JPS63207614A - インゴツト切断方法 - Google Patents

インゴツト切断方法

Info

Publication number
JPS63207614A
JPS63207614A JP62040764A JP4076487A JPS63207614A JP S63207614 A JPS63207614 A JP S63207614A JP 62040764 A JP62040764 A JP 62040764A JP 4076487 A JP4076487 A JP 4076487A JP S63207614 A JPS63207614 A JP S63207614A
Authority
JP
Japan
Prior art keywords
cutting
ingot
wafer
cut
blade
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP62040764A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0469528B2 (enrdf_load_stackoverflow
Inventor
本田　勝男
修一 塚田
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Tokyo Seimitsu Co Ltd
Original Assignee
Tokyo Seimitsu Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokyo Seimitsu Co Ltd filed Critical Tokyo Seimitsu Co Ltd
Priority to JP62040764A priority Critical patent/JPS63207614A/ja
Priority to US07/156,748 priority patent/US4903681A/en
Priority to DE88102589T priority patent/DE3883804T2/de
Priority to EP19880102589 priority patent/EP0280245B1/en
Priority to KR1019880001932A priority patent/KR930005466B1/ko
Publication of JPS63207614A publication Critical patent/JPS63207614A/ja
Publication of JPH0469528B2 publication Critical patent/JPH0469528B2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Jigs For Machine Tools (AREA)
  • Processing Of Stones Or Stones Resemblance Materials (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
JP62040764A 1987-02-24 1987-02-24 インゴツト切断方法 Granted JPS63207614A (ja)

Priority Applications (5)

Application Number Priority Date Filing Date Title
JP62040764A JPS63207614A (ja) 1987-02-24 1987-02-24 インゴツト切断方法
US07/156,748 US4903681A (en) 1987-02-24 1988-02-18 Method and apparatus for cutting a cylindrical material
DE88102589T DE3883804T2 (de) 1987-02-24 1988-02-22 Verfahren und Vorrichtung für das Schneiden eines zylindrischen Materials.
EP19880102589 EP0280245B1 (en) 1987-02-24 1988-02-22 Method and apparatus for cutting a cylindrical material
KR1019880001932A KR930005466B1 (ko) 1987-02-24 1988-02-24 원통형재료의 절단방법 및 장치

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP62040764A JPS63207614A (ja) 1987-02-24 1987-02-24 インゴツト切断方法

Publications (2)

Publication Number Publication Date
JPS63207614A true JPS63207614A (ja) 1988-08-29
JPH0469528B2 JPH0469528B2 (enrdf_load_stackoverflow) 1992-11-06

Family

ID=12589689

Family Applications (1)

Application Number Title Priority Date Filing Date
JP62040764A Granted JPS63207614A (ja) 1987-02-24 1987-02-24 インゴツト切断方法

Country Status (1)

Country Link
JP (1) JPS63207614A (enrdf_load_stackoverflow)

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5993810A (ja) * 1982-11-17 1984-05-30 Kawasaki Steel Corp 溶融スラグ薄層固化装置
JP2007245522A (ja) * 2006-03-15 2007-09-27 Ngk Insulators Ltd セラミック円柱状体用把持装置
JP2010083743A (ja) * 2008-09-30 2010-04-15 Mitsubishi Materials Corp 多結晶シリコン製造用シードの製造装置
JP2015109378A (ja) * 2013-12-05 2015-06-11 信越半導体株式会社 切断治具及びワークの切断方法
JP2018117034A (ja) * 2017-01-18 2018-07-26 信越半導体株式会社 インゴット切断装置
CN116619583A (zh) * 2023-04-19 2023-08-22 唐山晶玉科技股份有限公司 一种用于单晶硅棒料切断作业的工件支撑装置

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5414440A (en) * 1977-07-04 1979-02-02 Dai Ichi Kogyo Seiyaku Co Ltd Adhesive composition
JPS55144963A (en) * 1979-04-26 1980-11-12 Soken Kogyo Kk Adhering method of solid abrasive on buffing surface
JPS5687170U (enrdf_load_stackoverflow) * 1979-12-04 1981-07-13
JPS5753857U (enrdf_load_stackoverflow) * 1981-08-27 1982-03-29

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5414440A (en) * 1977-07-04 1979-02-02 Dai Ichi Kogyo Seiyaku Co Ltd Adhesive composition
JPS55144963A (en) * 1979-04-26 1980-11-12 Soken Kogyo Kk Adhering method of solid abrasive on buffing surface
JPS5687170U (enrdf_load_stackoverflow) * 1979-12-04 1981-07-13
JPS5753857U (enrdf_load_stackoverflow) * 1981-08-27 1982-03-29

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5993810A (ja) * 1982-11-17 1984-05-30 Kawasaki Steel Corp 溶融スラグ薄層固化装置
JP2007245522A (ja) * 2006-03-15 2007-09-27 Ngk Insulators Ltd セラミック円柱状体用把持装置
JP2010083743A (ja) * 2008-09-30 2010-04-15 Mitsubishi Materials Corp 多結晶シリコン製造用シードの製造装置
JP2015109378A (ja) * 2013-12-05 2015-06-11 信越半導体株式会社 切断治具及びワークの切断方法
JP2018117034A (ja) * 2017-01-18 2018-07-26 信越半導体株式会社 インゴット切断装置
CN116619583A (zh) * 2023-04-19 2023-08-22 唐山晶玉科技股份有限公司 一种用于单晶硅棒料切断作业的工件支撑装置

Also Published As

Publication number Publication date
JPH0469528B2 (enrdf_load_stackoverflow) 1992-11-06

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