JP2017216401A - Electronic component - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide an electronic component in which magnetic loss occurring around an external terminal is reduced.SOLUTION: The electronic component comprises: an electric element including a coil; a magnetic layer covering at least a part of the electric element; a plurality of external terminals electrically connected to the electric element and embedded in the magnetic layer so as to be partially exposed from one surface of the magnetic layer; and a non-magnetic layer embedded in the magnetic layer. The plurality of external terminals include at least one or more first external terminals, and the first external terminals are surrounded by the non-magnetic layer when viewed from the one surface side of the magnetic layer.SELECTED DRAWING: Figure 2

Description

  The present invention relates to an electronic component.

  Conventionally, as an electronic component, there is one described in JP2013-98259A (Patent Document 1). The electronic component includes an electric element including a coil, a magnetic layer that covers a part of the electric element, and a plurality of external terminals that are electrically connected to the electric element and are embedded so as to be partially exposed from the magnetic layer. Have

JP 2013-98259 A

  By the way, it has been found that there is the following problem when actually using the conventional electronic component. Since the magnetic layer is close to the external terminal, a magnetic loss occurs around the external terminal when energized. Depending on the configuration of the electronic component, it may be desired to reduce such magnetic loss in some external terminals. For example, in an external terminal connected to a capacitor in an electronic component, it is preferable to reduce the magnetic loss in order to reduce parasitic inductance. Further, even in the case of an external terminal connected to a coil, there may be a case where it is desired to reduce the magnetic loss generated around the external terminal in order to adjust the inductance.

  Accordingly, an object of the present invention is to provide an electronic component in which magnetic loss generated around an external terminal is reduced.

In order to solve the above problems, an electronic component according to one aspect of the present invention is provided.
An electrical element including a coil;
A magnetic layer covering at least a part of the electrical element;
A plurality of external terminals electrically connected to the electrical element and embedded in the magnetic layer such that a part is exposed from one surface of the magnetic layer;
A nonmagnetic layer embedded in the magnetic layer,
The plurality of external terminals include at least one first external terminal,
The first external terminal is surrounded by the nonmagnetic layer when viewed from one surface side of the magnetic layer.

  According to the electronic component, magnetic loss that occurs around the first external terminal can be reduced.

  In one embodiment of the electronic component, the nonmagnetic layer is in contact with the first external terminal.

  According to the embodiment, the magnetic loss generated around the first external terminal can be further reduced.

  In one embodiment of the electronic component, the nonmagnetic layer surrounds the entire outer periphery of the first external terminal when viewed from one surface side of the magnetic layer.

  According to the embodiment, the magnetic loss generated around the first external terminal can be further reduced.

  In one embodiment of the electronic component, the nonmagnetic layer is embedded so as to penetrate from one surface side of the magnetic layer to the other surface side on the opposite side.

  According to the embodiment, the magnetic loss generated around the first external terminal can be further reduced.

In one embodiment of the electronic component,
The electrical element includes a capacitor,
The first external terminal is connected to the capacitor.

  According to the embodiment, the parasitic inductance of the capacitor can be reduced and the capacitor characteristics can be improved.

  In one embodiment of the electronic component, the first external terminal connected to the capacitor is connected to the ground.

  According to the embodiment, magnetic loss due to impedance generated in the path between the capacitor and the ground can be reduced.

In one embodiment of the electronic component,
It comprises a plurality of insulating layers laminated on the other surface opposite to one surface of the magnetic layer, further comprising an insulator in which the electric element is embedded,
The coil includes a conductor layer wound on the insulating layer.

  According to the embodiment, the conductor layer can reduce the size and height.

  In one embodiment of the electronic component, as viewed from one surface side of the magnetic layer, the two conductor layers are wound on the same insulating layer, and the nonmagnetic layer is formed of the two conductor layers. It is arranged to divide the gap.

  According to the embodiment, the magnetic path can be divided between the two coils in the magnetic layer, and the isolation between the coils can be improved.

  According to the electronic component of the present invention, the magnetic loss generated around the first external terminal can be reduced.

It is sectional drawing which shows 1st Embodiment of an electronic component. It is the perspective view seen from the bottom face side of an electronic component. It is an equivalent circuit diagram of an electronic component. It is a top view of the 1st spiral wiring of the 1st coil, and the 1st spiral wiring of the 2nd coil. It is a top view of the 2nd spiral wiring of the 1st coil, and the 2nd spiral wiring of the 2nd coil. It is a top view of the 3rd spiral wiring of the 1st coil, and the 3rd spiral wiring of the 2nd coil. It is a top view of the 4th spiral wiring of the 1st coil, and the 4th spiral wiring of the 2nd coil. It is a top view of the 1st electrode plate of a capacitor. It is a top view between the 1st electrode plate and 2nd electrode plate of a capacitor | condenser. It is a top view of the 2nd electrode plate of a capacitor. It is the perspective view seen from the bottom face side which shows 2nd Embodiment of an electronic component.

  Hereinafter, an electronic component which is one embodiment of the present invention will be described in detail with reference to embodiments shown in the drawings.

(First embodiment)
FIG. 1 is a cross-sectional view showing a first embodiment of an electronic component. FIG. 2 is a perspective view of the electronic component viewed from the bottom. FIG. 3 is an equivalent circuit diagram of the electronic component.

  As shown in FIGS. 1, 2, and 3, the electronic component 10 is an LC composite electronic component that includes a first coil 1, a second coil 2, and a capacitor 3. The electronic component 10 is mounted on an electronic device such as a personal computer, a DVD player, a digital camera, a TV, a mobile phone, or a car electronics. The electronic component 10 is used as an LC filter such as a low-pass filter, a high-pass filter, a band-pass filter, or a trap filter.

  The electronic component 10 includes an insulator 5 in which the first and second coils 1 and 2 and the capacitor 3 are embedded, and a magnetic layer 6 provided on one surface of the insulator 5. Since the magnetic layer 6 covers part of the first and second coils 1 and 2, an inductance (L value) can be secured.

  The surface of the magnetic layer 6 opposite to the first and second coils 1 and 2 is a mounting surface mounted on the mounting substrate. The stacking direction of the magnetic layer 6 and the insulator 5 is the Z direction, and the mounting surface of the magnetic layer 6 is the bottom surface (lower surface). The electronic component 10 is formed in a rectangular parallelepiped, and in a plane orthogonal to the Z direction, one side direction is an X direction and the other side direction is a Y direction.

  A first external terminal 4a, a second external terminal 4b, a third external terminal 4c, a fourth external terminal 4d, and a fifth external terminal 4e are embedded on one surface of the magnetic layer 6. A part of the first to fifth external terminals 4 a to 4 e is exposed from one surface of the magnetic layer 6. The exposed portions of the first to fifth external terminals 4a to 4e are connected to the electrodes of the mounting substrate. In this embodiment, one surface of the magnetic layer 6 corresponds to the bottom surface opposite to the first and second coils 1 and 2. Note that one surface of the magnetic layer 6 may be a surface other than the bottom surface.

  As viewed from the Z direction, the first external terminal 4 a is disposed at the center of the rectangular bottom surface of the magnetic layer 6, and the second to fifth external terminals 4 b to 4 e are disposed at the four corners of the rectangular bottom surface of the magnetic layer 6. Yes.

  The first coil 1 and the second coil 2 are arranged in parallel in the X direction when viewed from the bottom surface (one surface) side of the magnetic layer 6, that is, when viewed from the Z direction. The capacitor 3 is disposed in the Z direction (upper side) of the first and second coils 1 and 2.

  As viewed from the Z direction, the second external terminal 4 b and the third external terminal 4 c are disposed on both sides of the first coil 1 in the Y direction. The fourth external terminal 4d and the fifth external terminal 4e are disposed on both sides of the second coil 2 in the Y direction. The first external terminal 4 a is disposed between the first coil 1 and the second coil 2. In FIG. 2, the position of the 1st coil 1 and the 2nd coil 2 when it sees from upper direction is shown with a dashed-two dotted line.

  One end of the first coil 1 is connected to the second external terminal 4b, and the other end of the first coil 1 is connected to the third external terminal 4c. For example, the second external terminal 4 b becomes an input terminal to the first coil 1, and the third external terminal 4 c becomes an output terminal from the first coil 1.

  One end of the second coil 2 is connected to the fourth external terminal 4d, and the other end of the second coil 2 is connected to the fifth external terminal 4e. For example, the fourth external terminal 4 d is an input terminal to the second coil 2, and the fifth external terminal 4 e is an output terminal from the second coil 2.

  As shown in FIG. 3, the other end of the first coil 1 and the other end of the second coil 2 are also connected to one end of a capacitor 3. The other end of the capacitor 3 is connected to the first external terminal 4a. The first external terminal 4a is connected to the ground. The first external terminal 4a is connected between the capacitor 3 and the ground.

  As shown in FIG. 2, a nonmagnetic layer 7 is embedded in the magnetic layer 6 so as to surround the entire outer periphery of the first external terminal 4 a when viewed from the bottom surface side of the magnetic layer 6. The nonmagnetic layer 7 is in contact with the first external terminal 4 a and is embedded so as to penetrate from one surface side of the magnetic layer 6 to the other surface side on the opposite side. The nonmagnetic layer 7 may surround at least a part of the periphery of the first external terminal 4a when viewed from the bottom surface side of the magnetic layer 6, and the nonmagnetic layer 7 is separated from the first external terminal 4a. You may make it not touch.

  According to the electronic component 10, the first external terminal 4 a is embedded so as to be partially exposed on one surface (bottom surface) of the magnetic layer 6, and the nonmagnetic layer 7 is first as viewed from the one surface side of the magnetic layer 6. It is embedded in the magnetic layer 6 so as to surround the periphery of the external terminal 4a. Accordingly, since the nonmagnetic layer 7 having a low magnetic loss is arranged around the first external terminal 4a, the magnetic flux passing through the magnetic layer 6 is reduced, so that the magnetic loss generated around the first external terminal 4a is reduced. Can be reduced.

  Further, since the nonmagnetic layer 7 is in contact with the first external terminal 4a, magnetic loss generated around the first external terminal 4a can be further reduced.

  Further, since the nonmagnetic layer 7 surrounds the entire outer periphery of the first external terminal 4a, magnetic loss generated around the first external terminal 4a can be further reduced. In addition, since the nonmagnetic layer 7 is embedded so as to penetrate from one surface side of the magnetic layer 6 to the other surface side on the opposite side, the magnetic loss generated around the first external terminal 4a can be further reduced.

  Moreover, since the 1st external terminal 4a is connected to the capacitor | condenser 3, the parasitic inductance of the capacitor | condenser 3 can be reduced and a capacitor | condenser characteristic can be improved.

  Further, since the first external terminal 4a is connected to the ground, it is possible to reduce the magnetic loss due to the impedance generated in the path between the capacitor 3 and the ground.

  Hereinafter, the configuration of the electronic component 10 will be described in detail.

  As shown in FIGS. 1 and 4A to 4D, the first coil 1 includes a first spiral wiring 11, a second spiral wiring 12, a third spiral wiring 13, and a fourth spiral wiring, which are stacked in order from the lower layer to the upper layer. 14 and the like. The insulator 5 is composed of a plurality of insulating layers. The first to fourth spiral wirings 11 to 14 are conductor layers wound on each insulating layer of the insulator 5.

  The outer peripheral end of the first spiral wiring 11 is connected to the first terminal 8a. The first spiral wiring 11 is turned clockwise from the outer peripheral end toward the inner peripheral end. The inner peripheral end of the first spiral wiring 11 is connected to the inner peripheral end of the second spiral wiring 12 through a via conductor. The second spiral wiring 12 is turned clockwise from the inner peripheral end toward the outer peripheral end. The outer peripheral end of the second spiral wiring 12 is connected to the outer peripheral end of the third spiral wiring 13 through a via conductor. The third spiral wiring 13 is turned clockwise from the outer peripheral end toward the inner peripheral end. The inner peripheral end of the third spiral wiring 13 is connected to the inner peripheral end of the fourth spiral wiring 14 through a via conductor. The fourth spiral wiring 14 is turned clockwise from the inner peripheral end toward the outer peripheral end. The outer peripheral end of the fourth spiral wiring 14 is connected to the second terminal 8b through a via conductor.

  The second coil 2 includes a first spiral wiring 21, a second spiral wiring 22, a third spiral wiring 23, and a fourth spiral wiring 24 that are stacked in order from the lower layer to the upper layer. The first to fourth spiral wirings 21 to 24 are conductor layers wound on each insulating layer of the insulator 5.

  The outer peripheral end of the first spiral wiring 21 is connected to the third terminal 8c. The first spiral wiring 21 is turned counterclockwise from the outer peripheral end toward the inner peripheral end. The inner peripheral end of the first spiral wiring 21 is connected to the inner peripheral end of the second spiral wiring 22 through a via conductor. The second spiral wiring 22 is turned counterclockwise from the inner peripheral end toward the outer peripheral end. The outer peripheral end of the second spiral wiring 22 is connected to the outer peripheral end of the third spiral wiring 23 through a via conductor. The third spiral wiring 23 is turned counterclockwise from the outer peripheral end toward the inner peripheral end. The inner peripheral end of the third spiral wiring 23 is connected to the inner peripheral end of the fourth spiral wiring 24 through a via conductor. The fourth spiral wiring 24 is turned counterclockwise from the inner peripheral end toward the outer peripheral end. The outer peripheral end of the fourth spiral wiring 24 is connected to the fourth terminal 8d.

  The first to fourth spiral wires 11 to 14 of the first coil 1 are arranged concentrically. The first to fourth spiral wires 21 to 24 of the second coil 2 are arranged concentrically. The axis of the first coil 1 and the axis of the second coil 2 are orthogonal to one surface (bottom surface) of the magnetic layer 6. The axis of the first coil 1 and the axis of the second coil 2 are arranged in parallel.

  As shown in FIG. 1 and FIGS. 5A to 5C, the capacitor 3 includes a first electrode plate 3 a and a second electrode plate 3 b that are stacked in order from the lower layer to the upper layer. Each insulating layer of the insulator 5 and the first and second electrode plates 3a and 3b are alternately stacked. The second electrode plate 3b has two plates and is connected to the second terminal 8b and the fourth terminal 8d, respectively. The first electrode plate 3a is connected to the fifth terminal 8e.

  The first to fifth terminals 8 a to 8 e extend in the stacking direction and are embedded in the insulator 5. As viewed from the Z direction, the first terminal 8a overlaps the second external terminal 4b and is connected to the second external terminal 4b. The second terminal 8b overlaps with the third external terminal 4c and is connected to the third external terminal 4c. The third terminal 8c overlaps the fourth external terminal 4d and is connected to the fourth external terminal 4d. The fourth terminal 8d overlaps with the fifth external terminal 4e and is connected to the fifth external terminal 4e. The fifth terminal 8e overlaps the first external terminal 4a and is connected to the first external terminal 4a.

  The first and second coils 1 and 2, the capacitor 3, the first to fifth terminals 8 a to 8 e and the first to fifth external terminals 4 a to 4 e are, for example, conductive materials such as Ag, Ag—Pd, Cu, and Ni. Consists of materials. The first and second coils 1 and 2, the capacitor 3, the first to fifth terminals 8 a to 8 e and the first to fifth external terminals 4 a to 4 e are formed by patterning a metal layer into a predetermined shape, for example. It is formed. As a method for forming the metal layer, coating, plating, a thin film method, or the like can be used. As a method for patterning the metal layer, an additive method such as a screen mask or a photomask, a subtractive method, or the like can be used.

  The insulator 5 has insulating properties, and is made of, for example, a resin material such as polyimide, a glass material, glass ceramics, or the like. The nonmagnetic layer 7 is nonmagnetic and is made of, for example, a resin material such as polyimide, a glass material, glass ceramics, or the like.

  The magnetic layer 6 has magnetism and is made of, for example, a magnetic material such as ferrite. Preferably, the magnetic layer 6 contains metal magnetic powder, and thereby the characteristics (inductance value, DC superposition characteristics, etc.) of the electronic component 10 can be improved.

  The manufacturing method of the electronic component 10 will be described. On the magnetic layer 6, the first and second coils 1 and 2 and the first to fifth terminals 8a to 8e are patterned and formed on each layer of the insulator 5 as described above. Are laminated. Thereafter, the capacitor 3 and the insulator 5 are laminated and formed on the upper portion.

  Then, holes are made from the lower surface (bottom surface) of the magnetic layer 6 toward the first to fifth terminals 8a to 8e using blast, laser, or the like. The side surface of the hole is formed in a tapered shape so that the lower surface side of the magnetic layer 6 expands.

  Thereafter, the second to fifth external terminals 4b to 4e are embedded in the holes corresponding to the first to fourth terminals 8a to 8d by screen printing or the like. Further, the nonmagnetic layer 7 is formed on the side surface of the hole corresponding to the fifth terminal 8 e by printing or the like, and the first external terminal 4 a is embedded in the center of the nonmagnetic layer 7. In addition, you may make it form the 1st-5th external terminals 4a-4e along the side surface of a hole using plating etc.

(Second Embodiment)
FIG. 6 is a perspective view seen from the bottom showing a second embodiment of the electronic component of the present invention. The second embodiment is different from the first embodiment in the configuration of the nonmagnetic layer. This different configuration will be described below.

  As shown in FIG. 6, in the electronic component 10 </ b> A, the nonmagnetic layer 7 includes two first and second coils 1 and 2 (first to fourth spirals) in the magnetic layer 6 when viewed from one surface side of the magnetic layer 6. The wirings 11 to 14 and 21 to 24) are arranged so as to be divided. The nonmagnetic layer 7 extends from one end surface of the magnetic layer 6 in the Y direction to the other end surface. The nonmagnetic layer 7 surrounds the entire periphery of the first external terminal 4a, as in the first embodiment.

  At this time, as a method of forming the nonmagnetic layer 7, a groove is formed using a dicer or the like so as to extend from one end surface of the magnetic layer 6 to the other end surface in the Y direction. Thereafter, the nonmagnetic layer 7 is embedded in the concave groove. A hole is formed in the central portion of the nonmagnetic layer 7 using a laser or the like, and the first external terminal 4a is embedded in the hole.

  Therefore, the nonmagnetic layer 7 is disposed between the two first and second coils 1 and 2 so as to divide the two first and second coils 1 and 2. 7 can divide the magnetic path between the two first and second coils 1 and 2, and can improve the isolation of each LC filter.

  The present invention is not limited to the above-described embodiment, and the design can be changed without departing from the gist of the present invention. For example, the feature points of the first and second embodiments may be variously combined.

  In the embodiment, the coil and the capacitor are provided, but a resistor, another coil, or the like may be provided instead of the capacitor. Alternatively, the capacitor may be omitted and only the coil may be provided.

  In the embodiment, the nonmagnetic layer surrounds the entire outer periphery of the first external terminal. However, the nonmagnetic layer may surround at least a part of the outer periphery of the first external terminal. The nonmagnetic layer may be provided intermittently along the periphery of the first external terminal.

  In the embodiment, the nonmagnetic layer is in contact with the first external terminal. However, the nonmagnetic layer may be separated from the first external terminal and not in contact with the first external terminal. Further, the nonmagnetic layer is embedded so as to penetrate from one surface side of the magnetic layer to the other surface side, but may be embedded only in a part of the magnetic layer.

  In the embodiment, two coils are provided, but one or three or more coils may be provided.

  In the embodiment, one coil is composed of four layers of spiral wiring, but the number of spiral wirings may be increased or decreased. The coil may have a helical configuration instead of a spiral configuration.

  In the embodiment, the first external terminal connected to the ground is surrounded by the nonmagnetic layer. However, the second and fourth external terminals serving as the input terminals and the third and fifth external terminals serving as the output terminals are not used. You may make it surround with a magnetic layer. At this time, the inductance can be adjusted by reducing the magnetic loss. In addition, the DC superimposition characteristics can be improved.

  In the embodiment, the first to fifth external terminals are embedded in the magnetic layer or the nonmagnetic layer. However, coating, plating, or thin film is formed on a portion exposed from the magnetic layer of the embedded portion. A configuration in which a film-like conductor layer is further formed by a method or the like may be used.

DESCRIPTION OF SYMBOLS 1 1st coil 11 1st spiral wiring 12 2nd spiral wiring 13 3rd spiral wiring 14 4th spiral wiring 2 2nd coil 21 1st spiral wiring 22 2nd spiral wiring 23 3rd spiral wiring 24 4th spiral wiring 3 Capacitor 3a 1st electrode plate 3b 2nd electrode plate 4a 1st external terminal 4b 2nd external terminal 4c 3rd external terminal 4d 4th external terminal 4e 5th external terminal 5 Insulator 6 Magnetic layer 7 Nonmagnetic layer 8a 1st terminal 8b Second terminal 8c Third terminal 8d Fourth terminal 8e Fifth terminal 10, 10A Electronic component

Claims (8)

An electrical element including a coil;
A magnetic layer covering at least a part of the electrical element;
A plurality of external terminals electrically connected to the electrical element and embedded in the magnetic layer such that a part is exposed from one surface of the magnetic layer;
A nonmagnetic layer embedded in the magnetic layer,
The plurality of external terminals include at least one first external terminal,
The first external terminal is an electronic component surrounded by the nonmagnetic layer when viewed from one surface side of the magnetic layer.   The electronic component according to claim 1, wherein the nonmagnetic layer is in contact with the first external terminal.   The electronic component according to claim 1, wherein the nonmagnetic layer surrounds the entire outer periphery of the first external terminal when viewed from one surface side of the magnetic layer.   4. The electronic component according to claim 1, wherein the nonmagnetic layer is embedded so as to penetrate from one surface side of the magnetic layer to the other surface side opposite to the magnetic layer. 5. The electrical element includes a capacitor,
5. The electronic component according to claim 1, wherein the first external terminal is connected to the capacitor. 6.   The electronic component according to claim 5, wherein the first external terminal connected to the capacitor is connected to a ground. It comprises a plurality of insulating layers laminated on the other surface opposite to one surface of the magnetic layer, further comprising an insulator in which the electric element is embedded,
The electronic component according to claim 1, wherein the coil includes a conductor layer wound on the insulating layer.   When viewed from one surface side of the magnetic layer, the two conductor layers are wound on the same insulating layer, and the nonmagnetic layer is disposed so as to divide the two conductor layers. The electronic component according to claim 7.

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