JPH0471286B2 - - Google Patents
Info
- Publication number
- JPH0471286B2 JPH0471286B2 JP4868783A JP4868783A JPH0471286B2 JP H0471286 B2 JPH0471286 B2 JP H0471286B2 JP 4868783 A JP4868783 A JP 4868783A JP 4868783 A JP4868783 A JP 4868783A JP H0471286 B2 JPH0471286 B2 JP H0471286B2
- Authority
- JP
- Japan
- Prior art keywords
- vacuum
- brazing
- layer
- temperature
- vacuum valve
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000000463 material Substances 0.000 claims description 38
- 238000000034 method Methods 0.000 claims description 30
- 229910052738 indium Inorganic materials 0.000 claims description 17
- 238000004519 manufacturing process Methods 0.000 claims description 13
- 229910017755 Cu-Sn Inorganic materials 0.000 claims description 10
- 229910017927 Cu—Sn Inorganic materials 0.000 claims description 10
- 230000008018 melting Effects 0.000 claims description 8
- 238000002844 melting Methods 0.000 claims description 8
- 229910001128 Sn alloy Inorganic materials 0.000 claims description 3
- 229910018956 Sn—In Inorganic materials 0.000 claims description 2
- KUNSUQLRTQLHQQ-UHFFFAOYSA-N copper tin Chemical compound [Cu].[Sn] KUNSUQLRTQLHQQ-UHFFFAOYSA-N 0.000 claims 1
- 238000005219 brazing Methods 0.000 description 57
- 239000002184 metal Substances 0.000 description 23
- 229910052751 metal Inorganic materials 0.000 description 23
- 239000000945 filler Substances 0.000 description 20
- 239000010410 layer Substances 0.000 description 16
- 229910052718 tin Inorganic materials 0.000 description 16
- 238000003466 welding Methods 0.000 description 16
- 239000010949 copper Substances 0.000 description 14
- 230000008020 evaporation Effects 0.000 description 11
- 238000001704 evaporation Methods 0.000 description 11
- 229910045601 alloy Inorganic materials 0.000 description 9
- 239000000956 alloy Substances 0.000 description 9
- 229910052802 copper Inorganic materials 0.000 description 9
- 238000007789 sealing Methods 0.000 description 8
- 229910000679 solder Inorganic materials 0.000 description 8
- 230000005496 eutectics Effects 0.000 description 7
- 238000010438 heat treatment Methods 0.000 description 7
- 229910052787 antimony Inorganic materials 0.000 description 6
- 239000001257 hydrogen Substances 0.000 description 6
- 229910052739 hydrogen Inorganic materials 0.000 description 6
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 description 5
- 229910052797 bismuth Inorganic materials 0.000 description 5
- 230000000694 effects Effects 0.000 description 5
- 229910052745 lead Inorganic materials 0.000 description 5
- 239000000126 substance Substances 0.000 description 5
- 229910052714 tellurium Inorganic materials 0.000 description 5
- 238000005304 joining Methods 0.000 description 4
- 229910052709 silver Inorganic materials 0.000 description 4
- 239000010935 stainless steel Substances 0.000 description 4
- 229910001220 stainless steel Inorganic materials 0.000 description 4
- 238000012360 testing method Methods 0.000 description 4
- 229910017944 Ag—Cu Inorganic materials 0.000 description 3
- 239000011247 coating layer Substances 0.000 description 3
- 239000004020 conductor Substances 0.000 description 3
- 239000000203 mixture Substances 0.000 description 3
- 238000007747 plating Methods 0.000 description 3
- 229910052725 zinc Inorganic materials 0.000 description 3
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 2
- 238000011109 contamination Methods 0.000 description 2
- 239000011162 core material Substances 0.000 description 2
- 230000003247 decreasing effect Effects 0.000 description 2
- 230000007547 defect Effects 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 238000002474 experimental method Methods 0.000 description 2
- 150000002739 metals Chemical class 0.000 description 2
- 230000003647 oxidation Effects 0.000 description 2
- 238000007254 oxidation reaction Methods 0.000 description 2
- 229910052573 porcelain Inorganic materials 0.000 description 2
- 230000001603 reducing effect Effects 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 229910001030 Iron–nickel alloy Inorganic materials 0.000 description 1
- 229910017709 Ni Co Inorganic materials 0.000 description 1
- 229910003267 Ni-Co Inorganic materials 0.000 description 1
- 229910003262 Ni‐Co Inorganic materials 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 229910052793 cadmium Inorganic materials 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 239000002131 composite material Substances 0.000 description 1
- 230000002596 correlated effect Effects 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 238000007872 degassing Methods 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 238000007598 dipping method Methods 0.000 description 1
- 238000010894 electron beam technology Methods 0.000 description 1
- 238000011156 evaluation Methods 0.000 description 1
- 239000011888 foil Substances 0.000 description 1
- 239000007789 gas Substances 0.000 description 1
- 150000002431 hydrogen Chemical class 0.000 description 1
- 230000001939 inductive effect Effects 0.000 description 1
- 239000000155 melt Substances 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 230000001590 oxidative effect Effects 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- 239000007790 solid phase Substances 0.000 description 1
- 238000007711 solidification Methods 0.000 description 1
- 230000008023 solidification Effects 0.000 description 1
- 239000002344 surface layer Substances 0.000 description 1
- 238000007740 vapor deposition Methods 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
- 238000009736 wetting Methods 0.000 description 1
Landscapes
- Ceramic Products (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4868783A JPS59175521A (ja) | 1983-03-25 | 1983-03-25 | 真空バルブの製造方法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4868783A JPS59175521A (ja) | 1983-03-25 | 1983-03-25 | 真空バルブの製造方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS59175521A JPS59175521A (ja) | 1984-10-04 |
| JPH0471286B2 true JPH0471286B2 (US07413550-20080819-C00001.png) | 1992-11-13 |
Family
ID=12810225
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP4868783A Granted JPS59175521A (ja) | 1983-03-25 | 1983-03-25 | 真空バルブの製造方法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS59175521A (US07413550-20080819-C00001.png) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2909856B2 (ja) * | 1991-11-14 | 1999-06-23 | 日本特殊陶業株式会社 | セラミックス基板と金属の接合体 |
| TW264530B (US07413550-20080819-C00001.png) * | 1993-12-24 | 1995-12-01 | Hitachi Seisakusyo Kk | |
| JP2007059107A (ja) * | 2005-08-23 | 2007-03-08 | Hitachi Ltd | 電気接点 |
-
1983
- 1983-03-25 JP JP4868783A patent/JPS59175521A/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS59175521A (ja) | 1984-10-04 |
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