JPH046208Y2 - - Google Patents

Info

Publication number
JPH046208Y2
JPH046208Y2 JP1982003411U JP341182U JPH046208Y2 JP H046208 Y2 JPH046208 Y2 JP H046208Y2 JP 1982003411 U JP1982003411 U JP 1982003411U JP 341182 U JP341182 U JP 341182U JP H046208 Y2 JPH046208 Y2 JP H046208Y2
Authority
JP
Japan
Prior art keywords
semiconductor element
bonding
element mounting
heating
circuit board
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP1982003411U
Other languages
English (en)
Japanese (ja)
Other versions
JPS58122450U (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1982003411U priority Critical patent/JPS58122450U/ja
Publication of JPS58122450U publication Critical patent/JPS58122450U/ja
Application granted granted Critical
Publication of JPH046208Y2 publication Critical patent/JPH046208Y2/ja
Granted legal-status Critical Current

Links

Classifications

    • H10W72/701—

Landscapes

  • Wire Bonding (AREA)
JP1982003411U 1982-01-14 1982-01-14 半導体素子搭載台 Granted JPS58122450U (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1982003411U JPS58122450U (ja) 1982-01-14 1982-01-14 半導体素子搭載台

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1982003411U JPS58122450U (ja) 1982-01-14 1982-01-14 半導体素子搭載台

Publications (2)

Publication Number Publication Date
JPS58122450U JPS58122450U (ja) 1983-08-20
JPH046208Y2 true JPH046208Y2 (esLanguage) 1992-02-20

Family

ID=30016351

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1982003411U Granted JPS58122450U (ja) 1982-01-14 1982-01-14 半導体素子搭載台

Country Status (1)

Country Link
JP (1) JPS58122450U (esLanguage)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0666361B2 (ja) * 1985-10-23 1994-08-24 松下電器産業株式会社 ボンディング装置及びボンディング方法

Also Published As

Publication number Publication date
JPS58122450U (ja) 1983-08-20

Similar Documents

Publication Publication Date Title
KR960028730A (ko) 반도체장치 및 그실장방법
JPH02192876A (ja) ヒーター装置および部材の接合方法
JPH046208Y2 (esLanguage)
JP2009164400A (ja) ヒータチップ及び接合装置及び接合方法
JPH0531231U (ja) ワイヤボンダーのヒータブロツク
US3936928A (en) Method for providing mounting assemblies for a plurality of transistor integrated circuit chips
JP2009160617A (ja) ヒータチップ及び接合装置
JP3449185B2 (ja) 電子部品のボンディング装置
JP3348830B2 (ja) はんだバンプボンディング装置およびはんだバンプボンディング方法
JP2002141373A (ja) 半導体実装方法および半導体実装装置
JP2803211B2 (ja) 半導体装置のボンディング方法及びボンディング装置
JP2000260826A (ja) 半導体チップ実装用加熱装置
US3911569A (en) Method and apparatus for bonding miniature semiconductor pill-type components to a circuit board
JPH03180270A (ja) ボンディングヘッド
JP2728230B2 (ja) リードの接合法
JP2504466B2 (ja) 熱圧着ヘッド
JP6791189B2 (ja) 複合電子部品、定温加熱装置、および複合電子部品の製造方法
JP2548988B2 (ja) 巻線端末処理装置
JPS5578552A (en) Semiconductor
JPS5645041A (en) Semiconductor integrated circuit device
JPS642343A (en) Semiconductor device
JPS6367740A (ja) テ−プボンディング装置及び方法
JPH0119418Y2 (esLanguage)
JP2868030B2 (ja) ボンディングツール
JP2001244040A (ja) ガラスエポキシ基板や電気回路等に装備されたランド若しくはパッドとマグネットワイヤ等の樹脂被覆線の接続工法