JPH046116B2 - - Google Patents
Info
- Publication number
- JPH046116B2 JPH046116B2 JP59173405A JP17340584A JPH046116B2 JP H046116 B2 JPH046116 B2 JP H046116B2 JP 59173405 A JP59173405 A JP 59173405A JP 17340584 A JP17340584 A JP 17340584A JP H046116 B2 JPH046116 B2 JP H046116B2
- Authority
- JP
- Japan
- Prior art keywords
- adhesive
- oxidizing agent
- insulating substrate
- rubber
- filler
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Landscapes
- Manufacturing Of Printed Wiring (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP17340584A JPS6151990A (ja) | 1984-08-22 | 1984-08-22 | 表面を金属化した絶縁基板の製造方法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP17340584A JPS6151990A (ja) | 1984-08-22 | 1984-08-22 | 表面を金属化した絶縁基板の製造方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6151990A JPS6151990A (ja) | 1986-03-14 |
| JPH046116B2 true JPH046116B2 (OSRAM) | 1992-02-04 |
Family
ID=15959812
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP17340584A Granted JPS6151990A (ja) | 1984-08-22 | 1984-08-22 | 表面を金属化した絶縁基板の製造方法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6151990A (OSRAM) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US11441015B2 (en) | 2018-01-12 | 2022-09-13 | Ajinomoto Co., Inc. | Coated particle |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS641599A (en) * | 1987-06-25 | 1989-01-05 | Kawatetsu Galvanizing Co Ltd | Manufacture of marking board with sunken lines |
| JPS6447095A (en) * | 1987-08-18 | 1989-02-21 | Ibiden Co Ltd | Printed wiring board and manufacture thereof |
| JPH0634447B2 (ja) * | 1987-08-31 | 1994-05-02 | イビデン株式会社 | アディティブ用接着剤、これを使用したアディティブ用基材及びプリント配線板 |
Family Cites Families (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5724074B2 (OSRAM) * | 1972-10-24 | 1982-05-21 | ||
| JPS53100470A (en) * | 1977-02-14 | 1978-09-01 | Hitachi Ltd | Method of producing printed board and coating agent used therefor |
| JPS5420650A (en) * | 1977-07-18 | 1979-02-16 | Hitachi Ltd | Input circuit |
| JPS5724074A (en) * | 1980-07-15 | 1982-02-08 | Toshiba Corp | Program selecting device |
| JPS584733A (ja) * | 1981-06-29 | 1983-01-11 | Shin Etsu Chem Co Ltd | アルキニル化合物の製造方法 |
| JPS60210449A (ja) * | 1984-04-05 | 1985-10-22 | 住友ベークライト株式会社 | アデイテイブめつき用積層板の製造方法 |
| JPS60217695A (ja) * | 1984-04-13 | 1985-10-31 | 株式会社日立製作所 | 無電解めつき前処理法及びプリント配線板の製造法 |
-
1984
- 1984-08-22 JP JP17340584A patent/JPS6151990A/ja active Granted
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US11441015B2 (en) | 2018-01-12 | 2022-09-13 | Ajinomoto Co., Inc. | Coated particle |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6151990A (ja) | 1986-03-14 |
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