JPH0461132A - Gel applicator for hybrid integrated circuit - Google Patents
Gel applicator for hybrid integrated circuitInfo
- Publication number
- JPH0461132A JPH0461132A JP16530490A JP16530490A JPH0461132A JP H0461132 A JPH0461132 A JP H0461132A JP 16530490 A JP16530490 A JP 16530490A JP 16530490 A JP16530490 A JP 16530490A JP H0461132 A JPH0461132 A JP H0461132A
- Authority
- JP
- Japan
- Prior art keywords
- gel
- hybrid integrated
- applicator
- diameter
- integrated circuit
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000002347 injection Methods 0.000 claims description 19
- 239000007924 injection Substances 0.000 claims description 19
- 238000004519 manufacturing process Methods 0.000 abstract 2
- 239000000758 substrate Substances 0.000 description 3
- 230000000694 effects Effects 0.000 description 2
- 238000000034 method Methods 0.000 description 2
Landscapes
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
Abstract
Description
【発明の詳細な説明】
〔M楽土の利用分野〕
この発明は、ゲル注入機を使用した混成集積回路アセン
ブリ技術に関するものである。DETAILED DESCRIPTION OF THE INVENTION [Field of Application of M-Rakudo] This invention relates to a hybrid integrated circuit assembly technique using a gel injection machine.
第2図は従来のこの種の注入機の使用状態を示す断面図
であり、第2図において、1は先端に細径ノズル8!1
&を有する筒状の注入機、2はその中に充填されたゲル
である。一方、3はパッケージ、4はヒートシンク、5
は厚膜基板、6は部品を示す。FIG. 2 is a cross-sectional view showing the state of use of a conventional injection machine of this type. In FIG. 2, 1 has a small diameter nozzle 8!
A cylindrical injector with &, 2 is the gel filled therein. On the other hand, 3 is the package, 4 is the heat sink, and 5 is the package.
6 indicates a thick film substrate, and 6 indicates a component.
次に動作について説明する。注入機1.!:リゲル2が
パッケージ3内に1プロンクごとに注入され1厚膜基板
5、部品6等をコートする。Next, the operation will be explained. Injection machine 1. ! : Rigel 2 is injected into the package 3 one pronk at a time to coat one thick film substrate 5, parts 6, etc.
ところが以上のような従来の注入機を使用したのでは、
第2図のように1ブロツクずつゲルを注入しなくてはな
らず、工程数が増え、時間とコストが多くかかるという
問題があった。However, if you use the conventional injection machine like the one above,
As shown in FIG. 2, the gel must be injected one block at a time, which increases the number of steps and increases time and cost.
この発明は上記のような問題点を解消するためになされ
たもので、混成集積回路アセンブリの時間と工程数を減
らすことを目的とする。The present invention has been made to solve the above-mentioned problems, and aims to reduce the time and number of steps required to assemble a hybrid integrated circuit.
この発明に係る注入装置は、ゲル注入機の注入部をシャ
ワー状にするとともに、その注入穴の径又は穴の数を変
えたものである。In the injection device according to the present invention, the injection part of the gel injection machine is shaped like a shower, and the diameter or the number of injection holes is changed.
この発明における注入装置は、注入部をシャワー状にし
てその穴の径又は穴を変えたことにより、複数1日ツク
の注入工程が一工程で行なえ、工程数を減らすことがで
きる。In the injection device according to the present invention, the injection part is shaped like a shower and the diameter or hole of the hole is changed, thereby making it possible to carry out injection steps over multiple days in one step, thereby reducing the number of steps.
第1図はこの発明の一実施例を下すもσ〕で、図におい
て、7は上記1に代わる注入機であり、その先端はシャ
ワー状の多数の穴7aが形成されるとともに、その穴の
径を変えたものである。FIG. 1 shows an embodiment of the present invention. In the figure, 7 is an injector in place of 1 above, the tip of which is formed with a large number of shower-shaped holes 7a. The diameter has been changed.
次に動作について説明する。了センブリにおけるゲル注
入工程において、ブロックで分けられた混成集積回路に
ゲルを注入する場合、ブロック数だけ工程が増え、時間
とコストがかかることは、上述した通りであるが、この
発明では、千の注入機の形状を変え、即ち注入部をシャ
ワー状に形成して、その穴の径を適宜変えることにより
、各ブロックに一度に適当量が注入できて工程数を減ら
すことが可能となり、大幅なコストダウンが図れる。Next, the operation will be explained. As mentioned above, when injecting gel into a hybrid integrated circuit divided into blocks in the gel injection process in the integrated assembly, the number of steps increases by the number of blocks, which increases time and cost. By changing the shape of the injection machine, that is, forming the injection part into a shower shape, and changing the diameter of the hole appropriately, it is possible to inject the appropriate amount into each block at once, which greatly reduces the number of steps. Cost reduction can be achieved.
なお上記実施例では、注入機をシャワー状にし注入部の
穴の径を変えているが、同径の穴のままで場所によって
穴の数を変えたり、注入機自体の形状を変えてもよい。In the above embodiment, the injector is shaped like a shower and the diameter of the hole in the injection part is changed, but the number of holes may be changed depending on the location while the holes are the same diameter, or the shape of the injector itself may be changed. .
〔発明の効果]
以上のようにこの発明によれば、混成集積回路のアセン
ブリ工程を減らすことができ′、コストの大幅な低下が
実現できる効果がある。[Effects of the Invention] As described above, according to the present invention, the number of assembly steps for a hybrid integrated circuit can be reduced, and the cost can be significantly reduced.
第1図はこの発明の一実施例を示t I!+面図、第2
図は従来のゲル注入装置を示す断面図である。
図中、3はパンケージ、4はヒートシンク、5は厚膜基
板、6は部品、7は注入機、7aは穴である0
なお図中間−符+iは同一または相当部分石−示す。FIG. 1 shows an embodiment of the invention. + side view, 2nd
The figure is a sectional view showing a conventional gel injection device. In the figure, 3 is a pan cage, 4 is a heat sink, 5 is a thick film substrate, 6 is a component, 7 is an injection machine, and 7a is a hole. Note that the symbol +i in the middle of the figure indicates the same or equivalent part.
Claims (1)
集積回路にゲルを注入する装置において、シャワー状に
多数の穴を形成するとともに、その穴の径又は穴の数を
変えることにより、一度にゲル注入を行えるようにした
ことを特徴とする混成集積回路用ゲル注入装置。In a device that injects gel into a hybrid integrated circuit that uses packages divided into blocks, it is possible to inject gel at once by forming a large number of holes in a shower pattern and changing the diameter or number of holes. A gel injection device for hybrid integrated circuits, which is characterized by being able to perform gel injection.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP16530490A JPH0461132A (en) | 1990-06-22 | 1990-06-22 | Gel applicator for hybrid integrated circuit |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP16530490A JPH0461132A (en) | 1990-06-22 | 1990-06-22 | Gel applicator for hybrid integrated circuit |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH0461132A true JPH0461132A (en) | 1992-02-27 |
Family
ID=15809791
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP16530490A Pending JPH0461132A (en) | 1990-06-22 | 1990-06-22 | Gel applicator for hybrid integrated circuit |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH0461132A (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH07268868A (en) * | 1994-03-30 | 1995-10-17 | Kensetsu Kiso Eng Co Ltd | Embankment anchor |
JP2006158277A (en) * | 2004-12-06 | 2006-06-22 | Chugoku Electric Power Co Inc:The | Bird-repelling apparatus in fish way |
-
1990
- 1990-06-22 JP JP16530490A patent/JPH0461132A/en active Pending
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH07268868A (en) * | 1994-03-30 | 1995-10-17 | Kensetsu Kiso Eng Co Ltd | Embankment anchor |
JP2509160B2 (en) * | 1994-03-30 | 1996-06-19 | 建設基礎エンジニアリング株式会社 | Embankment anchor |
JP2006158277A (en) * | 2004-12-06 | 2006-06-22 | Chugoku Electric Power Co Inc:The | Bird-repelling apparatus in fish way |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JP3431406B2 (en) | Semiconductor package equipment | |
JPH02143488A (en) | Printed wiring board with injection molded board | |
WO2004034424A3 (en) | A method and a mold to arrange features on a substrate to replicate features having minimal dimensional variability | |
KR940006432A (en) | How to create metal wiring on insulation board | |
JPH0461132A (en) | Gel applicator for hybrid integrated circuit | |
DE4424831A1 (en) | Process for producing an electrically conductive connection | |
JPS56114361A (en) | Semiconductor container | |
JPH0669691B2 (en) | Substrate sealing method | |
KR970077103A (en) | Photoresist coating device of semiconductor wafer | |
JPS63228631A (en) | Metal mold apparatus for sealing semiconductor element with resin | |
JPH10256714A (en) | Method of forming solder bump | |
JPH04107843U (en) | Structure of wire drawing circuit board | |
KR0172269B1 (en) | Spray nozzle assembly of processing liquid | |
JPH05192624A (en) | Adhesive applying nozzle | |
KR0175018B1 (en) | Semiconductor injection device | |
JPS57136349A (en) | Semiconductor device | |
JP3073195U (en) | Semiconductor memory substrate plastic injection coupling structure | |
JPS5821231A (en) | Manufacture of liquid crystal display element | |
JPH02119155A (en) | Semiconductor integrated circuit tester | |
DE19719983A1 (en) | Ball grid array for semiconductor component | |
JPH01220895A (en) | Method of designing thick-film conductor pattern | |
JPH02130831A (en) | Semiconductor integrated circuit | |
JPS63285995A (en) | Circuit substrate | |
JPS59146808A (en) | Method for molding electroconductive synthetic resin item | |
JPH0365278U (en) |