JPH0470394B2 - - Google Patents
Info
- Publication number
- JPH0470394B2 JPH0470394B2 JP57185568A JP18556882A JPH0470394B2 JP H0470394 B2 JPH0470394 B2 JP H0470394B2 JP 57185568 A JP57185568 A JP 57185568A JP 18556882 A JP18556882 A JP 18556882A JP H0470394 B2 JPH0470394 B2 JP H0470394B2
- Authority
- JP
- Japan
- Prior art keywords
- alloy
- plating
- gold
- current density
- composition
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 238000007747 plating Methods 0.000 claims description 47
- 229910052709 silver Inorganic materials 0.000 claims description 34
- 229910045601 alloy Inorganic materials 0.000 claims description 28
- 239000000956 alloy Substances 0.000 claims description 28
- 239000010931 gold Substances 0.000 claims description 25
- 239000010949 copper Substances 0.000 claims description 24
- 229910052802 copper Inorganic materials 0.000 claims description 21
- 229910052737 gold Inorganic materials 0.000 claims description 14
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims description 7
- 239000004332 silver Substances 0.000 claims description 6
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 5
- XFXPMWWXUTWYJX-UHFFFAOYSA-N Cyanide Chemical compound N#[C-] XFXPMWWXUTWYJX-UHFFFAOYSA-N 0.000 claims description 5
- 239000003513 alkali Substances 0.000 claims description 5
- 229910001020 Au alloy Inorganic materials 0.000 claims description 4
- 229910000881 Cu alloy Inorganic materials 0.000 claims description 4
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims description 3
- 238000004519 manufacturing process Methods 0.000 claims description 3
- 239000000463 material Substances 0.000 claims description 3
- 239000002585 base Substances 0.000 claims description 2
- -1 carbonate compound Chemical class 0.000 claims description 2
- 239000003353 gold alloy Substances 0.000 claims description 2
- 238000000151 deposition Methods 0.000 claims 1
- 239000000203 mixture Substances 0.000 description 24
- 229910002708 Au–Cu Inorganic materials 0.000 description 20
- 229910017944 Ag—Cu Inorganic materials 0.000 description 13
- 238000009792 diffusion process Methods 0.000 description 13
- 230000008021 deposition Effects 0.000 description 7
- 235000019646 color tone Nutrition 0.000 description 5
- 239000010944 silver (metal) Substances 0.000 description 5
- 238000005260 corrosion Methods 0.000 description 4
- 230000007797 corrosion Effects 0.000 description 4
- 239000002244 precipitate Substances 0.000 description 4
- 229910001316 Ag alloy Inorganic materials 0.000 description 3
- 230000008018 melting Effects 0.000 description 3
- 238000002844 melting Methods 0.000 description 3
- 238000000034 method Methods 0.000 description 3
- 229910001369 Brass Inorganic materials 0.000 description 2
- 239000010951 brass Substances 0.000 description 2
- 230000005484 gravity Effects 0.000 description 2
- 239000007788 liquid Substances 0.000 description 2
- PXHVJJICTQNCMI-UHFFFAOYSA-N nickel Substances [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- 238000003756 stirring Methods 0.000 description 2
- 229910002710 Au-Pd Inorganic materials 0.000 description 1
- 229910000925 Cd alloy Inorganic materials 0.000 description 1
- 229910002056 binary alloy Inorganic materials 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- QOGLYAWBNATGQE-UHFFFAOYSA-N copper;gold;silver Chemical compound [Cu].[Au][Ag] QOGLYAWBNATGQE-UHFFFAOYSA-N 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005323 electroforming Methods 0.000 description 1
- MOFOBJHOKRNACT-UHFFFAOYSA-N nickel silver Chemical compound [Ni].[Ag] MOFOBJHOKRNACT-UHFFFAOYSA-N 0.000 description 1
- 239000010956 nickel silver Substances 0.000 description 1
- 150000002825 nitriles Chemical class 0.000 description 1
- NNFCIKHAZHQZJG-UHFFFAOYSA-N potassium cyanide Chemical compound [K+].N#[C-] NNFCIKHAZHQZJG-UHFFFAOYSA-N 0.000 description 1
- TYJJADVDDVDEDZ-UHFFFAOYSA-M potassium hydrogencarbonate Chemical compound [K+].OC([O-])=O TYJJADVDDVDEDZ-UHFFFAOYSA-M 0.000 description 1
- 230000000087 stabilizing effect Effects 0.000 description 1
Landscapes
- Electroplating And Plating Baths Therefor (AREA)
- Electroplating Methods And Accessories (AREA)
- Other Surface Treatments For Metallic Materials (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP18556882A JPS5976891A (ja) | 1982-10-22 | 1982-10-22 | 金合金の製造方法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP18556882A JPS5976891A (ja) | 1982-10-22 | 1982-10-22 | 金合金の製造方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5976891A JPS5976891A (ja) | 1984-05-02 |
| JPH0470394B2 true JPH0470394B2 (US07922777-20110412-C00004.png) | 1992-11-10 |
Family
ID=16173079
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP18556882A Granted JPS5976891A (ja) | 1982-10-22 | 1982-10-22 | 金合金の製造方法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5976891A (US07922777-20110412-C00004.png) |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0382788A (ja) * | 1989-08-28 | 1991-04-08 | Eagle Ind Co Ltd | 多層電析層の形成方法 |
| SG127854A1 (en) * | 2005-06-02 | 2006-12-29 | Rohm & Haas Elect Mat | Improved gold electrolytes |
| CN102896832B (zh) * | 2011-07-28 | 2015-02-04 | 中国科学院金属研究所 | 一种功率模块金属化陶瓷基板及金属化方法 |
| CN109396364B (zh) * | 2018-12-11 | 2020-05-26 | 西安诺博尔稀贵金属材料有限公司 | 一种金银铜合金铸锭的制备方法 |
-
1982
- 1982-10-22 JP JP18556882A patent/JPS5976891A/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS5976891A (ja) | 1984-05-02 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JPS5534692A (en) | Gold plated electronic parts and production thereof | |
| JP5887381B2 (ja) | 有毒金属または半金属を使用することなく電気めっき法により黄色金合金析出物を得る方法 | |
| US6413653B1 (en) | Personal ornament covered with colored coating and process for producing the same | |
| JPS60248892A (ja) | 高純度パラジウム・ニッケル合金メッキ液及び方法 | |
| JPH0470394B2 (US07922777-20110412-C00004.png) | ||
| US5792565A (en) | Multiple layered article having a bright copper layer | |
| JPH0147558B2 (US07922777-20110412-C00004.png) | ||
| JPH0571673B2 (US07922777-20110412-C00004.png) | ||
| JP2577832B2 (ja) | 白金電鋳浴 | |
| US4309256A (en) | Process for the galvanoplastic deposition of a gold alloy | |
| JP3029948B2 (ja) | Ｓｎ−Ｃｕ−Ｐｄ合金めっき部材、その製造に用いるめっき浴 | |
| JPS62164890A (ja) | 金銀銅合金めつき液 | |
| JPS6314067B2 (US07922777-20110412-C00004.png) | ||
| US3056733A (en) | Process for electrolytic deposition of gold-copper-cadmium alloys | |
| CH418085A (fr) | Electrolyte pour le dépôt galvanique d'alliages d'or | |
| DE10243139A1 (de) | Dunkle Schichten | |
| JPS62164889A (ja) | 金銀銅合金めつき液 | |
| JPS5858296A (ja) | ステンレス鋼素材に対する金メツキ方法 | |
| Faust | Electrodeposition of Alloys, 1930 to 1940 | |
| US3738920A (en) | Plating tarnish-inhibited bright silver alloy | |
| JP2952541B2 (ja) | 白色または金色めっき製品 | |
| JPS5976892A (ja) | 金合金 | |
| JPS5823478B2 (ja) | 硬質金合金被膜の製造方法 | |
| Krohn et al. | Electrodeposition of alloys: Present state of the art | |
| JPS6358919B2 (US07922777-20110412-C00004.png) |
