JPH0462466B2 - - Google Patents

Info

Publication number
JPH0462466B2
JPH0462466B2 JP59177798A JP17779884A JPH0462466B2 JP H0462466 B2 JPH0462466 B2 JP H0462466B2 JP 59177798 A JP59177798 A JP 59177798A JP 17779884 A JP17779884 A JP 17779884A JP H0462466 B2 JPH0462466 B2 JP H0462466B2
Authority
JP
Japan
Prior art keywords
drive circuit
capacitance
circuit section
bonding pad
light receiving
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP59177798A
Other languages
English (en)
Japanese (ja)
Other versions
JPS6155959A (ja
Inventor
Takashi Ozawa
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujifilm Business Innovation Corp
Original Assignee
Fuji Xerox Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fuji Xerox Co Ltd filed Critical Fuji Xerox Co Ltd
Priority to JP59177798A priority Critical patent/JPS6155959A/ja
Publication of JPS6155959A publication Critical patent/JPS6155959A/ja
Publication of JPH0462466B2 publication Critical patent/JPH0462466B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/02—Bonding areas ; Manufacturing methods related thereto
    • H01L24/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
    • H01L24/06—Structure, shape, material or disposition of the bonding areas prior to the connecting process of a plurality of bonding areas
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F39/00—Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
    • H10F39/10—Integrated devices
    • H10F39/12—Image sensors
    • H10F39/191—Photoconductor image sensors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/02—Bonding areas; Manufacturing methods related thereto
    • H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
    • H01L2224/05—Structure, shape, material or disposition of the bonding areas prior to the connecting process of an individual bonding area
    • H01L2224/0554—External layer
    • H01L2224/0555—Shape
    • H01L2224/05552—Shape in top view
    • H01L2224/05554—Shape in top view being square
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
    • H01L2224/491—Disposition
    • H01L2224/4912—Layout
    • H01L2224/49175—Parallel arrangements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01014—Silicon [Si]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01074—Tungsten [W]

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Solid State Image Pick-Up Elements (AREA)
  • Facsimile Heads (AREA)
  • Wire Bonding (AREA)
JP59177798A 1984-08-27 1984-08-27 原稿読み取り装置 Granted JPS6155959A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP59177798A JPS6155959A (ja) 1984-08-27 1984-08-27 原稿読み取り装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP59177798A JPS6155959A (ja) 1984-08-27 1984-08-27 原稿読み取り装置

Publications (2)

Publication Number Publication Date
JPS6155959A JPS6155959A (ja) 1986-03-20
JPH0462466B2 true JPH0462466B2 (enrdf_load_stackoverflow) 1992-10-06

Family

ID=16037271

Family Applications (1)

Application Number Title Priority Date Filing Date
JP59177798A Granted JPS6155959A (ja) 1984-08-27 1984-08-27 原稿読み取り装置

Country Status (1)

Country Link
JP (1) JPS6155959A (enrdf_load_stackoverflow)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62276871A (ja) * 1986-05-24 1987-12-01 Kyocera Corp 読取り装置
JP4635191B2 (ja) 2003-10-21 2011-02-16 国立大学法人静岡大学 超解像画素電極の配置構造及び信号処理方法

Also Published As

Publication number Publication date
JPS6155959A (ja) 1986-03-20

Similar Documents

Publication Publication Date Title
JP4144892B2 (ja) 光電変換装置及び撮像装置
US4360732A (en) Infrared charge transfer device (CTD) system
JPS6156912B2 (enrdf_load_stackoverflow)
JPS6313348B2 (enrdf_load_stackoverflow)
EP0498664B1 (en) Solid-state imaging device
JPH0462466B2 (enrdf_load_stackoverflow)
KR940006933B1 (ko) 콘택 영상 센서
JP4633991B2 (ja) 信号読出回路
JPH0328871B2 (enrdf_load_stackoverflow)
JPH023551B2 (enrdf_load_stackoverflow)
JPH0748786B2 (ja) イメージセンサ
JPH0546137B2 (enrdf_load_stackoverflow)
EP0233020B1 (en) Switch array apparatus for use in a photoelectric conversion device
JP2591346B2 (ja) 画像読取装置
US6455909B1 (en) Image sensor
JPS58195373A (ja) 固体光電変換装置
JPS60248063A (ja) 密着型イメ−ジセンサ
JP3279094B2 (ja) イメージセンサ
JPS61231754A (ja) 混成集積化一次元光センサ
JPH0624234B2 (ja) １次元光電変換装置
JPH05227363A (ja) イメージセンサ及びその読み取り方法及び画像読取装置
JPH0645580A (ja) イメージセンサ
JPH06105069A (ja) 画像読取方法及びその装置
JPS59140766A (ja) 原稿読取装置
JP2803825B2 (ja) イメージセンサの駆動方法