JP2000269078A - Laminated electronic component - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a laminated electronic component of a structure, which can reduce not only terminal electrode coupling but also capacitive coupling between an internal electrode and coil conductor within a laminate, to thereby reduce shift in design as much as possible. SOLUTION: This electronic component includes a capacitor part Ca, having internal electrodes 9a and 9b stacked within a dielectric material 8 and inductor parts L1 and L2, having coil conductors 4 incorporated in an insulator 8 or a magnetic material 3. A capacitor part C and inductor parts L1 and L2 are alternately and integrally arranged with respect to the direction perpendicular to the stacked layer direction of a laminating step. The electrode faces of the internal electrodes 9a and 9b of the capacitor part C are provided to be perpendicular to the stacking direction, while winding cores S of the coil conductors 4 are provided to be directed to the stacking direction. A terminal electrode 6 for external connection is provided on an outer surface of the dielectric material 8. Terminal electrodes 1 and 2 for external connection are provided on an outer surface of the insulator or the magnetic material 3.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a laminated electronic component comprising an insulator such as a magnetic or dielectric material and a conductor.
In particular, the present invention relates to a multilayer electronic component including an LC filter or an LC array including a multilayer inductor and a multilayer capacitor or a hybrid integrated circuit using these as a substrate.

[0002]

2. Description of the Related Art Laminated electronic components have recently been reduced in set size,
The demand for weight reduction is rapidly increasing. In addition, the demand for high integration, in which many elements are built in at the same time, has become even stronger, and various laminated composite electronic components have been proposed.

As a laminated composite electronic component, an LC filter, an LC array or a hybrid integrated circuit using them as a substrate has been proposed. Conventionally, when an LC filter or an LC array is configured, a vertically integrated structure in which a dielectric layer containing a capacitor electrode is superimposed on a magnetic layer containing a conductor for an inductor. To form the terminal electrode, after forming such a chip with a vertically integrated structure of the capacitor and the inductor, a conductor is applied to the side of the chip in the stacking direction to form a terminal electrode for connection between the inductor and the capacitor or a terminal electrode for external connection. It is formed to realize the circuit function.

However, in such a structure in which the terminal electrodes are formed in the laminating direction, a dielectric layer is interposed between the terminal electrodes, a distributed capacitance is generated between the terminal electrodes, and a characteristic deviation in design is caused. Will cause.

In order to solve such a problem, Japanese Patent Application Laid-Open No. 9-22831 discloses an exploded perspective view shown in FIG. 4A and a perspective view shown in FIG. 4B. . This is because a capacitor portion C in which capacitor internal electrodes 21 and 22 are provided inside a dielectric 20 and a magnetic material 2
The LC filters shown in FIG. 4C are formed by superposing inductor portions L1 and L2 having coil conductors 26 and 27 for inductors inside the layers 4 and 25 in the laminating direction. The input / output terminal electrodes 30, 31 of the inductor and the terminal electrode 32 of the capacitor section (33 are the inductor sections L1, L2
In order to minimize the capacitive coupling via the dielectric 20 between one end of each of the coil conductors 26 and 27 and one of the internal electrodes 21 of the capacitor portion C), these terminal electrodes are used. 30, 31, 32 are formed so as to be aligned in the plane direction of the internal electrodes 21, 22, that is, in the lamination direction of the multilayer inductor portion and the multilayer capacitor portion. Thus, the magnetic material 24 or 25 is interposed between the terminal electrodes 30, 31, and 32, thereby reducing the capacitive coupling.

[0006]

As described above, the terminal electrodes 30, 31, and 32 are provided with the magnetic members 24, 25 therebetween.
That is, if it is configured such that a layer having a low dielectric constant is interposed,
Although the capacitive coupling between the terminal electrodes 30, 31, and 32 can be weakened and the design deviation can be reduced, the internal electrodes 21, 22 of the capacitor portion and the coil conductors 26, 27 face each other inside the laminate. 4C, that is, a capacitive component C generated between the coil conductor 26 and the internal electrode 21 in the equivalent circuit in FIG.
a, and the coupling by the capacitance component Cb generated between the coil conductor 27 and the internal electrode 22 cannot be ignored, and this causes a problem of design deviation.

In view of the above problems, the present invention can reduce not only coupling by terminal electrodes but also capacitive coupling between an internal electrode and a coil conductor inside a laminated body, thereby reducing design deviation as much as possible. An object is to provide a multilayer electronic component.

[0008]

According to a first aspect of the present invention, there is provided a multilayer electronic component comprising: a capacitor portion having a laminated structure in which internal electrodes are formed in a dielectric; and an inductor portion having a coil conductor built in an insulator or a magnetic material. An electronic component, wherein the capacitor portion and the inductor portion are arranged alternately and integrally in a direction perpendicular to a laminating direction in a laminating step, and an electrode surface of an internal electrode of the capacitor portion is perpendicular to a laminating direction. And the winding core of the coil conductor is provided in the direction of the stacking direction, the external connection terminal electrode of the capacitor section is provided on the outer surface of the dielectric, and the external connection terminal electrode of the inductor section is provided on the insulator. Alternatively, it is provided on the outer surface of the magnetic body.

Thus, the capacitor section and the inductor section are arranged integrally in the laminating plane direction in the laminating step.
The electrode surfaces of the internal electrodes of the capacitor section are perpendicular to the laminating direction, and the core of the coil conductor is provided in the direction of the laminating direction, so that the internal electrodes of the capacitor section and the coil conductor of the inductor section are edged. Since the parts face each other, capacitive coupling is reduced. Further, since the external connection terminal electrodes of the capacitor portion and the inductor portion are formed on the outer surface of the dielectric and the outer surface of the insulator or the magnetic material, respectively, the external connection terminal electrodes are capacitively coupled via the dielectric layer. Reduces the degree of bonding. Thus, a multilayer electronic component with reduced design deviation is provided.

According to a second aspect of the present invention, there is provided the multilayer electronic component according to the first aspect, wherein an internal electrode of the capacitor unit and a coil conductor of the inductor unit are connected to each other to form a filter.

According to the present invention, a filter with reduced capacitive coupling according to the first aspect is provided, and a filter with less design deviation is provided.

[0012]

FIG. 1 is a view showing one embodiment of a laminated electronic component according to the present invention. FIG. 1 (A) is an equivalent circuit diagram,
1B is a longitudinal sectional view, FIG. 1C is a plan view, FIG.
(D) is an EE cross-sectional view of FIG. 1 (C). In FIG. 1, L1 and L2 are inductor portions formed by incorporating a coil conductor 4 in a magnetic material 3 such as ferrite by a laminated structure. Note that a low dielectric constant insulator such as forsterite may be used instead of the magnetic body 3. C is a capacitor unit integrally provided between the inductor units L1 and L2 at both ends, and is constituted by providing internal electrodes 9a and 9b facing each other in the dielectric 8. The present invention is particularly effective when a dielectric having a dielectric constant of 100 or more is used as the dielectric 8.

Reference numerals 1 and 2 are input / output terminal electrodes provided at both ends of the laminate as terminal electrodes for external connection. The input / output terminal electrodes 1 and 2 are provided on the outer surface of the magnetic body 3, and the input / output terminal electrodes 1 and 2 are connected to one ends of the coil conductors 4 and 4, respectively. In this example, the terminal electrodes 1 and 2 are provided on the end surface of the chip, but may be provided on at least one of the side surface and the upper and lower surfaces.

Reference numeral 5 denotes an internal electrode connecting terminal electrode for connecting the plurality of internal electrodes 9a, 9a via the lead portion 7a. Reference numeral 6 denotes a ground terminal electrode provided as an external connection terminal electrode connected to the ground of a mounting board or the like. The terminal electrode 6 is connected to the internal electrodes 9b, 9b facing the internal electrode 9a via a lead portion 7c. The capacitor section C
The external connection terminal electrode 6 is provided on the outer surface of the dielectric 8 in the laminating direction. In this example, the external connection terminal electrode 6 is provided on the side surface, but may be provided on any of the upper and lower surfaces.

The input / output terminal electrodes 1 and 2 of the coil conductors 4 and 4
Are connected to the internal electrode 9a via lead portions 7a and 7d, respectively. Instead of this internal connection, the connection between the coil conductors 4 and 4 and the internal electrode 9 are made by the internal electrode connection terminal electrode 5.
a may be connected.

As shown in the figure, the capacitor section C and the inductor sections L1 and L2 are arranged integrally in a direction perpendicular to the laminating direction in the laminating step. The electrode surfaces of the internal electrodes 9a and 9b of the capacitor section C are perpendicular to the laminating direction, and the core S of the coil conductor 4 (see FIG.
(B) is provided in the direction of the lamination direction.

FIG. 2 is a view showing a laminating process for manufacturing one chip by the screen printing method for one chip. First, as shown in FIG. 2A, printing of the magnetic layers 3a and 3b serving as the lower layer of the chip and the ceramic paste serving as the dielectric layer 8a are performed alternately a required number of times. Next, as shown in FIG.
b, and a conductor paste to be the half coils 4a and 4b of the coil conductor 4 is printed. Next, as shown in FIG. 2C, the magnetic layers 3c and 3d covering the other portions except for the tips of the half coils 4a and 4b, and the internal electrodes 9b
Then, printing of a ceramic paste to be a dielectric layer 8b covering the entire lead portion 7c is performed. Next, as shown in FIG. 2 (D), a conductor paste for forming the half coils 4c and 4d of the coil conductor 4 is printed with one end thereof superposed on the exposed portions of the half coils 4a and 4b. Next, as shown in FIG. 2 (E), a ceramic paste for forming the magnetic layers 3e and 3f covering the other portions except for the tips of the partial coils 4c and 4d is printed. Next, as shown in FIG.
One end of the conductor paste that becomes the half coils 4e and 4f of the coil conductor 4 is printed on the exposed portions of the half coils 4c and 4d, and the conductor paste that becomes the internal electrode 9a of the capacitor part C is printed. .

By repeating such a process, the conductor of the uppermost layer is printed by the internal electrode 9a and the inductor portions L1 and L2 as shown in FIG. 2G in the process of FIG. 2E.
The end of each half coil 4g, 4h is drawn out 7a,
This is performed in the pattern connected in 7d. Then, FIG.
(H) As shown in FIG.
g, 3h and printing of the ceramic paste to be the dielectric layer 8c are performed alternately a required number of times. After cutting the material thus laminated into individual chips and sintering them, FIGS. 1 (B) to 1 (C)
As shown in (1), the terminal electrodes 1, 2, 5, and 6 are applied, baked, and plated thereon.

The laminating step as described above includes a sheet laminating method,
Alternatively, it can be performed by a combination of a sheet laminating method and a screen printing method.

As described above, the capacitor section C and the inductor sections L1 and L2 are integrally arranged in a direction perpendicular to the laminating direction in the laminating step, and the electrode surfaces of the internal electrodes 9a and 9b of the capacitor section C are By forming the core S of the coil conductor 4 at right angles to the stacking direction and in the stacking direction, the internal electrodes 9a, 9
Since b and the coil conductors 4 of the inductor portions L1 and L2 face each other at the edges, the facing area decreases, and the capacitive coupling decreases. Also, since the external connection terminal electrodes 1, 2, and 6 of the capacitor section C and the inductor sections L1, L2 are formed on the outer surface of the dielectric 8 and the outer surface of the magnetic body 3, respectively, the external connection terminal electrodes 1, 2 And 6 are coupled to each other via the dielectric 8 by capacitive coupling. Thus, a multilayer electronic component with reduced design deviation is provided.

FIGS. 3A, 3B, and 3C show other embodiments of the laminated electronic component of the present invention drawn corresponding to FIGS. 1A, 1B, and 1C, respectively. FIG. In this example, three inductor portions L1, L2, L3 and two capacitor portions C1, C2 are alternately and integrally arranged in a direction perpendicular to the laminating direction, and these inductor portions L1 to L1 are arranged.
The coil conductor 4 of L3 and one of the internal electrodes 9a of the capacitor portions C1 and C2 are connected at lead portions 7a and 7d, and the external connection terminal electrodes 1, 2 and 6 are made of a magnetic material 3 and a dielectric material, respectively. 8 is provided on the outer surface. In the present embodiment, the same effect as described above can be obtained.

According to the present invention, the coil conductor 4 and the internal electrode 9 are provided.
a is not connected to each other, or is configured as an LC array having a plurality of sets of the LC filter of FIG. 1 in one chip, or a hybrid integrated circuit in which the LC filter or the LC array is a substrate and electronic components are mounted thereon. Can also be applied.

[0023]

According to the first aspect, the capacitor portion and the inductor portion are arranged integrally in a direction perpendicular to the laminating direction in the laminating step, and the electrode surfaces of the internal electrodes of the capacitor portion are arranged in the laminating direction. And the coil conductor of the coil conductor is provided in the direction of the lamination direction, so that the internal electrode of the capacitor portion and the coil conductor of the inductor portion face each other at the edges, so that the facing area is reduced. ,
Capacitive coupling is reduced. Further, since the external connection terminal electrodes of the capacitor section and the inductor section are formed in the laminating direction and on the outer surface of the dielectric and the outer surface of the insulator or the magnetic body, respectively, the external connection terminal electrodes are connected to each other by the dielectric layer. , The degree of coupling by capacitive coupling is reduced. As a result, a multilayer electronic component with reduced design deviation can be provided.

According to the second aspect, it is possible to provide a filter with a reduced design loss.

[Brief description of the drawings]

FIG. 1 is a view showing one embodiment of a laminated electronic component of the present invention, wherein (A) is an equivalent circuit diagram, (B) is a longitudinal sectional view,
(C) is a plan view, and (D) is an EE cross-sectional view of (C).

FIG. 2 is a stacking process diagram of the multilayer electronic component of FIG. 1;

FIG. 3 is a view showing another embodiment of the multilayer electronic component of the present invention, wherein (A), (B) and (C) correspond to (A), (B) and (C) of FIG. It is a corresponding equivalent circuit diagram, longitudinal sectional view, and plan view.

FIGS. 4A, 4B and 4C are an exploded perspective view of a conventional laminated electronic component, a perspective view of a completed product, and an equivalent circuit diagram, respectively.

[Explanation of symbols]

1, 2: Input / output terminal electrode (terminal electrode for external connection), 3:
Magnetic material, 3a to 3h: magnetic material layer, 4: coil conductor, 4a
To 4h: half coil, 5: terminal electrode for internal electrode connection,
6: terminal electrode for grounding (terminal electrode for external connection), 7a to 7
d: lead portion, 8: dielectric, 8a to 8c: dielectric layer,
9a, 9b: internal electrode, C, C1 to C2: capacitor section, L1 to L3: inductor section

 ──────────────────────────────────────────────────続 き Continued on the front page F term (reference) 5E070 AA05 AB01 BA12 CB04 CB13 CC01 EA01 5E082 AA01 AB03 BB01 BC40 CC03 DD08 DD09 EE04 EE35 FG04 FG26 FG46 FG54 GG10 GG26 GG28 LL03

Claims (2)

[Claims] 1. A laminated electronic component comprising: a capacitor portion having a laminated structure in which internal electrodes are formed in a dielectric; and an inductor portion having a coil conductor built in the insulator or the magnetic material. Are integrally and alternately arranged in a direction perpendicular to the laminating direction in the laminating step, the electrode surfaces of the internal electrodes of the capacitor section are perpendicular to the laminating direction, and the core of the coil conductor is laminated. The external connection terminal electrode of the capacitor unit is provided on the outer surface of the dielectric, and the external connection terminal electrode of the inductor unit is provided on the outer surface of the insulator or the magnetic material. Laminated electronic components. 2. The multilayer electronic component according to claim 1, wherein an internal electrode of the capacitor section and a coil conductor of the inductor section are connected to each other to form a filter.