JPH0461517B2 - - Google Patents
Info
- Publication number
- JPH0461517B2 JPH0461517B2 JP60134709A JP13470985A JPH0461517B2 JP H0461517 B2 JPH0461517 B2 JP H0461517B2 JP 60134709 A JP60134709 A JP 60134709A JP 13470985 A JP13470985 A JP 13470985A JP H0461517 B2 JPH0461517 B2 JP H0461517B2
- Authority
- JP
- Japan
- Prior art keywords
- wiring pattern
- adhesive
- die
- printed wiring
- conductive thin
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 239000000463 material Substances 0.000 claims description 23
- 239000000853 adhesive Substances 0.000 claims description 22
- 230000001070 adhesive effect Effects 0.000 claims description 22
- 238000000034 method Methods 0.000 claims description 18
- 238000004519 manufacturing process Methods 0.000 claims description 13
- 239000000758 substrate Substances 0.000 claims description 12
- 239000002313 adhesive film Substances 0.000 claims description 10
- 238000004080 punching Methods 0.000 claims description 10
- 239000004838 Heat curing adhesive Substances 0.000 claims description 3
- 238000001723 curing Methods 0.000 claims description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical group [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 10
- 239000011889 copper foil Substances 0.000 description 9
- 239000003990 capacitor Substances 0.000 description 4
- 238000009713 electroplating Methods 0.000 description 3
- 238000005530 etching Methods 0.000 description 3
- 239000002184 metal Substances 0.000 description 3
- 229910052751 metal Inorganic materials 0.000 description 3
- 239000002390 adhesive tape Substances 0.000 description 2
- 239000004020 conductor Substances 0.000 description 2
- 238000005520 cutting process Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 229920005989 resin Polymers 0.000 description 2
- 239000011347 resin Substances 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- 238000004065 wastewater treatment Methods 0.000 description 2
- QTBSBXVTEAMEQO-UHFFFAOYSA-M Acetate Chemical compound CC([O-])=O QTBSBXVTEAMEQO-UHFFFAOYSA-M 0.000 description 1
- 229920000298 Cellophane Polymers 0.000 description 1
- 229910000881 Cu alloy Inorganic materials 0.000 description 1
- 239000004952 Polyamide Substances 0.000 description 1
- 229920002367 Polyisobutene Polymers 0.000 description 1
- 229920006311 Urethane elastomer Polymers 0.000 description 1
- 229920002433 Vinyl chloride-vinyl acetate copolymer Polymers 0.000 description 1
- 229920005549 butyl rubber Polymers 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000007599 discharging Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000011888 foil Substances 0.000 description 1
- 239000002655 kraft paper Substances 0.000 description 1
- 239000004745 nonwoven fabric Substances 0.000 description 1
- 239000000123 paper Substances 0.000 description 1
- 229920002120 photoresistant polymer Polymers 0.000 description 1
- 229920003023 plastic Polymers 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 229920002037 poly(vinyl butyral) polymer Polymers 0.000 description 1
- 229920002647 polyamide Polymers 0.000 description 1
- 229920000728 polyester Polymers 0.000 description 1
- 229920001289 polyvinyl ether Polymers 0.000 description 1
- 238000007650 screen-printing Methods 0.000 description 1
- 229920003048 styrene butadiene rubber Polymers 0.000 description 1
- 229920001187 thermosetting polymer Polymers 0.000 description 1
Landscapes
- Shaping Metal By Deep-Drawing, Or The Like (AREA)
- Manufacturing Of Printed Circuit Boards (AREA)
- Manufacturing Of Printed Wiring (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP60134709A JPS61292397A (ja) | 1985-06-19 | 1985-06-19 | プリント配線板の製造方法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP60134709A JPS61292397A (ja) | 1985-06-19 | 1985-06-19 | プリント配線板の製造方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS61292397A JPS61292397A (ja) | 1986-12-23 |
| JPH0461517B2 true JPH0461517B2 (cs) | 1992-10-01 |
Family
ID=15134762
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP60134709A Granted JPS61292397A (ja) | 1985-06-19 | 1985-06-19 | プリント配線板の製造方法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS61292397A (cs) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3472751B2 (ja) * | 2000-07-06 | 2003-12-02 | シンワ測定株式会社 | 面状発熱体の製造方法並びに耐熱絶縁材付の面状発熱体の製造方法 |
-
1985
- 1985-06-19 JP JP60134709A patent/JPS61292397A/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS61292397A (ja) | 1986-12-23 |
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