JPH0472646U - - Google Patents
Info
- Publication number
- JPH0472646U JPH0472646U JP11484690U JP11484690U JPH0472646U JP H0472646 U JPH0472646 U JP H0472646U JP 11484690 U JP11484690 U JP 11484690U JP 11484690 U JP11484690 U JP 11484690U JP H0472646 U JPH0472646 U JP H0472646U
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor device
- terminal
- connection conductor
- internal connection
- external lead
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims description 7
- 239000004020 conductor Substances 0.000 claims description 4
- 239000000463 material Substances 0.000 claims 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical group [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims 1
- 229910052802 copper Inorganic materials 0.000 claims 1
- 239000010949 copper Substances 0.000 claims 1
- 238000010586 diagram Methods 0.000 description 3
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/484—Connecting portions
- H01L2224/4847—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a wedge bond
- H01L2224/48472—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a wedge bond the other connecting portion not on the bonding area also being a wedge bond, i.e. wedge-to-wedge
Description
第１図は本考案実施例の構成図、第２図は第１
図の部分斜視図、第３図は本考案の実施対象とな
る半導体装置の従来構成図、第４図は第３図にお
ける内部構造の斜視図である。
１……半導体素子、２……配線基板、５……端
子取付ブロツク、６……外部導出端子、６１……
外部接続端子金具、６２……内部接続導体。
Figure 1 is a configuration diagram of an embodiment of the present invention, and Figure 2 is a diagram of the first embodiment.
FIG. 3 is a conventional configuration diagram of a semiconductor device to which the present invention is applied, and FIG. 4 is a perspective view of the internal structure in FIG. 3. 1... Semiconductor element, 2... Wiring board, 5... Terminal mounting block, 6... External lead-out terminal, 61...
External connection terminal fitting, 62...Internal connection conductor.
Claims (1)
端子であつて、ケースの端子取付ブロツクに装着
した外部接続端子金具と、一端を前記端子金具に
、他端を半導体素子をマウントした配線基板の回
路パターンに接合してパツケージ内に引回し配線
した棒材の内部接続導体とで構成したことを特徴
とする半導体装置の外部導出端子。 ２ 請求項１に記載の外部導出端子において、内
部接続導体が銅系棒材であり、かつ外部接続端子
金具との間を溶接接合したことを特徴とする半導
体装置の外部導出端子。 ３ 請求項１に記載の外部導出端子において、内
部接続導体がその途中箇所を蛇行状に屈曲して配
線されていることを特徴とする半導体装置の外部
導出端子。[Claims for Utility Model Registration] 1. An external connection terminal fitting of a packaged semiconductor device that is attached to a terminal mounting block of a case, one end of which is connected to the terminal fitting, and the other end of which is attached to a semiconductor element. 1. An external lead-out terminal for a semiconductor device, comprising an internal connection conductor made of a bar material connected to a circuit pattern of a mounted wiring board and routed and wired within a package cage. 2. The external lead-out terminal for a semiconductor device according to claim 1, wherein the internal connection conductor is a copper bar material and is welded to the external connection terminal fitting. 3. The external lead-out terminal of a semiconductor device according to claim 1, wherein the internal connection conductor is wired in a meandering manner at a midpoint thereof.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11484690U JPH0472646U (en) | 1990-11-01 | 1990-11-01 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11484690U JPH0472646U (en) | 1990-11-01 | 1990-11-01 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0472646U true JPH0472646U (en) | 1992-06-26 |
Family
ID=31862566
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP11484690U Pending JPH0472646U (en) | 1990-11-01 | 1990-11-01 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0472646U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2007266608A (en) * | 2006-03-29 | 2007-10-11 | Infineon Technologies Ag | Semiconductor module |
-
1990
- 1990-11-01 JP JP11484690U patent/JPH0472646U/ja active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2007266608A (en) * | 2006-03-29 | 2007-10-11 | Infineon Technologies Ag | Semiconductor module |