JPH0473871A - セラミック基板の端子構造 - Google Patents

セラミック基板の端子構造

Info

Publication number
JPH0473871A
JPH0473871A JP2210880A JP21088090A JPH0473871A JP H0473871 A JPH0473871 A JP H0473871A JP 2210880 A JP2210880 A JP 2210880A JP 21088090 A JP21088090 A JP 21088090A JP H0473871 A JPH0473871 A JP H0473871A
Authority
JP
Japan
Prior art keywords
electrode layer
ceramic substrate
lead wire
terminal structure
noble metal
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2210880A
Other languages
English (en)
Japanese (ja)
Other versions
JPH059908B2 (oth
Inventor
Akio Takami
高見　昭雄
Toshitaka Matsuura
松浦　利孝
Teppei Okawa
哲平 大川
Keizo Furusaki
圭三 古崎
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Niterra Co Ltd
Original Assignee
NGK Spark Plug Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NGK Spark Plug Co Ltd filed Critical NGK Spark Plug Co Ltd
Priority to JP2210880A priority Critical patent/JPH0473871A/ja
Publication of JPH0473871A publication Critical patent/JPH0473871A/ja
Publication of JPH059908B2 publication Critical patent/JPH059908B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0306—Inorganic insulating substrates, e.g. ceramic, glass

Landscapes

  • Multi-Conductor Connections (AREA)
  • Connections Effected By Soldering, Adhesion, Or Permanent Deformation (AREA)
JP2210880A 1990-08-08 1990-08-08 セラミック基板の端子構造 Granted JPH0473871A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2210880A JPH0473871A (ja) 1990-08-08 1990-08-08 セラミック基板の端子構造

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2210880A JPH0473871A (ja) 1990-08-08 1990-08-08 セラミック基板の端子構造

Related Parent Applications (1)

Application Number Title Priority Date Filing Date
JP58228921A Division JPS60120593A (ja) 1983-12-02 1983-12-02 セラミック基板の端子構造

Publications (2)

Publication Number Publication Date
JPH0473871A true JPH0473871A (ja) 1992-03-09
JPH059908B2 JPH059908B2 (oth) 1993-02-08

Family

ID=16596625

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2210880A Granted JPH0473871A (ja) 1990-08-08 1990-08-08 セラミック基板の端子構造

Country Status (1)

Country Link
JP (1) JPH0473871A (oth)

Also Published As

Publication number Publication date
JPH059908B2 (oth) 1993-02-08

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