JPH0473319B2 - - Google Patents
Info
- Publication number
- JPH0473319B2 JPH0473319B2 JP58018817A JP1881783A JPH0473319B2 JP H0473319 B2 JPH0473319 B2 JP H0473319B2 JP 58018817 A JP58018817 A JP 58018817A JP 1881783 A JP1881783 A JP 1881783A JP H0473319 B2 JPH0473319 B2 JP H0473319B2
- Authority
- JP
- Japan
- Prior art keywords
- pads
- electroplating
- electronic circuit
- leads
- plating
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Landscapes
- Production Of Multi-Layered Print Wiring Board (AREA)
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
- Manufacturing Of Printed Wiring (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP58018817A JPS59145591A (ja) | 1983-02-09 | 1983-02-09 | 電子回路用基板の電気メッキ方法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP58018817A JPS59145591A (ja) | 1983-02-09 | 1983-02-09 | 電子回路用基板の電気メッキ方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS59145591A JPS59145591A (ja) | 1984-08-21 |
| JPH0473319B2 true JPH0473319B2 (enExample) | 1992-11-20 |
Family
ID=11982122
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP58018817A Granted JPS59145591A (ja) | 1983-02-09 | 1983-02-09 | 電子回路用基板の電気メッキ方法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS59145591A (enExample) |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6024190B2 (ja) * | 1980-05-28 | 1985-06-11 | 株式会社日立製作所 | 部分めっき治具 |
-
1983
- 1983-02-09 JP JP58018817A patent/JPS59145591A/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS59145591A (ja) | 1984-08-21 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| KR100326347B1 (ko) | Ni-b도금층을가진c4기판접점패드 | |
| US5069626A (en) | Plated plastic castellated interconnect for electrical components | |
| US4700276A (en) | Ultra high density pad array chip carrier | |
| US5314606A (en) | Leadless ceramic package with improved solderabilty | |
| JP3060896B2 (ja) | バンプ電極の構造 | |
| JPH02100392A (ja) | 回路板と半田付けの方法 | |
| JPH01235170A (ja) | マイクロ入出力ピンおよびその製造方法 | |
| US6609915B2 (en) | Interconnect for electrically connecting a multichip module to a circuit substrate and processes for making and using same | |
| KR100260276B1 (ko) | 수직 리드 온칩 패키지 | |
| JP2629908B2 (ja) | 多層配線基板の給電構造 | |
| US6897378B2 (en) | Technique for surface mounting electrical components to a circuit board | |
| US6376054B1 (en) | Surface metallization structure for multiple chip test and burn-in | |
| JPH0696815A (ja) | コネクタ | |
| JP3582111B2 (ja) | プリント配線板の製造方法 | |
| JPH06101492B2 (ja) | 半導体装置及びその製造方法 | |
| JPH0818188A (ja) | コネクタレスプリント基板接続機構 | |
| JPS58221667A (ja) | チツプ部品の半田付方法 | |
| JP2942401B2 (ja) | メッキ用治具 | |
| JPS60218900A (ja) | 印刷配線板 | |
| JPS634690A (ja) | 厚膜混成集積回路基板 | |
| JP2616571B2 (ja) | 半導体装置の製造方法 | |
| JPS59145591A (ja) | 電子回路用基板の電気メッキ方法 | |
| JPH04243187A (ja) | プリント基板 | |
| JPH1041356A (ja) | 半導体装置用テープキャリア | |
| JP3053935B2 (ja) | 半導体装置及びその製造方法 |