JPH0464464B2 - - Google Patents

Info

Publication number
JPH0464464B2
JPH0464464B2 JP60077370A JP7737085A JPH0464464B2 JP H0464464 B2 JPH0464464 B2 JP H0464464B2 JP 60077370 A JP60077370 A JP 60077370A JP 7737085 A JP7737085 A JP 7737085A JP H0464464 B2 JPH0464464 B2 JP H0464464B2
Authority
JP
Japan
Prior art keywords
bonding
pad
pad hole
wiring
hole
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP60077370A
Other languages
English (en)
Japanese (ja)
Other versions
JPS61234555A (ja
Inventor
Yoichi Obara
Takahiro Oka
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Oki Electric Industry Co Ltd
Original Assignee
Oki Electric Industry Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Oki Electric Industry Co Ltd filed Critical Oki Electric Industry Co Ltd
Priority to JP60077370A priority Critical patent/JPS61234555A/ja
Publication of JPS61234555A publication Critical patent/JPS61234555A/ja
Publication of JPH0464464B2 publication Critical patent/JPH0464464B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/544—Marks applied to semiconductor devices or parts, e.g. registration marks, alignment structures, wafer maps
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2223/00—Details relating to semiconductor or other solid state devices covered by the group H01L23/00
    • H01L2223/544—Marks applied to semiconductor devices or parts
    • H01L2223/54473—Marks applied to semiconductor devices or parts for use after dicing
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/12—Structure, shape, material or disposition of the bump connectors prior to the connecting process
    • H01L2224/13—Structure, shape, material or disposition of the bump connectors prior to the connecting process of an individual bump connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/12—Structure, shape, material or disposition of the bump connectors prior to the connecting process
    • H01L2224/13—Structure, shape, material or disposition of the bump connectors prior to the connecting process of an individual bump connector
    • H01L2224/13001—Core members of the bump connector
    • H01L2224/13099—Material
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01079—Gold [Au]

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Wire Bonding (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
JP60077370A 1985-04-11 1985-04-11 半導体装置 Granted JPS61234555A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP60077370A JPS61234555A (ja) 1985-04-11 1985-04-11 半導体装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP60077370A JPS61234555A (ja) 1985-04-11 1985-04-11 半導体装置

Publications (2)

Publication Number Publication Date
JPS61234555A JPS61234555A (ja) 1986-10-18
JPH0464464B2 true JPH0464464B2 (enrdf_load_html_response) 1992-10-15

Family

ID=13632008

Family Applications (1)

Application Number Title Priority Date Filing Date
JP60077370A Granted JPS61234555A (ja) 1985-04-11 1985-04-11 半導体装置

Country Status (1)

Country Link
JP (1) JPS61234555A (enrdf_load_html_response)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0834226B2 (ja) * 1988-12-17 1996-03-29 日本電気株式会社 半導体集積回路装置
JP2901446B2 (ja) * 1992-01-08 1999-06-07 日本電気株式会社 駆動用半導体素子内蔵型蛍光表示パネル
JPH0851113A (ja) * 1994-08-05 1996-02-20 Sony Corp 半導体集積回路とその製造方法

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5218096B2 (enrdf_load_html_response) * 1973-04-18 1977-05-19

Also Published As

Publication number Publication date
JPS61234555A (ja) 1986-10-18

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Legal Events

Date Code Title Description
EXPY Cancellation because of completion of term