JPS6351495U - - Google Patents
Info
- Publication number
- JPS6351495U JPS6351495U JP14526886U JP14526886U JPS6351495U JP S6351495 U JPS6351495 U JP S6351495U JP 14526886 U JP14526886 U JP 14526886U JP 14526886 U JP14526886 U JP 14526886U JP S6351495 U JPS6351495 U JP S6351495U
- Authority
- JP
- Japan
- Prior art keywords
- wiring board
- printed wiring
- heat dissipation
- dissipation fin
- solid
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 230000017525 heat dissipation Effects 0.000 claims description 4
- 238000005266 casting Methods 0.000 claims description 2
- 239000000463 material Substances 0.000 claims description 2
- 239000004065 semiconductor Substances 0.000 claims description 2
- 239000006096 absorbing agent Substances 0.000 description 1
Landscapes
- Non-Metallic Protective Coatings For Printed Circuits (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
Description
第１図はこの考案によるソリツドステート・コ
ンタクタの要部における一実施例を示す断面図、
第２図Ａ，Ｂ，Ｃは第１図に要部を示したソリツ
ドステート・コンタクタの構成要素及びその組立
状態を示す分解斜視図、第３図Ａ，Ｂ，Ｃはこの
考案に先立つて検討されたソリツドステート・コ
ンタクタの構成要素及びその組立状態を示す分解
斜視図である。
図において、１は半導体スイツチング素子、６
は電子部品、８は表示灯、１６はケース、１７は
フタ、２１，２２，２３は端子リード、２４，２
５は第１のプリント配線基板、２４ａは第１のプ
リント配線基板２４の穴、２４ｂは第１のプリン
ト配線基板２４から一体に延設された支持板、２
５は第２のプリント配線基板、２６は開閉制御信
号入力用の端子、２６ａは端子２６のリード部に
形成された突起、１３はサージ吸収器、２７は放
熱フイン、２７ｄは放熱フイン２７に形成された
壁、２７ｅはその壁２７ｄに囲まれたくぼみ、２
８は取付け板、２９は絶縁板、３０は注型材であ
る。なお、図中、同一符号は同一、又は相当部分
を示す。
FIG. 1 is a sectional view showing an embodiment of the main part of the solid-state contactor according to this invention;
Figures 2A, B, and C are exploded perspective views showing the components of the solid-state contactor shown in Figure 1 and their assembled states, and Figures 3A, B, and C are exploded perspective views of the solid-state contactor whose main parts were shown in Figure 1. FIG. 2 is an exploded perspective view showing the components of the solid-state contactor and their assembled state. In the figure, 1 is a semiconductor switching element, 6
are electronic components, 8 is an indicator light, 16 is a case, 17 is a lid, 21, 22, 23 are terminal leads, 24, 2
5 is a first printed wiring board; 24a is a hole in the first printed wiring board 24; 24b is a support plate integrally extended from the first printed wiring board 24;
5 is a second printed wiring board, 26 is a terminal for inputting an opening/closing control signal, 26a is a protrusion formed on the lead portion of the terminal 26, 13 is a surge absorber, 27 is a heat dissipation fin, and 27d is formed on the heat dissipation fin 27. 27e is a hollow surrounded by the wall 27d, 2
8 is a mounting plate, 29 is an insulating plate, and 30 is a casting material. In addition, in the figures, the same reference numerals indicate the same or equivalent parts.
補正 昭６２．８．１２
図面の簡単な説明を次のように補正する。
第１８頁１６〜１７行「２４，２５は第１のプ
リント」を２４は「第１のプリント」に補正する
。Amendment August 12, 1982 The brief description of the drawing is amended as follows. Page 18, lines 16-17, "24 and 25 are first prints" is corrected to "24 is first print".
Claims (1)
フインと、この放熱フインに形成されたくぼみに
挿入されたプリント配線基板及び端子類と、上記
くぼみに流し込まれて硬化させられたことによつ
て上記プリント配線基板及び端子類を固定してい
る注型材を備えることを特徴とするソリツドステ
ート・コンタクタ。 A heat dissipation fin to which a semiconductor switching element is attached, a printed wiring board and terminals inserted into a recess formed in the heat dissipation fin, and the printed wiring board and terminals inserted into the recess and hardened. 1. A solid-state contactor characterized by comprising a casting material fixing the parts.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14526886U JPS6351495U (en) | 1986-09-22 | 1986-09-22 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14526886U JPS6351495U (en) | 1986-09-22 | 1986-09-22 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6351495U true JPS6351495U (en) | 1988-04-07 |
Family
ID=31056650
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP14526886U Pending JPS6351495U (en) | 1986-09-22 | 1986-09-22 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6351495U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2015053385A (en) * | 2013-09-06 | 2015-03-19 | Tdk株式会社 | Power supply device |
-
1986
- 1986-09-22 JP JP14526886U patent/JPS6351495U/ja active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2015053385A (en) * | 2013-09-06 | 2015-03-19 | Tdk株式会社 | Power supply device |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JPH0220248U (en) | ||
| JPS6351495U (en) | ||
| JPS6351462U (en) | ||
| JPS6351464U (en) | ||
| JPS6351463U (en) | ||
| JPH0331092Y2 (en) | ||
| JPH0350970U (en) | ||
| JPH02142599U (en) | ||
| JPH0326105U (en) | ||
| JPH0179887U (en) | ||
| KR960044013A (en) | Method and method for manufacturing a printed circuit board | |
| JPS6365208U (en) | ||
| JPH0467312U (en) | ||
| JPH0217810U (en) | ||
| JPH0472646U (en) | ||
| JPH038484U (en) | ||
| JPS6183097U (en) | ||
| JPS606244U (en) | Mold package type semiconductor device | |
| JPS6398656U (en) | ||
| JPS62178593U (en) | ||
| JPS6387884U (en) | ||
| JPS6312893U (en) | ||
| JPH0375594U (en) | ||
| JPS58148961U (en) | Printed circuit board for immersion liquid cooling | |
| JPS6398655U (en) |