JPH0469528B2 - - Google Patents
Info
- Publication number
- JPH0469528B2 JPH0469528B2 JP4076487A JP4076487A JPH0469528B2 JP H0469528 B2 JPH0469528 B2 JP H0469528B2 JP 4076487 A JP4076487 A JP 4076487A JP 4076487 A JP4076487 A JP 4076487A JP H0469528 B2 JPH0469528 B2 JP H0469528B2
- Authority
- JP
- Japan
- Prior art keywords
- ingot
- cutting
- vacuum
- suction
- wafer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 238000005520 cutting process Methods 0.000 claims description 56
- 238000000034 method Methods 0.000 claims description 12
- 235000012431 wafers Nutrition 0.000 description 47
- 239000004065 semiconductor Substances 0.000 description 5
- 230000000694 effects Effects 0.000 description 4
- 239000000463 material Substances 0.000 description 4
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 3
- 230000002093 peripheral effect Effects 0.000 description 3
- 229910052710 silicon Inorganic materials 0.000 description 3
- 239000010703 silicon Substances 0.000 description 3
- 238000010276 construction Methods 0.000 description 2
- 230000007547 defect Effects 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 238000011084 recovery Methods 0.000 description 2
- 238000001179 sorption measurement Methods 0.000 description 2
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- 206010067482 No adverse event Diseases 0.000 description 1
- 210000001015 abdomen Anatomy 0.000 description 1
- 238000004026 adhesive bonding Methods 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- 238000005336 cracking Methods 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 239000002173 cutting fluid Substances 0.000 description 1
- 229910003460 diamond Inorganic materials 0.000 description 1
- 239000010432 diamond Substances 0.000 description 1
- 238000012423 maintenance Methods 0.000 description 1
- 230000010355 oscillation Effects 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 230000000704 physical effect Effects 0.000 description 1
- 238000012805 post-processing Methods 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 239000007779 soft material Substances 0.000 description 1
- 125000006850 spacer group Chemical group 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- 238000009423 ventilation Methods 0.000 description 1
- 239000002699 waste material Substances 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Landscapes
- Jigs For Machine Tools (AREA)
- Processing Of Stones Or Stones Resemblance Materials (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
Priority Applications (5)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP62040764A JPS63207614A (ja) | 1987-02-24 | 1987-02-24 | インゴツト切断方法 |
| US07/156,748 US4903681A (en) | 1987-02-24 | 1988-02-18 | Method and apparatus for cutting a cylindrical material |
| DE88102589T DE3883804T2 (de) | 1987-02-24 | 1988-02-22 | Verfahren und Vorrichtung für das Schneiden eines zylindrischen Materials. |
| EP19880102589 EP0280245B1 (en) | 1987-02-24 | 1988-02-22 | Method and apparatus for cutting a cylindrical material |
| KR1019880001932A KR930005466B1 (ko) | 1987-02-24 | 1988-02-24 | 원통형재료의 절단방법 및 장치 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP62040764A JPS63207614A (ja) | 1987-02-24 | 1987-02-24 | インゴツト切断方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS63207614A JPS63207614A (ja) | 1988-08-29 |
| JPH0469528B2 true JPH0469528B2 (enrdf_load_stackoverflow) | 1992-11-06 |
Family
ID=12589689
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP62040764A Granted JPS63207614A (ja) | 1987-02-24 | 1987-02-24 | インゴツト切断方法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS63207614A (enrdf_load_stackoverflow) |
Families Citing this family (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5993810A (ja) * | 1982-11-17 | 1984-05-30 | Kawasaki Steel Corp | 溶融スラグ薄層固化装置 |
| JP4861027B2 (ja) * | 2006-03-15 | 2012-01-25 | 日本碍子株式会社 | セラミック円柱状体用把持装置 |
| US8425279B2 (en) * | 2008-09-30 | 2013-04-23 | Misubishi Polycrystalline Silicon America Corporation (MIPSA) | Apparatus for manufacturing seeds for polycrystalline silicon manufacture |
| JP6197617B2 (ja) * | 2013-12-05 | 2017-09-20 | 信越半導体株式会社 | 切断治具及びワークの切断方法 |
| JP6617721B2 (ja) * | 2017-01-18 | 2019-12-11 | 信越半導体株式会社 | インゴット切断装置 |
| CN116619583A (zh) * | 2023-04-19 | 2023-08-22 | 唐山晶玉科技股份有限公司 | 一种用于单晶硅棒料切断作业的工件支撑装置 |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5414440A (en) * | 1977-07-04 | 1979-02-02 | Dai Ichi Kogyo Seiyaku Co Ltd | Adhesive composition |
| JPS55144963A (en) * | 1979-04-26 | 1980-11-12 | Soken Kogyo Kk | Adhering method of solid abrasive on buffing surface |
| JPS5851989Y2 (ja) * | 1979-12-04 | 1983-11-26 | 寅雄 田之内 | 木板の塗装仕上げ機 |
| JPS5753857U (enrdf_load_stackoverflow) * | 1981-08-27 | 1982-03-29 |
-
1987
- 1987-02-24 JP JP62040764A patent/JPS63207614A/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS63207614A (ja) | 1988-08-29 |
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