JPH0468581U - - Google Patents

Info

Publication number
JPH0468581U
JPH0468581U JP11190090U JP11190090U JPH0468581U JP H0468581 U JPH0468581 U JP H0468581U JP 11190090 U JP11190090 U JP 11190090U JP 11190090 U JP11190090 U JP 11190090U JP H0468581 U JPH0468581 U JP H0468581U
Authority
JP
Japan
Prior art keywords
substrate
protective film
glass
electrode parts
films
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP11190090U
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP11190090U priority Critical patent/JPH0468581U/ja
Publication of JPH0468581U publication Critical patent/JPH0468581U/ja
Pending legal-status Critical Current

Links

Landscapes

  • Multi-Conductor Connections (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)

Description

【図面の簡単な説明】[Brief explanation of drawings]

第1図は、本考案が適用されたハイブリツドI
Cの要部平面図である。第2図は、第1図の−
線について見た断面図である。 1……セラミツク基板、2……導体膜、3……
搭載部、4……電極部、4a,4b……部分、5
……ガラス保護膜、5a……延長部。
Figure 1 shows a hybrid I to which the present invention is applied.
FIG. Figure 2 is the − of Figure 1.
FIG. 1...Ceramic substrate, 2...Conductor film, 3...
Mounting part, 4...Electrode part, 4a, 4b...part, 5
...Glass protective film, 5a...extension part.

Claims (1)

【実用新案登録請求の範囲】 基板表面の縁部近傍に互いに近接する複数のリ
ード取付用電極部が露出すると共に前記表面に形
成された導体膜、抵抗体膜等のパターンを保護す
るためのガラス保護膜を有するIC用基板の保護
構造であつて、 前記各リード取付用電極部間に前記ガラス保護
膜を介在させたことを特徴とするIC用基板の保
護構造。
[Claims for Utility Model Registration] Glass for exposing a plurality of electrode parts for attaching leads close to each other near the edge of the surface of a substrate and for protecting patterns of conductor films, resistor films, etc. formed on the surface. A protective structure for an IC substrate having a protective film, characterized in that the glass protective film is interposed between each of the lead attachment electrode parts.
JP11190090U 1990-10-25 1990-10-25 Pending JPH0468581U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP11190090U JPH0468581U (en) 1990-10-25 1990-10-25

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP11190090U JPH0468581U (en) 1990-10-25 1990-10-25

Publications (1)

Publication Number Publication Date
JPH0468581U true JPH0468581U (en) 1992-06-17

Family

ID=31859384

Family Applications (1)

Application Number Title Priority Date Filing Date
JP11190090U Pending JPH0468581U (en) 1990-10-25 1990-10-25

Country Status (1)

Country Link
JP (1) JPH0468581U (en)

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