JPH032651U - - Google Patents
Info
- Publication number
- JPH032651U JPH032651U JP6223889U JP6223889U JPH032651U JP H032651 U JPH032651 U JP H032651U JP 6223889 U JP6223889 U JP 6223889U JP 6223889 U JP6223889 U JP 6223889U JP H032651 U JPH032651 U JP H032651U
- Authority
- JP
- Japan
- Prior art keywords
- heat sink
- fixed
- wiring board
- bent
- mounting structure
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000010586 diagram Methods 0.000 description 1
- 238000006073 displacement reaction Methods 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
Description
第１図および第２図はそれぞれこの考案に係る
放熱板の取付構造の一例を取付前および取付後の
状態で示す斜視図および側面断面図、第３図はこ
の考案の要部の変形例を示す斜視図、第４図は従
来の放熱板の取付構造を示す斜視図、第５図は第
４図のものにおいて、振動時の配線基板の変位の
説明図である。
１……放熱板、１ａ，１ｂ……脚部、２……電
子部品、２ａ，２ｂ……リード端子、４……配線
基板、８，３１，３２……支持片部。なお、図中
同一符号は同一もしくは相当部分を示す。
Figures 1 and 2 are perspective views and side sectional views showing an example of the mounting structure of a heat sink according to this invention before and after installation, respectively, and Figure 3 shows a modification of the main part of this invention. FIG. 4 is a perspective view showing a conventional heat sink mounting structure, and FIG. 5 is an explanatory diagram of the displacement of the wiring board during vibration in the structure shown in FIG. 4. DESCRIPTION OF SYMBOLS 1... Heat sink, 1a, 1b... Leg part, 2... Electronic component, 2a, 2b... Lead terminal, 4... Wiring board, 8, 31, 32... Support piece part. Note that the same reference numerals in the figures indicate the same or corresponding parts.
Claims (1)
上記放熱板と交差方向へ折曲形成されて上記配線
基板に接続・固定されるリード端子を有し、上記
放熱板に固定された電子部品とを備え、上記交差
方向へ沿つて折曲されて上記リード端子の接続部
近傍で上記配線基板に固定される支持片部を上記
放熱板に一体形成したことを特徴とする放熱板の
取付構造。 A heat sink fixed to the wiring board via the legs,
It has lead terminals that are bent in a direction crossing the heat sink and connected to and fixed to the wiring board, and includes an electronic component fixed to the heat sink, and is bent in the cross direction. A mounting structure for a heat sink, characterized in that a support piece portion fixed to the wiring board near the connection portion of the lead terminal is integrally formed on the heat sink.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6223889U JPH032651U (en) | 1989-05-29 | 1989-05-29 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6223889U JPH032651U (en) | 1989-05-29 | 1989-05-29 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH032651U true JPH032651U (en) | 1991-01-11 |
Family
ID=31591200
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP6223889U Pending JPH032651U (en) | 1989-05-29 | 1989-05-29 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH032651U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2007266179A (en) * | 2006-03-28 | 2007-10-11 | Seiko Epson Corp | Heat sink |
-
1989
- 1989-05-29 JP JP6223889U patent/JPH032651U/ja active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2007266179A (en) * | 2006-03-28 | 2007-10-11 | Seiko Epson Corp | Heat sink |
| JP4666165B2 (en) * | 2006-03-28 | 2011-04-06 | セイコーエプソン株式会社 | heatsink |