JPH0474441U - - Google Patents
Info
- Publication number
- JPH0474441U JPH0474441U JP1990116823U JP11682390U JPH0474441U JP H0474441 U JPH0474441 U JP H0474441U JP 1990116823 U JP1990116823 U JP 1990116823U JP 11682390 U JP11682390 U JP 11682390U JP H0474441 U JPH0474441 U JP H0474441U
- Authority
- JP
- Japan
- Prior art keywords
- insulating substrate
- semiconductor chip
- semiconductor device
- cap
- insulating
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims description 7
- 239000000758 substrate Substances 0.000 claims description 4
- 239000011521 glass Substances 0.000 claims description 2
- 230000008018 melting Effects 0.000 claims description 2
- 238000002844 melting Methods 0.000 claims description 2
- 239000002184 metal Substances 0.000 claims 1
- 230000002093 peripheral effect Effects 0.000 claims 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/161—Cap
- H01L2924/1615—Shape
- H01L2924/16152—Cap comprising a cavity for hosting the device, e.g. U-shaped cap
Landscapes
- Lead Frames For Integrated Circuits (AREA)
Description
第１図は本考案の一実施例を示す断面図、第２
図は従来の半導体装置の一例を示す断面図である
。 １……絶縁基板、２……半導体チツプ、３……
キヤツプ、３ａ……面取部、４……低融点ガラス
、５……Ａｕ線、６……メタライズ層、７……リ
ード。
図は従来の半導体装置の一例を示す断面図である
。 １……絶縁基板、２……半導体チツプ、３……
キヤツプ、３ａ……面取部、４……低融点ガラス
、５……Ａｕ線、６……メタライズ層、７……リ
ード。
Claims (1)
- 半導体チツプを搭載した絶縁基板と、前記半導
体チツプと前記絶縁基板上に設けたメタライズ層
との間を電気的に接続する金属線と、前記絶縁基
板上に低融点ガラスを用いて接合し半導体チツプ
を含む内部に中空キヤビテイを形成する絶縁性キ
ヤツプとを有する半導体装置において、前記キヤ
ツプの内側周縁部に設けた面取り部を備えたこと
を特徴とする半導体装置。
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1990116823U JPH0474441U (ja) | 1990-11-07 | 1990-11-07 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1990116823U JPH0474441U (ja) | 1990-11-07 | 1990-11-07 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0474441U true JPH0474441U (ja) | 1992-06-30 |
Family
ID=31864665
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1990116823U Pending JPH0474441U (ja) | 1990-11-07 | 1990-11-07 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0474441U (ja) |
-
1990
- 1990-11-07 JP JP1990116823U patent/JPH0474441U/ja active Pending