CN110730572A - Backflow type circuit board insulation processing equipment - Google Patents
Backflow type circuit board insulation processing equipment Download PDFInfo
- Publication number
- CN110730572A CN110730572A CN201910861601.4A CN201910861601A CN110730572A CN 110730572 A CN110730572 A CN 110730572A CN 201910861601 A CN201910861601 A CN 201910861601A CN 110730572 A CN110730572 A CN 110730572A
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- Prior art keywords
- assembly
- box
- circuit board
- backflow
- assembly box
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/28—Applying non-metallic protective coatings
- H05K3/282—Applying non-metallic protective coatings for inhibiting the corrosion of the circuit, e.g. for preserving the solderability
Abstract
The invention discloses a backflow type circuit board insulation processing device, which structurally comprises: the processing machine comprises a processing machine body, a distribution box, a movable base, an assembly box and a cover box, wherein the movable base is arranged below the assembly box and is buckled with the assembly box, the distribution box is arranged on the right side of the assembly box, and the distribution box is locked with the assembly box.
Description
Technical Field
The invention discloses backflow type circuit board insulation processing equipment, and belongs to the field of circuit boards.
Background
The traditional circuit board contacts are exposed outside, are easy to short circuit and burn out circuits, can cause fire disasters seriously and even cause immeasurable damage to the environment, so that the surface of the circuit board needs to be coated with a solder resist to prevent the circuits from being corroded and broken, prevent short circuit between lines caused by more welding points, reduce the dissolution pollution of copper in welding lines and increase the insulation degree.
The prior art has the following defects: when carrying out solder resist to the circuit board surface and spraying processing, current mode of spraying is mostly atomizing formula and sprays to the time that needs one end time of standing leads to the processing bench upper surface to adhere to a lot of spray, and the difficult clearance just causes great wasting of resources.
Disclosure of Invention
Aiming at the defects in the prior art, the invention aims to provide backflow type circuit board insulation processing equipment to solve the problems that when solder resist spraying processing is carried out on the surface of a circuit board, most of existing spraying modes are atomizing spraying, and one end of the spraying mode needs standing time, so that a large amount of spraying agent can be attached to the upper surface of a processing table, cleaning is not convenient, and large resource waste is caused.
In order to achieve the purpose, the invention is realized by the following technical scheme: a backflow type circuit board insulation processing equipment structurally comprises: processing organism, block terminal, removal base, assembly box, cover case, remove the pedestal mounting in the assembly box below and with the assembly box lock joint, the assembly box right side is equipped with the block terminal, block terminal and assembly box halving, the assembly box top is equipped with the processing organism, processing organism and assembly box swing joint, the processing organism outside is equipped with the cover case, cover case and processing organism lock joint, the processing organism includes assembly bench device, shower nozzle group, control storage silo, backflow pump, side swash plate, the side swash plate is installed in assembly bench device upper end side and with assembly bench device lock joint, the assembly bench device passes through the backflow pump and connects with the control storage silo lock joint, control storage silo below is equipped with the shower nozzle group, shower nozzle group and control silo lock joint.
Preferably, the assembly table device comprises a backflow recovery device, a fixing plate, a clamping rod group, a chute plate and a drainage tube, the drainage tube is installed on the side edge of the backflow recovery device and is fastened with the backflow recovery device, the fixing plate is arranged above the backflow recovery device, the chute plate is fastened above the fixing plate, the clamping rod group is arranged at the upper end of the chute plate, and the clamping rod group is movably connected with the chute plate.
Preferably, the backflow recovery device comprises a condensation preventing device and a leakage barrel, and the condensation preventing device is installed below the leakage barrel and movably connected with the leakage barrel.
Preferably, the condensation preventing device comprises a main shaft rod, an outer heat generating pipe, a servo motor and an auxiliary heating device, wherein the outer heat generating pipe is installed above the main shaft rod and fastened with the main shaft rod, the auxiliary heating device is installed below the main shaft rod, and the auxiliary heating device is installed above the servo motor and fastened with the servo motor.
Preferably, the bottom of the drain cylinder is in an inclined state, the inclined angle faces the drainage tube, and the inner side surface of the clamping rod group is provided with an opening for clamping and fixing the matched circuit board.
Preferably, a certain gap is formed between the inner wall of the outer heating pipe and the main shaft rod, and a corresponding connecting device is arranged, so that the outer heating pipe generates heat when the main shaft rod rotates, and further the outer heating pipe is matched with the main shaft rod to prevent solidification.
Preferably, the outer heat-generating pipe adopts a friction heating acquisition mode.
Preferably, the user's accessible will be processed the circuit board and fix the centre gripping along the corresponding trench of holder group, through the mutually supporting of block terminal and assembly box, and then make control storage silo can spray the solder resist to the circuit board below through the shower nozzle group, in this process, unnecessary solder resist can fall to the chute board upper surface along the side slash shield, and then flow to leaking in the section of thick bamboo along its surface, and under servo motor and the mutually supporting of auxiliary heating device, can drive the main shaft pole and rotate, make the outer heat pipe assist that generates heat simultaneously, and then avoided leaking the solidification of the interior solder resist of section of thick bamboo, simultaneously with it by the backflow pump control storage silo through the cooperation of drainage tube, and then carry out resource recovery and recycle.
Advantageous effects
Compared with the prior art, the invention has the beneficial effects that: in the in-process of processing is sprayed to the solder resist to circuit board surface, will spray out unnecessary solder resist through distinctive chute board and hourglass a section of thick bamboo and collect, carry out the pyrolysis and the stirring that prevent to solidify to the solder resist of collecting through preventing congealing the device simultaneously to carry out recycle to the reflux pump direction along the drainage tube, it is more reasonable to utilization of resources, also reduced the trouble on clearance platform surface.
Drawings
Other features, objects and advantages of the invention will become more apparent upon reading of the detailed description of non-limiting embodiments with reference to the following drawings:
fig. 1 is a schematic view of an appearance structure of a backflow type circuit board insulation processing device according to the present invention.
Fig. 2 is a schematic front sectional view of the processing machine body according to the present invention.
Fig. 3 is a schematic structural diagram of the mounting table device of the present invention.
FIG. 4 is a schematic cross-sectional view of the backflow recovery device according to the present invention.
FIG. 5 is a schematic cross-sectional view of the condensation preventing device of the present invention.
In the figure: the device comprises a processing machine body-1, a distribution box-2, a movable base-3, an assembly box-4, a cover box-5, an assembly table device-a, a spray head group-b, a control storage bin-c, a reflux pump-d, a side inclined plate-e, a backflow recovery device-a 1, a fixing plate-a 2, a clamping rod group-a 3, an inclined groove plate-a 4, a drainage tube-a 5, an anti-condensation device-a 11, a leakage tube-a 12, a main shaft rod-a 111, an external heating tube-a 112, a servo motor-a 113 and an auxiliary heating device-a 114.
Detailed Description
In order to make the technical means, the creation characteristics, the achievement purposes and the effects of the invention easy to understand, the invention is further described with the specific embodiments.
Referring to fig. 1-5, the present invention provides a technical solution of a backflow type circuit board insulation processing apparatus: the structure includes: in order to achieve the purpose, the invention is realized by the following technical scheme: a backflow type circuit board insulation processing equipment structurally comprises: the processing machine comprises a processing machine body 1, a distribution box 2, a moving base 3, an assembly box 4 and a cover box 5, wherein the moving base 3 is installed below the assembly box 4 and is fastened with the assembly box 4, the distribution box 2 is arranged on the right side of the assembly box 4, the distribution box 2 is locked with the assembly box 4, the processing machine body 1 is arranged above the assembly box 4, the processing machine body 1 is movably connected with the assembly box 4, the cover box 5 is arranged on the outer side of the processing machine body 1, the cover box 5 is fastened with the processing machine body 1, the processing machine body 1 comprises an assembly table device a, a spray head group b, a control storage bin c, a backflow pump d and a side inclined plate e, the side inclined plate e is installed on the side edge of the upper end of the assembly table device a and is fastened with the assembly table device a, the assembly table device a is locked with the control storage bin c through the backflow pump d, the control storage bin c is provided with the spray head group b, the assembly table device a comprises a backflow recovery device a1, a fixing plate a2, a clamping rod group a3, a chute plate a4 and a drainage tube a5, the drainage tube a5 is installed on the side edge of the backflow recovery device a1 and is buckled with the backflow recovery device a1, a fixing plate a2 is arranged above the backflow recovery device a1, a chute plate a4 is buckled above the fixing plate a2, a clamping rod group a3 is arranged at the upper end of the chute plate a4, and the clamping rod group a3 is movably connected with the chute plate a 4.
The backflow recovery device a1 comprises a condensation preventing device a11 and a leakage cylinder a12, wherein the condensation preventing device a11 is installed below the leakage cylinder a12 and movably connected with the leakage cylinder a12, and the backflow recovery device a1 is matched with the leakage cylinder a12 through the condensation preventing device a11 so as to recycle the spraying agent.
The condensation preventing device a11 comprises a main shaft rod a111, an outer heat generating pipe a112, a servo motor a113 and an auxiliary heat device a114, wherein the outer heat generating pipe a112 is installed above the main shaft rod a111 and fastened with the main shaft rod a111, the auxiliary heat device a114 is installed below the main shaft rod a111, the auxiliary heat device a114 is installed above the servo motor a113 and locked with the servo motor a113, and the condensation preventing device a11 is matched with the auxiliary heat device a114 through the servo motor a113 so as to drive the main shaft rod a111 to perform rotation assistance.
The invention is mainly characterized in that: the user's accessible will be processed the circuit board and fix the centre gripping along the corresponding trench of holder group a3, through the mutually supporting of block terminal 2 and assembly box 4, and then make control storage silo c spray the solder resist to the circuit board of below through shower nozzle group b, in this process, unnecessary solder resist can fall to chute board a4 upper surface along side swash plate e, and then flow in leaking section of thick bamboo a12 along its surface, and under the mutually supporting of servo motor a113 and auxiliary heating device a114, can drive main shaft a111 and rotate, make outer heat pipe a112 of generating heat simultaneously and generate heat the assistance, and then avoided the solidification of leaking section of thick bamboo a12 internal resistance welding flux, return to control storage silo c in its by reflux pump d through the cooperation of drainage tube a5 simultaneously, and then carry out resource recovery and recycle.
According to the invention, through the mutual combination of the components, when the equipment is used, the reflux mechanism is arranged, so that the problems that when the solder resist is sprayed and processed on the surface of a circuit board, most of the existing spraying modes are atomized spraying, and one end of standing time is needed, so that a lot of spraying agents are attached to the upper surface of a processing table, the cleaning is inconvenient and the resource waste is large are solved, the resource utilization of the equipment is more reasonable, and the trouble of cleaning the surface of the platform is reduced.
While there have been shown and described what are at present considered the fundamental principles and essential features of the invention and its advantages, it will be apparent to those skilled in the art that the invention is not limited to the details of the foregoing exemplary embodiments, but is capable of other specific forms without departing from the spirit or essential characteristics thereof. The present embodiments are therefore to be considered in all respects as illustrative and not restrictive, the scope of the invention being indicated by the appended claims rather than by the foregoing description, and all changes which come within the meaning and range of equivalency of the claims are therefore intended to be embraced therein. Any reference sign in a claim should not be construed as limiting the claim concerned.
Furthermore, it should be understood that although the present description refers to embodiments, not every embodiment may contain only a single embodiment, and such description is for clarity only, and those skilled in the art should integrate the description, and the embodiments may be combined as appropriate to form other embodiments understood by those skilled in the art.
Claims (4)
1. A backflow type circuit board insulation processing equipment structurally comprises: processing organism (1), block terminal (2), removal base (3), assembly box (4), cover case (5), remove base (3) install in assembly box (4) below and with assembly box (4) lock joint, assembly box (4) right side is equipped with block terminal (2), block terminal (2) and assembly box (4) lock joint, its characterized in that:
the assembly box is characterized in that a processing machine body (1) is arranged above the assembly box (4), the processing machine body (1) is movably connected with the assembly box (4), a cover box (5) is arranged on the outer side of the processing machine body (1), and the cover box (5) is buckled with the processing machine body (1).
2. The reverse flow type circuit board insulation processing equipment according to claim 1, wherein: the processing machine body (1) comprises an assembly table device (a), a spray head group (b), a control storage bin (c), a reflux pump (d) and a side inclined plate (e), the side sloping plate (e) is arranged on the side edge of the upper end of the assembly table device (a) and is buckled with the assembly table device (a), the assembly table device (a) is locked with the control storage bin (c) through a backflow pump (d), a nozzle group (b) is arranged below the control storage bin (c), the assembly table device (a) comprises a backflow recovery device (a1), a fixing plate (a2), a clamping rod group (a3), an inclined groove plate (a4) and a drainage tube (a5), the drainage tube (a5) is arranged at the side of the backflow recovery device (a1), a fixing plate (a2) is arranged above the backflow recovery device (a1), a chute plate (a4) is buckled above the fixing plate (a2), and a clamping rod group (a3) is arranged at the upper end of the chute plate (a 4).
3. The reverse flow type circuit board insulation processing equipment according to claim 2, wherein: the backflow recovery device (a1) comprises a condensation preventing device (a11) and a leakage cylinder (a12), wherein the condensation preventing device (a11) is arranged below the leakage cylinder (a 12).
4. The reverse flow type circuit board insulation processing equipment according to claim 3, wherein: the condensation preventing device (a11) comprises a main shaft rod (a111), an outer heat generating pipe (a112), a servo motor (a113) and an auxiliary heating device (a114), wherein the outer heat generating pipe (a112) is installed above the main shaft rod (a111) and is buckled with the main shaft rod (a111), the auxiliary heating device (a114) is arranged below the main shaft rod (a111), and the auxiliary heating device (a114) is installed above the servo motor (a 113).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910861601.4A CN110730572B (en) | 2019-09-12 | 2019-09-12 | Backflow type circuit board insulation processing equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910861601.4A CN110730572B (en) | 2019-09-12 | 2019-09-12 | Backflow type circuit board insulation processing equipment |
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| CN110730572A true CN110730572A (en) | 2020-01-24 |
| CN110730572B CN110730572B (en) | 2020-08-28 |
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| CN201910861601.4A Active CN110730572B (en) | 2019-09-12 | 2019-09-12 | Backflow type circuit board insulation processing equipment |
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Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6421996A (en) * | 1987-07-16 | 1989-01-25 | Irex Corp | Manufacture of printed circuit board |
| JPH10256714A (en) * | 1997-03-11 | 1998-09-25 | Sony Corp | Method of forming solder bump |
| CN201199753Y (en) * | 2006-11-08 | 2009-02-25 | 洪源基 | Defoaming apparatus |
| CN102404939A (en) * | 2010-09-17 | 2012-04-04 | 富葵精密组件(深圳)有限公司 | Wet processing device and wet processing method |
| CN207445907U (en) * | 2017-11-08 | 2018-06-05 | 浙江华再环境技术有限公司 | Exhaust gas adsorption environmental protection device |
| CN110137129A (en) * | 2019-05-30 | 2019-08-16 | 湖州靖源信息技术有限公司 | A kind of coring piece machine |
-
2019
- 2019-09-12 CN CN201910861601.4A patent/CN110730572B/en active Active
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6421996A (en) * | 1987-07-16 | 1989-01-25 | Irex Corp | Manufacture of printed circuit board |
| JPH10256714A (en) * | 1997-03-11 | 1998-09-25 | Sony Corp | Method of forming solder bump |
| CN201199753Y (en) * | 2006-11-08 | 2009-02-25 | 洪源基 | Defoaming apparatus |
| CN102404939A (en) * | 2010-09-17 | 2012-04-04 | 富葵精密组件(深圳)有限公司 | Wet processing device and wet processing method |
| CN207445907U (en) * | 2017-11-08 | 2018-06-05 | 浙江华再环境技术有限公司 | Exhaust gas adsorption environmental protection device |
| CN110137129A (en) * | 2019-05-30 | 2019-08-16 | 湖州靖源信息技术有限公司 | A kind of coring piece machine |
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|---|---|
| CN110730572B (en) | 2020-08-28 |
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Effective date of registration: 20200803 Address after: 261000 2 / F, workshop 3, Weifang oulong science and Technology Park, north of Yuqing East Street, Yuqing community, Xincheng street, high tech Zone, Weifang City, Shandong Province Applicant after: Weifang Libei Electronic Technology Co., Ltd Address before: 310009 Hangzhou Power Bureau, No. 219 Jianguo Road, Zhejiang, Hangzhou Applicant before: Zhang Ziming |
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