JPH0461506B2 - - Google Patents
Info
- Publication number
- JPH0461506B2 JPH0461506B2 JP25757285A JP25757285A JPH0461506B2 JP H0461506 B2 JPH0461506 B2 JP H0461506B2 JP 25757285 A JP25757285 A JP 25757285A JP 25757285 A JP25757285 A JP 25757285A JP H0461506 B2 JPH0461506 B2 JP H0461506B2
- Authority
- JP
- Japan
- Prior art keywords
- heat dissipation
- dissipation block
- flat
- heat
- integrated circuit
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
- H01L23/433—Auxiliary members in containers characterised by their shape, e.g. pistons
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
- H01L23/473—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing liquids
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/30—Technical effects
- H01L2924/35—Mechanical effects
- H01L2924/351—Thermal stress
- H01L2924/3511—Warping
Landscapes
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Priority Applications (4)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP25757285A JPS62118552A (ja) | 1985-11-19 | 1985-11-19 | 集積回路の冷却構造 |
| US06/931,847 US4854377A (en) | 1985-11-19 | 1986-11-18 | Liquid cooling system for integrated circuit chips |
| EP86308975A EP0225108B1 (en) | 1985-11-19 | 1986-11-18 | Liquid cooling system for integrated circuit chips |
| DE8686308975T DE3666644D1 (en) | 1985-11-19 | 1986-11-18 | Liquid cooling system for integrated circuit chips |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP25757285A JPS62118552A (ja) | 1985-11-19 | 1985-11-19 | 集積回路の冷却構造 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS62118552A JPS62118552A (ja) | 1987-05-29 |
| JPH0461506B2 true JPH0461506B2 (enrdf_load_stackoverflow) | 1992-10-01 |
Family
ID=17308134
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP25757285A Granted JPS62118552A (ja) | 1985-11-19 | 1985-11-19 | 集積回路の冷却構造 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS62118552A (enrdf_load_stackoverflow) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3575829B2 (ja) * | 1994-06-13 | 2004-10-13 | 東洋エアゾール工業株式会社 | エアゾール用ディップチューブ |
| EP2166569A1 (de) * | 2008-09-22 | 2010-03-24 | ABB Schweiz AG | Kühlvorrichtung für ein Leistungsbauelement |
-
1985
- 1985-11-19 JP JP25757285A patent/JPS62118552A/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS62118552A (ja) | 1987-05-29 |
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