JPH0465107A - Laminated composite part - Google Patents

Abstract

PURPOSE:To obtain a laminated composite part to form a complicated electronic circuit by electrically connecting at least one external electrode among second external electrodes with internal electronic part function element by means of via holes. CONSTITUTION:Internal electrodes 13a to 13d form capacitors through ceramic layers, the internal electrodes 13a, 13c are connected with a via hole 14a filled with conductive material and internal electrodes 13b, 13d are connected with a via hole 14b filled with conductive material. The via holes 14a, 14b are connected with external electrodes 15a, 15b at the upper surface of the laminated layer 12. The internal electrodes 16a to 16c form capacitors through ceramic layers. The electrodes 16a, 16c are connected to the electrode 17a at the side surface of laminated material 12 and the electrode 16b to the electrode 17b. The external electrodes 17a to 17l are scattered for formation on the side surface of external circumference of the laminated material 12 and are connected with any internal electronic part function element. The electrodes 15a to 15g are formed on the upper and lower surfaces of the laminated material 12. With such structure, a complicated electronic circuit may be formed by comprising many electronic part function elements.

Description

[Detailed Description of the Invention] [Field of Industrial Application] The present invention relates to a laminated composite electronic component having a structure in which a plurality of functional electronic components such as capacitors are built into a laminated body, and in particular, The present invention relates to a laminated composite electronic component having a structure that allows circuits to be configured with high precision.

[Conventional technology]

BACKGROUND ART Laminated composite parts constructed using ceramic laminates have been known. An example of such a laminated composite part will be explained with reference to FIGS. 3 and 4. The laminated composite component 1 is constructed using a ceramic laminate 2. The ceramic laminate 2 is obtained by laminating a plurality of ceramic green sheets and firing them together.

Inside the laminate 2, a plurality of internal electrodes 3 to 6 are formed, as shown in a plan cross-sectional view in FIG. 4, for example. The plurality of internal electrodes 3 to 6 each have an electrode extension portion 3a.
6a to the outer circumferential side of the laminate 2.

Further, above and below the internal electrodes 3 to 6, the internal electrode 3
Internal electrodes (not shown) are formed so as to overlap with the internal electrodes 3 to 6 via the ceramic layer, and a capacitor is formed in each region where the internal electrodes 3 to 6 are arranged.

Returning to FIG. 3, a plurality of interior portions 7a to 71 are formed on the outer peripheral side surface of the laminate 2. As shown in FIG. The external electrodes 7a to 71 are
For example, internal electrodes 3 to 3 that are provided to draw out the electronic component functional element such as the capacitor configured inside the capacitor are respectively provided.
6 are electrically connected to external electrodes 7a, 7d, 1f, and 7i, respectively. Other external electrodes 7b, 7c, 7c7
g, 7h, 7j~7! Similarly, they are electrically connected to other internal electrodes and electronic component functional elements formed within the laminate 2.

Examples of the electronic component functional elements configured in the laminate 2 include, in addition to the above-mentioned capacitors, other electronic component functional elements such as resistors and inductances.

(Problem to be solved by the invention) In order to achieve high-density packaging of electronic components, it is required to incorporate more electronic component functional elements even in laminated composite components.Increasing the number of electronic component elements When trying to configure a complicated electronic circuit, a large number of electrode extension parts will be drawn out on the outer circumferential side of the laminate 2. However, since the area of the outer circumferential side is limited,
It is difficult to draw out a large number of electrode lead-out portions to the outer circumferential side surface, and there is also a limit to forming a large number of external electrodes on the outer circumferential side surface in response to such a large number of lead-out electrodes.

That is, in the conventional laminated composite component 1, the external electrodes are electrically connected to the internal electronic component functional elements on the outer circumferential side surface, so the number of external electrodes is limited and only a simple electronic circuit can be configured. I couldn't. Furthermore, even if the size of the laminate 2 is increased, it is extremely difficult to increase the number of built-in electronic component functional elements in the conventional laminate type composite component 1 because the area of the outer peripheral side surface is limited. Ta.

Furthermore, when a plurality of capacitors are built into the laminate 2, it is difficult to form individual capacitors with high precision due to stacking misalignment, etc., and variations in capacitance tend to occur6. An object of the present invention is to provide a structure that can configure more complex circuits, can cope with an increase in the number of in-situ child component functional elements, and can also set characteristics such as capacitance with high precision. The objective is to provide a laminated composite part with the following features.

[Means to solve the problem]

The laminated composite component of the present invention includes a laminate in which a plurality of electronic component functional elements are formed, and a laminate formed on the outer circumferential side of the laminate and electrically connected to the internal electronic component elements. a plurality of first external electrodes, and a plurality of second external electrodes provided on at least one of the upper surface or the lower surface of the laminate and electrically connected to any of the internal electronic component functional elements. At least one of the plurality of second external electrodes is electrically connected to an internal electronic component functional element through a via hole.

[Effect]

Any of the built-in electronic component functional elements is drawn out to at least one of the upper surface or the lower surface of the laminate through a via hole, and is electrically connected to a second external electrode provided on at least one of the upper surface or the lower surface. Because they are connected, that is, at least one of the top or bottom surfaces of the laminate is used as a drawer for electronic component functional elements, it is possible to incorporate a larger number of electronic component functional elements or to configure more complex electronic circuits. It is considered possible to do so.

In other words, the laminated composite component of the present invention utilizes not only the outer circumferential side of the laminate but also at least one of the top surface and the bottom surface as a connection part with the outside, so that the built-in electronic component functional element can be connected to the outside of the laminate. It is characterized by reducing the density of drawings to the surface, thereby making it possible to incorporate a larger number of electronic component functional elements and to configure a more complex electronic circuit.

C Description of Embodiment] A laminated composite component according to an embodiment of the present invention will be described with reference to FIGS. 1 and 2.

Referring to FIG. 1, the laminated composite component 11 of this example is as follows:
It is constructed using a ceramic laminate 12 in which a plurality of electronic component functional elements are built-in.

A large number of electronic component functional elements are configured within the laminate 12, some of which will be explained with reference to FIG. 2.

In the cross section shown in FIG. 2, internal electrodes 13a to 13d are laminated in the upper part with ceramic layers interposed therebetween, thereby forming one laminated capacitor part. Internal electrodes 13a and 13c are electrically connected to each other by a via hole 14a filled with a conductive material, and internal electrodes 13b and 13d are electrically connected by a via hole 14b filled with a conductive material. The via holes 14a and 14b are formed to reach the upper surface of the stacked body 12, and the second external electrodes 15a and 15
b, respectively, are electrically connected to each other.

Further, below the internal electrodes 13a to 13d, internal electrodes 16a to 16c are similarly laminated with ceramic layers interposed therebetween to form a capacitor.

The internal electrodes 16a and 16c are electrically connected to a first external electrode 17a formed on the side surface of the laminate 12, and the internal electrode 16b is electrically connected to a first external electrode 17b also formed on the side surface.

In this way, a large number of electronic component functional elements including the two capacitors described above are configured within the laminate 12.

Furthermore, as shown in FIG. 1, a plurality of first external electrodes 17a to 17! are formed dispersedly on the outer circumferential side of the laminate 12, and are electrically connected to any of the internal electronic component functional elements.

In addition, second external electrodes 15a to 15g are formed on the upper surface 12a and the lower surface 12b of the laminate 12.

Therefore, even if a large number of electronic component functional elements are built-in, the drawer portions of the built-in electronic component functional elements are not limited to the outer circumferential side of the laminate 12, and are not limited to the upper surface 12a and the lower surface 12b.
It is also possible to withdraw. Therefore, compared to conventional laminated composite parts, it is possible to incorporate a larger number of electronic component functional elements to construct a more complex electronic circuit.

In addition, in a multilayer composite component that incorporates a large number of electronic functional elements as described above, stacking misalignment between overlapping internal electrodes is likely to occur, resulting in variations in capacitance in the capacitor portion as described above. Although it may be difficult, in the laminated composite component 11 of this embodiment, the capacitance adjustment electrode 19 is formed on the upper surface 12a of the laminated body 12 in a continuous manner with the second external electrode 15b.

That is, by appropriately trimming the size of the capacitance adjusting electrode 19, it is possible to accurately set the capacitance of the multilayer capacitor composed of the internal electrodes 13a to 13d to a desired value. Therefore, the yield of parts can be increased, and it can also be applied to parts such as filters that require highly accurate capacitance setting.

Note that this trimming can be performed by using a sandblasting method, a laser method, or the like.

Further, on the upper surface 12a of the laminate 12, in addition to the second external electrode, connection electrodes 20a and 20b are formed so as to be connected to the first external electrodes 17h and 17i. A resistor 21 is formed between 20a and 20b. That is, using the upper surface 12a of the laminate 12,
In addition to simply wiring the built-in electronic component functional elements, the electronic component functional elements are also configured on the upper surface 12a. Therefore, more complex electronic circuits are constructed.

Further, on the upper surface 12a of the laminate 12, a connection land 22 is provided.
a and 22b are formed at a predetermined distance apart. Each connection land 22a, 22b is connected to the first external electrode 1, respectively.
7 and is electrically connected to l'l. Connection land 2
Other chip-type electronic components are mounted on 2a and 22b, thereby making it possible to configure a more complex circuit.

In the laminated composite component 11 of the above embodiment, a plurality of ceramic green sheets are prepared, and a conductive paste is printed on each ceramic green sheet in the shape necessary to form, for example, the internal electrodes 13a. , obtained by laminating and then integrally firing. Note that the via hole 14a
, 14b, etc., it is sufficient to form through holes in the ceramic green sheet in advance, and embed the conductive paste in the through holes for via holes when printing the conductive paste.

A first external electrode 17 formed on the outer peripheral side surface of the laminate 12
a~17! The second external electrodes 15a to 15g formed on the upper surface 12a and the lower surface 12b can be formed by applying a conductive paste and baking after obtaining the laminate 12 by firing ceramics. However, each of the external electrodes and the like formed on these outer surfaces may also be completed by applying a conductive paste before firing the ceramics, and then baking them by the above-mentioned firing process.

In the above embodiment, the laminate 12 was constructed by laminating a plurality of ceramic green sheets and firing them together, but the laminate in the present invention is made by laminating a plurality of pre-fired ceramic plates with adhesive or the like. It may be configured by pasting them together.

Furthermore, the laminate may be constructed using dielectric or insulating materials other than ceramics.

〔Effect of the invention〕

According to the present invention, wiring of internal electronic component functional elements is performed by also utilizing the second external electrode formed on at least one of the upper surface and the lower surface of the laminate. Therefore, compared to conventional laminated composite parts, it is possible to incorporate a larger number of electronic component functional elements and to configure a more complex electronic circuit. Furthermore, the degree of freedom in designing the electronic circuit can be increased.

Therefore, it is possible to provide a laminated composite component that can accommodate miniaturization and high-density packaging of electronic components. In particular, when the laminate is made large, not only the outer peripheral side surface but also at least one of the top and bottom surfaces of the laminate is used for wiring, so a large number of electronic components and functional elements such as capacitors and resistors are built in. It can be extremely complicated times! A laminated composite part having three configurations can be realized.

[Brief explanation of drawings]

Fig. 1 is a perspective view of a laminated composite part according to an embodiment of the present invention, Fig. 2 is a sectional view taken along the line ■-■ in Fig. 1, and Fig. 3 is a perspective view of a conventional laminated composite part. , FIG. 4 is a plan cross-sectional view of the laminated composite part of FIG. 3. In the figure, 11 is a laminated composite part, 12 is a laminate, 1
3.16 is a capacitor as an electronic component functional element, 14
a, 14b are via holes, 15a to 15g are second external electrodes, 17a to 17j1! indicates the first external electrode.

Claims (1)

[Claims] (1) A laminate in which a plurality of electronic component functional elements are configured; and a plurality of laminates formed on the outer surface of the laminate and electrically connected to any of the internal electronic component functional elements. 1st of
and a plurality of second external electrodes provided on at least one of the upper surface or the lower surface of the laminate and electrically connected to any of the internal electronic component elements, A laminated composite component, wherein at least one of the second external electrodes is electrically connected to an internal electronic component functional element through a via hole.