06-30

Family

ID=31866042

Family Applications (1)

Application Number Title Priority Date Filing Date
JP11813390U Pending JPH0474442U (en) 1990-11-09 1990-11-09

Country Status (1)

Country Link
JP (1) JPH0474442U (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2020004769A (en) * 2018-06-25 2020-01-09 日本電気硝子株式会社 Airtight package and manufacturing method thereof

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2020004769A (en) * 2018-06-25 2020-01-09 日本電気硝子株式会社 Airtight package and manufacturing method thereof

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