JPH0474428U - - Google Patents
Info
- Publication number
- JPH0474428U JPH0474428U JP11791790U JP11791790U JPH0474428U JP H0474428 U JPH0474428 U JP H0474428U JP 11791790 U JP11791790 U JP 11791790U JP 11791790 U JP11791790 U JP 11791790U JP H0474428 U JPH0474428 U JP H0474428U
- Authority
- JP
- Japan
- Prior art keywords
- insulating substrate
- matching capacitor
- transistor chip
- metal wires
- semiconductor device
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000003990 capacitor Substances 0.000 claims description 5
- 239000004065 semiconductor Substances 0.000 claims description 4
- 239000002184 metal Substances 0.000 claims 3
- 239000000758 substrate Substances 0.000 claims 3
- 239000004020 conductor Substances 0.000 claims 1
- 238000010586 diagram Methods 0.000 description 1
Landscapes
- Bipolar Transistors (AREA)
Description
第１図はこの考案の一実施例である半導体装置
のトランジスタ搭載部を示す平面図、第２図は従
来の場合を示した半導体装置の平面図、第３図は
第１図および第２図の等価回路の回路図である。
図において、１はトランジスタチツプ、２は整
合用キヤパシタ、２１，２２は整合用キヤパシタ
電極、３１〜３３は接続ワイヤ、４１〜４３はメ
タライズパターン、５はベース電極、６はエミツ
タ電極を示す。なお、図中、同一符号は同一、ま
たは相当部分を示す。
FIG. 1 is a plan view showing a transistor mounting part of a semiconductor device that is an embodiment of this invention, FIG. 2 is a plan view of a conventional semiconductor device, and FIG. It is a circuit diagram of the equivalent circuit of. In the figure, 1 is a transistor chip, 2 is a matching capacitor, 21 and 22 are matching capacitor electrodes, 31 to 33 are connection wires, 41 to 43 are metallized patterns, 5 is a base electrode, and 6 is an emitter electrode. In addition, in the figures, the same reference numerals indicate the same or equivalent parts.
Claims (1)
装置において、トランジスタチツプと整合用キヤ
パシタと絶縁基板上導体パターンとの金属ワイヤ
による接続に、信号入力側の整合用キヤパシタと
絶縁基板上とを接続する金属ワイヤ数を、トラン
ジスタチツプと整合用キヤパシタとを接続する金
属ワイヤ数よりも多くしたことを特徴とする半導
体装置。 In a semiconductor integrated circuit device in which a circuit is formed on an insulating substrate, the matching capacitor on the signal input side and the insulating substrate are connected to the metal wire connection between the transistor chip, the matching capacitor, and the conductor pattern on the insulating substrate. A semiconductor device characterized in that the number of metal wires is greater than the number of metal wires connecting a transistor chip and a matching capacitor.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11791790U JPH0474428U (en) | 1990-11-07 | 1990-11-07 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11791790U JPH0474428U (en) | 1990-11-07 | 1990-11-07 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0474428U true JPH0474428U (en) | 1992-06-30 |
Family
ID=31865815
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP11791790U Pending JPH0474428U (en) | 1990-11-07 | 1990-11-07 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0474428U (en) |
-
1990
- 1990-11-07 JP JP11791790U patent/JPH0474428U/ja active Pending
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