JPH10256714A - Method of forming solder bump - Google Patents
Method of forming solder bumpInfo
- Publication number
- JPH10256714A JPH10256714A JP9056606A JP5660697A JPH10256714A JP H10256714 A JPH10256714 A JP H10256714A JP 9056606 A JP9056606 A JP 9056606A JP 5660697 A JP5660697 A JP 5660697A JP H10256714 A JPH10256714 A JP H10256714A
- Authority
- JP
- Japan
- Prior art keywords
- solder
- wiring board
- filling
- filling hole
- solder bump
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Abandoned
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3452—Solder masks
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3457—Solder materials or compositions; Methods of application thereof
- H05K3/3485—Applying solder paste, slurry or powder
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3489—Composition of fluxes; Methods of application thereof; Other methods of activating the contact surfaces
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Non-Metallic Protective Coatings For Printed Circuits (AREA)
Abstract
Description
【０００１】[0001]
【発明の属する技術分野】この発明は、表面実装用配線
板上に設けられた電子部品ソード用半田付ランドに半田
のバンプを形成する半田バンプ形成方法に関するもので
ある。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a solder bump forming method for forming a solder bump on a soldering land for electronic component sword provided on a surface mounting wiring board.
【０００２】[0002]
【従来の技術】従来、この種の半田バンプ形成方法とし
ては、例えば次のような技術がある。第１の技術は、半
田クリームをスクリーン印刷によって画線板の半田付け
ランド部に塗布し、半田クリームを溶融させることによ
り半田付けランド上に所定の半田バンプを形成する方法
である。また、第２の技術は、フラックスをスクリーン
印刷，スプレー，浸漬によって半田付ランドに塗布し、
その上に成形半田を付着させ、この成形半田を付着させ
た配線板を加熱し、成形半田を溶融させることにより、
半田付ランド上に所定の半田バンプを形成する方法であ
る。さらに、第３の技術は、半田付ランド上に上記第２
の技術と同様にフラックスを塗布し、フラックスを塗布
した配線板を加熱し、加熱した配線板の半田付ランド部
に向けて溶融半田を吹き付ける方法、または溶融半田に
浸漬させることにより、半田付ランド上に所定の半田バ
ンプを形成する方法である。2. Description of the Related Art Conventionally, as a solder bump forming method of this kind, for example, there is the following technique. The first technique is a method in which a solder cream is applied to a soldering land portion of an image plate by screen printing, and a predetermined solder bump is formed on the soldering land by melting the solder cream. The second technique is to apply flux to the soldering lands by screen printing, spraying, and dipping.
By applying the molded solder on it, heating the wiring board to which the molded solder is attached, and melting the molded solder,
This is a method of forming a predetermined solder bump on a solder land. Further, the third technique is that the second
Applying the flux in the same manner as in the technique described above, heating the wiring board to which the flux is applied, and spraying the molten solder toward the soldered land portion of the heated wiring board, or immersing the soldered land in the molten solder. This is a method of forming a predetermined solder bump on the upper surface.
【０００３】[0003]
【発明が解決しようとする課題】しかし、上記した従来
の半田バンプ形成方法では、次のような問題があった。
上記第１の技術に係る半田バンプ形成方法では、半田ク
リームを半田付ランド上に均一に塗布することが難し
く、均一な半田バンプを形成することができない。ま
た、上記第２の技術に係る半田バンプ形成方法では、成
形半田を半田付ランド上に付着させるには複雑な成形半
田付着装置を必要とし、設備投資コストが大幅にかかっ
てしまう。さらに、上記第３の技術に係るバンプ形成方
法では、所定の半田付ランドに均一な半田量を得ること
ができず、均一な半田バンプを形成することができな
い。However, the above-mentioned conventional solder bump forming method has the following problems.
In the solder bump forming method according to the first technique, it is difficult to uniformly apply the solder cream on the lands to be soldered, so that a uniform solder bump cannot be formed. Further, in the method of forming a solder bump according to the second technique, a complicated molding solder attaching apparatus is required to attach the molding solder on the soldering land, and the capital investment cost is greatly increased. Further, in the bump forming method according to the third technique, a uniform amount of solder cannot be obtained on a predetermined soldering land, and a uniform solder bump cannot be formed.
【０００４】この発明は上述した課題を解決するために
なされたもので、簡単な工程で均一な半田量の半田バン
プを形成することができる半田バンプ形成方法を提供す
ることを目的としている。SUMMARY OF THE INVENTION The present invention has been made to solve the above-described problems, and has as its object to provide a solder bump forming method capable of forming a solder bump having a uniform amount of solder in a simple process.
【０００５】[0005]
【課題を解決するための手段】上記課題を解決するため
に、この発明に係る半田バンプ形成方法は、配線板の半
田付ランドに対応する個所に所定大きさの充填孔を有し
た所定厚さの耐熱性マスクを、配線板半田付ランド面に
マスキングするマスキング工程と、配線板の傾斜によっ
て転がり可能な形状の半田粒をマスキングされた配線板
上に散乱載置し、配線板を傾斜させて、充填孔内にのみ
半田粒を存在させる充填工程と、充填孔内の半田粒にフ
ラックスを、塗布する塗布工程と、充填孔内の半田粒を
溶融させる半田溶融工程とを具備する構成とした。かか
る構成により、マスキング工程において、半田付ランド
上に耐熱性マスクの充填孔が位置し、充填工程におい
て、半田付ランド上の充填孔内にのみ半田粒が存在する
こととなる。そして、塗布工程において、充填孔内の半
田粒にフラックスが塗布され、半田溶融工程において、
充填孔内の半田粒が溶かされ、半田付ランド上に半田バ
ンプが形成される。In order to solve the above-mentioned problems, a method of forming a solder bump according to the present invention is directed to a method for forming a solder bump having a predetermined thickness having a filling hole of a predetermined size at a position corresponding to a solder land on a wiring board. A masking step of masking the heat-resistant mask of the wiring board on the land surface to which the wiring board is to be soldered, and dispersingly placing the solder particles in a shape that can be rolled by the inclination of the wiring board on the masked wiring board, and tilting the wiring board. A filling step of having solder particles only in the filling hole, a coating step of applying flux to the solder particles in the filling hole, and a solder melting step of melting the solder particles in the filling hole. . With this configuration, the filling hole of the heat resistant mask is located on the land with solder in the masking step, and the solder particles are present only in the filling hole on the land with solder in the filling step. Then, in the applying step, the flux is applied to the solder particles in the filling hole, and in the solder melting step,
The solder particles in the filling hole are melted, and a solder bump is formed on the land with solder.
【０００６】[0006]
【発明の実施の形態】以下、この発明の実施の形態につ
いて図面を参照して説明する。図１はこの発明の一実施
形態に係る半田バンプ形成方法の工程順断面図であり、
図２は耐熱性マスクの斜視図である。この実施形態の半
田バンプ形成方法は、マスキング工程と充填工程と塗布
工程と半田溶融工程と剥離工程とを具備している。以
下、各工程を順を追って説明する。Embodiments of the present invention will be described below with reference to the drawings. FIG. 1 is a cross-sectional view in the order of steps of a method for forming a solder bump according to an embodiment of the present invention.
FIG. 2 is a perspective view of the heat resistant mask. The solder bump forming method of this embodiment includes a masking step, a filling step, a coating step, a solder melting step, and a peeling step. Hereinafter, each step will be described in order.
【０００７】この実施形態では、図１の（ａ）に示すよ
うに、電子部品リード（図示省略）を半田付けするため
の半田付ランド２を有し、オーバコート樹脂３でコーテ
ィングされた配線板１に、半田バンプを形成する。ま
ず、図１の（ｂ）に示すように、配線板１に対してマス
キング工程を実行する。具体的には、図２に示す耐熱性
マスク４を配線板１の半田付ランド面に貼り付ける。耐
熱性マスク４は所定厚さの平板体であり、配線板１の半
田付ランド２に対応する個所に充填孔４０を有してい
る。充填孔４０の径は半田付ランド２の幅に略等しく設
定されている。このような耐熱性マスク４を配線板１上
にマスキングすることで、図１の（ｂ）に示すように、
充填孔４０が半田付ランド２に一致した状態となる。In this embodiment, as shown in FIG. 1A, a wiring board having solder lands 2 for soldering electronic component leads (not shown) and coated with an overcoat resin 3 is provided. First, a solder bump is formed. First, as shown in FIG. 1B, a masking step is performed on the wiring board 1. Specifically, the heat resistant mask 4 shown in FIG. 2 is attached to the soldered land surface of the wiring board 1. The heat-resistant mask 4 is a flat body having a predetermined thickness, and has a filling hole 40 at a position corresponding to the soldering land 2 of the wiring board 1. The diameter of the filling hole 40 is set substantially equal to the width of the soldering land 2. By masking such a heat-resistant mask 4 on the wiring board 1, as shown in FIG.
The filling hole 40 is in a state of being coincident with the land 2 for soldering.
【０００８】つぎに、充填工程を実行する。すなわち、
図１の（ｃ）に示すように、多数の半田ボール５（半田
粒）を配線板１上に散乱載置させ、配線板１を前後左右
方向（図１の紙面表裏方向及び左右方向）に揺動させ
る。これにより、半田ボール５が配線板１上に均一に拡
散し、半田ボール５の一部が充填孔４０内に確実且つ密
に充填される。この状態では、多数の半田ボール５がオ
ーバコート樹脂３上に存在している。したがって、図１
の（ｄ）に示すように、配線板１を傾斜させる。この傾
斜動作によって、オーバコート樹脂３上の多数の半田ボ
ール５が転がって配線板１上から落下する。また、充填
孔４０内の半田ボール５は、充填孔４０の内壁によって
係止されるので、充填孔４０内から飛び出して落下する
ことはない。このため、各充填孔４０内に同数の半田ボ
一ル５が充填された状態となる。このようにして、充填
孔４０内の半田ボール５のみを残すことにより、充填工
程を終了し、塗布工程に移行する。Next, a filling step is performed. That is,
As shown in FIG. 1C, a large number of solder balls 5 (solder grains) are scattered and mounted on the wiring board 1, and the wiring board 1 is moved in the front-rear and left-right directions (the front-back direction and the left-right direction in FIG. 1). Rock it. Thereby, the solder balls 5 are uniformly diffused on the wiring board 1, and a part of the solder balls 5 is securely and densely filled in the filling hole 40. In this state, many solder balls 5 exist on the overcoat resin 3. Therefore, FIG.
The wiring board 1 is inclined as shown in FIG. Due to this tilting operation, a large number of solder balls 5 on the overcoat resin 3 roll and fall from the wiring board 1. Further, since the solder balls 5 in the filling holes 40 are locked by the inner walls of the filling holes 40, they do not jump out of the filling holes 40 and fall. Therefore, each filling hole 40 is filled with the same number of solder balls 5. By leaving only the solder balls 5 in the filling holes 40 in this way, the filling step is completed, and the process shifts to the coating step.
【０００９】塗布工程では、図１の（ｅ）に示すよう
に、フラツクス６をスプレーして、フラックス６を半田
ボール５上に塗布する動作が行われ、しかる後、半田溶
融工程に移行する。In the application step, as shown in FIG. 1E, an operation of spraying the flux 6 and applying the flux 6 onto the solder balls 5 is performed, and thereafter, the process proceeds to the solder melting step.
【００１０】半田溶融工程に移行すると、図１の（ｆ）
に示すように、配線板１が上方から加熱される。したが
って、フラックス６が塗布された充填孔４０内の半田ボ
ール５のみが溶かされ、図１の（ｇ）に示すように、半
田付ランド２上に山形の半田バンプ７が形成されること
となる。ところで、上記したように、各充填孔４０は同
径であり、各充填孔４０内の半田ボール５は同数であ
る。したがって、これらの半田ボール５が溶かされて形
成された充填孔４０内の半田バンプ７の半田量はすべて
等しい。この結果、すべての半田付ランド２上に均一な
半田量の半田バンプ７が形成されることとなる。When the process shifts to the solder melting step, FIG.
As shown in (1), the wiring board 1 is heated from above. Therefore, only the solder balls 5 in the filling holes 40 to which the flux 6 has been applied are melted, and the mountain-shaped solder bumps 7 are formed on the soldering lands 2 as shown in FIG. . As described above, the filling holes 40 have the same diameter, and the number of the solder balls 5 in each filling hole 40 is the same. Therefore, the solder amounts of the solder bumps 7 in the filling holes 40 formed by melting the solder balls 5 are all equal. As a result, the solder bumps 7 having a uniform amount of solder are formed on all the solder lands 2.
【００１１】上記のように、半田溶融工程において、均
一半田量の半田バンプ７を形成した後、剥離工程に移行
し、図１の（ｈ）に示すように、耐熱性マスク４をオ一
バコート樹脂３から剥がすことで全工程を終了する。As described above, in the solder melting step, after the solder bumps 7 having a uniform amount of solder are formed, the process proceeds to the peeling step, and as shown in FIG. 1H, the heat resistant mask 4 is overcoated. The whole process is completed by peeling off the resin 3.
【００１２】このように、この実施形態の半田バンプ形
成方法によれば、簡単な工程で半田量が均一な半田バン
プ７を形成することができる。また、半田ボ一ル５や充
填孔４０の大きさを調整することで、半田バンプ７の半
田量を調整することができる。具体的には、図３に示す
ように、半田ボール５の直径Ｒを小さくすることで、充
填孔４０内に充填された半田ボール５の間の間隙が少な
くなり、半田量を増加させることができ、逆に、半田ボ
ール５の直径Ｒを大きくすることで、半田量を減少させ
ることができる。また、耐熱性マスク４の厚さ即ち充填
孔４０の深さｈを変化させて、充填される半田ボール５
の数を調整することで半田量を増減させることができ
る。同様に、充填孔４０の径Ｄを調整することで、半田
量を増減することができる。As described above, according to the solder bump forming method of this embodiment, the solder bumps 7 having a uniform amount of solder can be formed by a simple process. Further, by adjusting the size of the solder balls 5 and the filling holes 40, the amount of solder of the solder bumps 7 can be adjusted. Specifically, as shown in FIG. 3, by reducing the diameter R of the solder ball 5, the gap between the solder balls 5 filled in the filling hole 40 is reduced, and the amount of solder can be increased. Conversely, by increasing the diameter R of the solder ball 5, the amount of solder can be reduced. Further, the thickness of the heat-resistant mask 4, that is, the depth h of the filling hole 40 is changed so that
By adjusting the number, the amount of solder can be increased or decreased. Similarly, by adjusting the diameter D of the filling hole 40, the amount of solder can be increased or decreased.
【００１３】なお、この発明は、上記実施形態に限定さ
れるものではなく、発明の要旨の範囲内において種々の
変形や変更が可能である。例えば、上記実施形態では、
塗布工程において、フラックス６をスプレ一にて散布塗
布したが、フラックス６の液を充填孔４０内の半田ボー
ル５上に滴下するようにしても良い。また、上記実施形
態では、半田粒として半田ボ一ル５を用いたが、配線板
１の傾斜によって転がり可能な形状のものであれば、楕
円状，円柱状等でもよく、球状の半田ボール５に限定さ
れるのではない。また、上記実施形態では、耐熱性マス
ク４の充填孔４０の形状を円形にしたが、三角形，四角
形等でも良く、円形に限定されるのではない。さらに、
上記実施形態では、充填孔４０の径Ｄを半田付ランド２
の幅と等しく設定したが、半田付ランド２の幅よりも大
きくしたり、小さくしたり設定することができることは
勿論である。The present invention is not limited to the above embodiment, and various modifications and changes can be made within the scope of the invention. For example, in the above embodiment,
In the application step, the flux 6 is applied by spraying, but the liquid of the flux 6 may be dropped onto the solder balls 5 in the filling holes 40. In the above embodiment, the solder balls 5 are used as the solder particles. However, the solder balls 5 may have an elliptical shape, a cylindrical shape, or the like, as long as they can be rolled due to the inclination of the wiring board 1. It is not limited to. In the above-described embodiment, the shape of the filling hole 40 of the heat resistant mask 4 is circular. However, the shape may be a triangle, a square, or the like, and is not limited to a circle. further,
In the above embodiment, the diameter D of the filling hole 40 is set to the soldering land 2.
Is set to be equal to the width of the soldering land 2, but it is needless to say that it can be set to be larger or smaller than the width of the soldering land 2.
【００１４】[0014]
【発明の効果】以上詳しく説明したように、この発明に
よれば、充填孔内の半田粒の数に対応した半田量の半田
バンプを形成することができるので、すべての半田付ラ
ンド上に均一な量の半田バンプを形成することができる
という優れた効果がある。また、半田粒の大きさや充填
孔の深さ及び大きさを調整することで、半田バンプの半
田量を自由に調整することができる。さらに、単に耐熱
性マスクをマスキングするマスキング工程，配線板を傾
斜させるだけの充填工程，半田粒にフラックスを塗布す
るだけの塗布工程，単に半田粒を溶融させるだけの半田
溶融工程という非常に簡単な工程で半田バンプを形成す
ることができるので、バンプ形成コストの低減化を図る
ことができる。As described above in detail, according to the present invention, it is possible to form solder bumps having a solder amount corresponding to the number of solder particles in the filling hole, so that the solder bumps can be uniformly formed on all the solder lands. There is an excellent effect that an appropriate amount of solder bumps can be formed. Also, by adjusting the size of the solder particles and the depth and size of the filling hole, the amount of solder of the solder bumps can be freely adjusted. In addition, a very simple masking step of masking a heat-resistant mask, a filling step of merely tilting a wiring board, a coating step of applying flux to solder particles, and a solder melting step of merely melting solder particles are very simple. Since the solder bumps can be formed in the process, the cost for forming the bumps can be reduced.
【００１５】また、配線板を揺動させて半田粒を充填孔
内に充填させることで、半田粒を充填孔内に確実且つ密
に充填させることができる。Further, the solder particles are filled in the filling holes by swinging the wiring board, so that the solder particles can be reliably and densely filled in the filling holes.
【００１６】また、半田粒として所定径の半田ボ一ルを
用いることにより、配線板上での転がりを良くすること
ができ、この結果、半田ボールをより確実且つ密に充填
孔内にのみ充填させることができると共に、半田量のよ
り一層の均一性を図ることができる。Further, by using a solder ball having a predetermined diameter as solder particles, it is possible to improve the rolling on the wiring board. As a result, the solder balls are more reliably and densely filled only in the filling holes. And more uniformity of the amount of solder can be achieved.
【図面の簡単な説明】[Brief description of the drawings]
【図１】この発明の一実施形態に係る半田バンプ形成方
法の工程順断面図である。FIG. 1 is a cross-sectional view in a process order of a method for forming a solder bump according to an embodiment of the present invention.
【図２】耐熱性マスクの斜視図である。FIG. 2 is a perspective view of a heat-resistant mask.
【図３】充填孔の径の大きさと深さとを示す断面図であ
る。FIG. 3 is a cross-sectional view showing the size and depth of the diameter of a filling hole.
１・・・配線板、 ２・・・半田付ランド、 ３・・・
オーバコート樹脂、４・・・耐熱性マスク、 ５・・・
半田ボール、 ６・・・フラツクス、 ７・・・半田バ
ンプ。1 ... wiring board, 2 ... land with solder, 3 ...
Overcoat resin, 4 ... heat resistant mask, 5 ...
Solder ball, 6: flux, 7: solder bump.
Claims (5)
所定大きさの充填孔を有した所定厚さの耐熱性マスク
を、上記配線板半田付ランド面にマスキングするマスキ
ング工程と、 上記配線板の傾斜によって転がり可能な形状の半田粒を
上記マスキングされた配線板上に散乱載置し、上記配線
板を傾斜させて、上記充填孔内にのみ上記半田粒を存在
させる充填工程と、 上記充填孔内の半田粒にフラックスを塗布する塗布工程
と、 上記充填孔内の半田粒を溶融させる半田溶融工程と、 を具備することを特徴とする半田バンプ形成方法。A masking step of masking a heat-resistant mask of a predetermined thickness having a predetermined size of a filling hole at a position corresponding to a soldering land of the wiring board on the surface of the wiring board soldering land; A filling step in which the solder particles having a shape that can be rolled by the inclination of the board are scattered and mounted on the masked wiring board, the wiring board is inclined, and the solder particles are present only in the filling holes. A solder bump forming method, comprising: an application step of applying a flux to solder particles in a filling hole; and a solder melting step of melting the solder particles in the filling hole.
おいて、 上記充填工程は、 上記配線板を揺動させて、散乱載置された半田粒の一部
を上記充填孔に充填させた後、配線板を傾斜させるもの
である、 ことを特徴とする半田バンプ形成方法。2. The solder bump forming method according to claim 1, wherein in the filling step, the wiring board is swung to fill a part of the solder particles scattered and placed in the filling hole. A method of forming a solder bump by inclining a wiring board.
おいて、 上記半田溶融工程後に、上記耐熱性マスクを剥がす、 ことを特徴とする半田バンプ形成方法。3. The solder bump forming method according to claim 1, wherein the heat resistant mask is peeled off after the solder melting step.
おいて、 上記半田溶融工程後に、上記耐熱性マスクを剥がす、 ことを特徴とする半田バンプ形成方法。4. The method for forming a solder bump according to claim 2, wherein the heat-resistant mask is peeled off after the solder melting step.
おいて、 上記半田粒は、所定径の半田ボールである、 ことを特徴とする半田バンプ形成方法。5. The method according to claim 1, wherein the solder particles are solder balls having a predetermined diameter.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9056606A JPH10256714A (en) | 1997-03-11 | 1997-03-11 | Method of forming solder bump |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9056606A JPH10256714A (en) | 1997-03-11 | 1997-03-11 | Method of forming solder bump |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH10256714A true JPH10256714A (en) | 1998-09-25 |
Family
ID=13031904
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP9056606A Abandoned JPH10256714A (en) | 1997-03-11 | 1997-03-11 | Method of forming solder bump |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH10256714A (en) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2007116145A (en) * | 2005-10-20 | 2007-05-10 | Endicott Interconnect Technologies Inc | Method for manufacturing circuit substrate equipped with plural solder connection parts on upper surface thereof |
| US8087566B2 (en) * | 2008-05-15 | 2012-01-03 | International Business Machines Corporation | Techniques for arranging solder balls and forming bumps |
| JP2014078633A (en) * | 2012-10-11 | 2014-05-01 | Toppan Printing Co Ltd | Solder bump formation method |
| CN110730572A (en) * | 2019-09-12 | 2020-01-24 | 张自明 | Backflow type circuit board insulation processing equipment |
| CN112091346A (en) * | 2020-09-07 | 2020-12-18 | 昆山联滔电子有限公司 | Welding method of laser spraying welding ball |
-
1997
- 1997-03-11 JP JP9056606A patent/JPH10256714A/en not_active Abandoned
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2007116145A (en) * | 2005-10-20 | 2007-05-10 | Endicott Interconnect Technologies Inc | Method for manufacturing circuit substrate equipped with plural solder connection parts on upper surface thereof |
| US8087566B2 (en) * | 2008-05-15 | 2012-01-03 | International Business Machines Corporation | Techniques for arranging solder balls and forming bumps |
| JP2014078633A (en) * | 2012-10-11 | 2014-05-01 | Toppan Printing Co Ltd | Solder bump formation method |
| CN110730572A (en) * | 2019-09-12 | 2020-01-24 | 张自明 | Backflow type circuit board insulation processing equipment |
| CN112091346A (en) * | 2020-09-07 | 2020-12-18 | 昆山联滔电子有限公司 | Welding method of laser spraying welding ball |
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