JPH01220895A - Method of designing thick-film conductor pattern - Google Patents

Abstract

PURPOSE:To remove a lateral bulge of a conductor by properly making the line width of the masks of conductors in a cross-over region such as the crossing of conductor paths smaller than that of a mask in a normal device. CONSTITUTION:In the design of the mask of conductors, the width of required conductors 1 corresponding to a cross-over section 2 is set at a property small value according to the height of the cross-over section. The design of these width is determined by the quantity of conductive paste applied to a stepped section 10, but it is decided in consideration of even the viscosity of conductive paste. Conductive paste is applied by using such as a mask, and dried and sintered, thus preventing lateral bulges of the conductors on boundary lines with the cross-over sections 4 approximately completely in the conductors 3.

Description

DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a mask for forming thick film conductors in hybrid integrated circuits, etc., and in particular, to a mask for forming thick film conductors in hybrid integrated circuits, etc. Learn how to create one.

``Conventional technology'' Conventionally, as a method of forming conductors on a substrate using printing technology, the conductor paths are formed by using a mask made of a mesh or the like, applying conductive paste, and sintering. Was. These techniques pose no problem on a flat surface of the substrate, but if, for example, the conductor paths intersect, it is necessary to provide an insulating layer on the lower conductor path and form an upper conductor path thereon. A so-called crossover portion occurs.

When forming a conductor using a mask in a place having such a lossover, conventionally, as shown in FIG. 2, when a crossover portion 8 is formed on a substrate 7,
The mask 9 has a stepped portion lO, and the back surface 11 of the mask is raised above the substrate 7. If conductive paste is applied in this condition, the amount of applied conductive paste will be the second
As shown by the crosshatches in the figure, the number of conductors is larger than that of other conductor parts. FIG. 3 is a diagram showing the shape of a conventional mask for forming conductor paths and the conductor after sintering. Conventionally, the width of the conductor l was formed in a straight line with a required width. 2 is a crossover section. In this state, when a conductive paste is applied, dried and sintered, more conductive paste than a normal conductor is applied to the end of the crossover 8 shown in FIG. This applied conductive paste spreads laterally due to its own weight or due to diffusion, causing the conductor to ooze out and swell laterally compared to the normal conductor 3, as shown in the conductor 5 shown in Figure 3(b). become a state. If another conductor is formed adjacently in such a state, a short circuit may occur between the conductors, which has been a problem.

"Problem to be Solved by the Invention" When forming conductors using conventional masks, there is a problem in which lateral bulges of the conductor occur due to excessive application of conductive paste, especially at the step part of the crossover part. there were.

The present invention solves these conventional problems, namely, the lateral bulge of the conductor.

``Means for Solving the Problems'' In order to solve the above-mentioned problems, the present invention is a device in which a conductive paste is applied onto a substrate using a mask to form a conductor path, and in which a conductor path is formed such that the conductor path crosses, etc. The present invention provides a method for designing a thick film conductor pattern in which the line width of a conductor mask in a crossover region is appropriately smaller than the line width of a normal mask.

"Example" Hereinafter, a thick film conductor pattern design method according to the present invention will be explained based on the drawings. FIG. 1(a) is a diagram showing an embodiment of a thick film conductor pattern according to the present invention, and FIG. 1(b) is a diagram showing a thick film conductor formed using the same pattern.

In designing the conductor mask, the required width of the conductor 1 corresponding to the crossover section 2 is set to be appropriately small depending on the height of the crossover section.

The design of these widths is determined by the amount of conductive paste applied to the stepped portion IO, but is also determined by taking into account the viscosity of the conductive paste. By applying a conductive paste using such a mask, drying, and sintering, the conductor 3 is made to have a lateral bulge at the boundary with the crossover section 4, as shown in FIG. 1(b). It can be almost completely prevented.

"Effects" As explained above, in the thick film conductor pattern design method according to the present invention, even if there is a crossover portion on the substrate,
The conductor printed on the top surface is formed in a substantially straight line, which can prevent problems such as short circuits that occur due to the bulge of the conductor in the past. Thin conductors or those that substantially increase the number of conductors per unit area.

[Brief explanation of the drawing]

FIG. 1(a) is a plan view of an embodiment of a thick film conductor pattern according to the present invention, FIG. 1(b) is a plan view showing the shape of a conductor using the same pattern, and FIG. 2 is a main part of the thick film conductor. Cross-sectional view, 3rd [
! I(a) is a plan view of a conventional thick film conductor pattern, and FIG. 1(b) is a plan view showing the shape of a conductor using the same pattern. In the figure, l is the conductor on the mask, 2.4 is the crossover part,
3 is a conductor, 7 is a substrate, 8 is a crossover section, 9 is a mask, and 10 is a step section. Patent applicant: Fujitsu General Ltd. Figure 7 [a] [b), Figure 2

Claims (1)

[Claims] In a device in which a conductive paste is applied to a substrate using a mask to form a conductor path, the line width of the conductor mask in crossover areas such as intersections of conductor paths is appropriately made smaller than the line width of the normal mask. A thick film conductor pattern design method characterized by: