JPH0464795B2 - - Google Patents
Info
- Publication number
- JPH0464795B2 JPH0464795B2 JP4657984A JP4657984A JPH0464795B2 JP H0464795 B2 JPH0464795 B2 JP H0464795B2 JP 4657984 A JP4657984 A JP 4657984A JP 4657984 A JP4657984 A JP 4657984A JP H0464795 B2 JPH0464795 B2 JP H0464795B2
- Authority
- JP
- Japan
- Prior art keywords
- bonding
- diffusion
- deposited layer
- present
- heat
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000000463 material Substances 0.000 claims description 35
- 238000000034 method Methods 0.000 claims description 27
- 238000009792 diffusion process Methods 0.000 claims description 24
- 229910000838 Al alloy Inorganic materials 0.000 claims description 22
- 238000010438 heat treatment Methods 0.000 claims description 17
- 229910000601 superalloy Inorganic materials 0.000 claims description 16
- 238000005304 joining Methods 0.000 claims description 13
- 229910052710 silicon Inorganic materials 0.000 claims description 4
- 229910052802 copper Inorganic materials 0.000 claims description 3
- 229910052732 germanium Inorganic materials 0.000 claims description 3
- 229910052738 indium Inorganic materials 0.000 claims description 3
- 229910052746 lanthanum Inorganic materials 0.000 claims description 3
- 229910052763 palladium Inorganic materials 0.000 claims description 3
- 239000012071 phase Substances 0.000 description 15
- 230000008018 melting Effects 0.000 description 11
- 238000002844 melting Methods 0.000 description 11
- 229910000943 NiAl Inorganic materials 0.000 description 6
- 230000015572 biosynthetic process Effects 0.000 description 6
- NPXOKRUENSOPAO-UHFFFAOYSA-N Raney nickel Chemical compound [Al].[Ni] NPXOKRUENSOPAO-UHFFFAOYSA-N 0.000 description 5
- 230000000694 effects Effects 0.000 description 5
- 229910052751 metal Inorganic materials 0.000 description 5
- 239000002184 metal Substances 0.000 description 5
- 230000003647 oxidation Effects 0.000 description 5
- 238000007254 oxidation reaction Methods 0.000 description 5
- 238000007740 vapor deposition Methods 0.000 description 5
- 229910052782 aluminium Inorganic materials 0.000 description 4
- 229910052684 Cerium Inorganic materials 0.000 description 3
- 229910045601 alloy Inorganic materials 0.000 description 3
- 230000008901 benefit Effects 0.000 description 3
- 230000008569 process Effects 0.000 description 3
- 239000000956 alloy Substances 0.000 description 2
- 239000010953 base metal Substances 0.000 description 2
- 239000000919 ceramic Substances 0.000 description 2
- 150000001875 compounds Chemical class 0.000 description 2
- 238000011109 contamination Methods 0.000 description 2
- 230000007246 mechanism Effects 0.000 description 2
- 239000000155 melt Substances 0.000 description 2
- 230000001681 protective effect Effects 0.000 description 2
- 238000005728 strengthening Methods 0.000 description 2
- 229910052714 tellurium Inorganic materials 0.000 description 2
- -1 NiAl compound Chemical class 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 238000004140 cleaning Methods 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- 230000005496 eutectics Effects 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 239000007791 liquid phase Substances 0.000 description 1
- 229910021645 metal ion Inorganic materials 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 238000001000 micrograph Methods 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 150000004767 nitrides Chemical class 0.000 description 1
- 239000005416 organic matter Substances 0.000 description 1
- 238000001556 precipitation Methods 0.000 description 1
- 238000001179 sorption measurement Methods 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/001—Interlayers, transition pieces for metallurgical bonding of workpieces
- B23K35/004—Interlayers, transition pieces for metallurgical bonding of workpieces at least one of the workpieces being of a metal of the iron group
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K20/00—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating
- B23K20/22—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating taking account of the properties of the materials to be welded
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K20/00—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating
- B23K20/24—Preliminary treatment
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Pressure Welding/Diffusion-Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4657984A JPS60191679A (ja) | 1984-03-13 | 1984-03-13 | 耐熱超合金の拡散接合方法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4657984A JPS60191679A (ja) | 1984-03-13 | 1984-03-13 | 耐熱超合金の拡散接合方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS60191679A JPS60191679A (ja) | 1985-09-30 |
| JPH0464795B2 true JPH0464795B2 (fr) | 1992-10-16 |
Family
ID=12751209
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP4657984A Granted JPS60191679A (ja) | 1984-03-13 | 1984-03-13 | 耐熱超合金の拡散接合方法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS60191679A (fr) |
Families Citing this family (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4875619A (en) * | 1988-09-01 | 1989-10-24 | Anderson Jeffrey J | Brazing of ink jet print head components using thin layers of braze material |
| JP4905766B2 (ja) * | 2005-10-11 | 2012-03-28 | 日産自動車株式会社 | 抵抗溶接による異種金属の接合方法及び接合構造 |
| JP5367842B2 (ja) * | 2009-12-11 | 2013-12-11 | パイオニア株式会社 | 半導体基板の接合方法およびｍｅｍｓデバイス |
| US8592285B2 (en) | 2009-12-11 | 2013-11-26 | Pioneer Corporation | Method of bonding semiconductor substrate and MEMS device |
| WO2011070625A1 (fr) * | 2009-12-11 | 2011-06-16 | パイオニア株式会社 | Procédé de collage de substrats semiconducteurs et dispositif mems |
| CN101983819B (zh) * | 2010-11-04 | 2013-05-22 | 西安航空动力股份有限公司 | 一种高温合金与白铜焊接的方法及其夹具 |
| CN104093519A (zh) * | 2011-11-02 | 2014-10-08 | 株式会社Uacj | 铝合金包层材料的制造方法 |
-
1984
- 1984-03-13 JP JP4657984A patent/JPS60191679A/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS60191679A (ja) | 1985-09-30 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| EXPY | Cancellation because of completion of term |