JPH047175U - - Google Patents

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Publication number
JPH047175U
JPH047175U JP4880290U JP4880290U JPH047175U JP H047175 U JPH047175 U JP H047175U JP 4880290 U JP4880290 U JP 4880290U JP 4880290 U JP4880290 U JP 4880290U JP H047175 U JPH047175 U JP H047175U
Authority
JP
Japan
Prior art keywords
card
wiring board
metal panel
frame
heat dissipation
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP4880290U
Other languages
English (en)
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP4880290U priority Critical patent/JPH047175U/ja
Publication of JPH047175U publication Critical patent/JPH047175U/ja
Pending legal-status Critical Current

Links

Landscapes

  • Credit Cards Or The Like (AREA)
JP4880290U 1990-05-09 1990-05-09 Pending JPH047175U (enEXAMPLES)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP4880290U JPH047175U (enEXAMPLES) 1990-05-09 1990-05-09

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP4880290U JPH047175U (enEXAMPLES) 1990-05-09 1990-05-09

Publications (1)

Publication Number Publication Date
JPH047175U true JPH047175U (enEXAMPLES) 1992-01-22

Family

ID=31565941

Family Applications (1)

Application Number Title Priority Date Filing Date
JP4880290U Pending JPH047175U (enEXAMPLES) 1990-05-09 1990-05-09

Country Status (1)

Country Link
JP (1) JPH047175U (enEXAMPLES)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH09226280A (ja) * 1996-02-22 1997-09-02 Shinko Electric Ind Co Ltd カードモジュール
JPH09231336A (ja) * 1995-12-20 1997-09-05 Pfu Ltd カード型回路モジュール
JP2011216077A (ja) * 2010-03-16 2011-10-27 Toshiba Corp 半導体メモリ装置

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62127292A (ja) * 1985-11-29 1987-06-09 株式会社東芝 携帯可能記憶媒体用の放熱装置
JPH0217659A (ja) * 1988-05-05 1990-01-22 Digital Equip Corp <Dec> 回路チップをｅｍｉ、ｅｓｄ、熱及び機械的衝撃から保護するためのパッケージ
JPH0287655A (ja) * 1988-09-26 1990-03-28 Nec Corp 半導体装置

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62127292A (ja) * 1985-11-29 1987-06-09 株式会社東芝 携帯可能記憶媒体用の放熱装置
JPH0217659A (ja) * 1988-05-05 1990-01-22 Digital Equip Corp <Dec> 回路チップをｅｍｉ、ｅｓｄ、熱及び機械的衝撃から保護するためのパッケージ
JPH0287655A (ja) * 1988-09-26 1990-03-28 Nec Corp 半導体装置

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH09231336A (ja) * 1995-12-20 1997-09-05 Pfu Ltd カード型回路モジュール
JPH09226280A (ja) * 1996-02-22 1997-09-02 Shinko Electric Ind Co Ltd カードモジュール
JP2011216077A (ja) * 2010-03-16 2011-10-27 Toshiba Corp 半導体メモリ装置
US8670243B2 (en) 2010-03-16 2014-03-11 Kabushiki Kaisha Toshiba Semiconductor memory device
US9351418B2 (en) 2010-03-16 2016-05-24 Kabushiki Kaisha Toshiba Semiconductor memory device

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