JPH0461506B2 - - Google Patents

Info

Publication number
JPH0461506B2
JPH0461506B2 JP60257572A JP25757285A JPH0461506B2 JP H0461506 B2 JPH0461506 B2 JP H0461506B2 JP 60257572 A JP60257572 A JP 60257572A JP 25757285 A JP25757285 A JP 25757285A JP H0461506 B2 JPH0461506 B2 JP H0461506B2
Authority
JP
Japan
Prior art keywords
heat dissipation
dissipation block
flat
heat
integrated circuit
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP60257572A
Other languages
English (en)
Japanese (ja)
Other versions
JPS62118552A (ja
Inventor
Toshifumi Sano
Yoichi Matsuo
Mitsuo Takamoto
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
Nippon Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nippon Electric Co Ltd filed Critical Nippon Electric Co Ltd
Priority to JP60257572A priority Critical patent/JPS62118552A/ja
Priority to US06/931,847 priority patent/US4854377A/en
Priority to EP86308975A priority patent/EP0225108B1/en
Priority to DE8686308975T priority patent/DE3666644D1/de
Publication of JPS62118552A publication Critical patent/JPS62118552A/ja
Publication of JPH0461506B2 publication Critical patent/JPH0461506B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H10W40/77—
    • H10W40/47—

Landscapes

  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
JP60257572A 1985-11-19 1985-11-19 集積回路の冷却構造 Granted JPS62118552A (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP60257572A JPS62118552A (ja) 1985-11-19 1985-11-19 集積回路の冷却構造
US06/931,847 US4854377A (en) 1985-11-19 1986-11-18 Liquid cooling system for integrated circuit chips
EP86308975A EP0225108B1 (en) 1985-11-19 1986-11-18 Liquid cooling system for integrated circuit chips
DE8686308975T DE3666644D1 (en) 1985-11-19 1986-11-18 Liquid cooling system for integrated circuit chips

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP60257572A JPS62118552A (ja) 1985-11-19 1985-11-19 集積回路の冷却構造

Publications (2)

Publication Number Publication Date
JPS62118552A JPS62118552A (ja) 1987-05-29
JPH0461506B2 true JPH0461506B2 (cg-RX-API-DMAC10.html) 1992-10-01

Family

ID=17308134

Family Applications (1)

Application Number Title Priority Date Filing Date
JP60257572A Granted JPS62118552A (ja) 1985-11-19 1985-11-19 集積回路の冷却構造

Country Status (1)

Country Link
JP (1) JPS62118552A (cg-RX-API-DMAC10.html)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3575829B2 (ja) * 1994-06-13 2004-10-13 東洋エアゾール工業株式会社 エアゾール用ディップチューブ
EP2166569A1 (de) * 2008-09-22 2010-03-24 ABB Schweiz AG Kühlvorrichtung für ein Leistungsbauelement

Also Published As

Publication number Publication date
JPS62118552A (ja) 1987-05-29

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