JP2000021613A - Manufacture of chip resistor - Google Patents

Abstract

PROBLEM TO BE SOLVED: To reduce mixed unacceptable products whose overlap is extremely small in manufacturing by forming notched parts or through holes in the parts on which either electrode film of both the pairs of right and left electrode films which have lateral width larger than that of a resistance film is overlapped with the resistance film. SOLUTION: After material paste is spread on a resistance film partly overlapping by using screen printing, both electrode films 8, 9 are formed by drying and baking. A lateral width W2 of the electrode films is larger than the lateral width of the resistance film which is previously formed and set as a dimension approximate to the lateral width of an insulating board 1. In both of the electrode films 8, 9, notched parts 10, 11 are formed on parts overlapping with the resistance film. Even if, both ends of the resistance film are covered with both of the electrode films 8, 9 a parts of which are overlapped with both of the ends, both of the ends of the resistance film are seen in the notched parts 10, 11, degree and quality of print deviation in the longitudinal direction of the resistance film out of print deviation between the resistance film and both of the electrode films 8, 9 can surely recognized.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for manufacturing a chip-type resistor in which a resistive film is formed in a thick film on an upper surface of a chip-type insulating substrate.

[0002]

2. Description of the Related Art Generally, a chip resistor of this type includes a thick resistive film and a pair of left and right electrode films electrically connected to both ends of the resistive film on the upper surface of an insulating substrate. It is a structure called forming. Conventionally, this chip type resistor
First, on the upper surface of the insulating substrate, the pair of left and right electrode films is formed by applying the material paste by screen printing, and then drying and firing. Then, the resistive film is coated with the material paste. A manufacturing method has been adopted in which coating is performed by screen printing so as to partially overlap the electrode film, followed by drying and firing to form the electrode film.

However, as described above, forming a pair of left and right electrode films first, and then forming a resistive film such that a part of both ends thereof overlaps with the two electrode films is necessary to reduce the thickness of the resistive film. In addition to the change, some components in both electrode films diffuse into the resistance film, so that the performance of the resistance film is reduced. Therefore, recently, for example, Japanese Patent Application Laid-Open No. 64-73
As described in JP-A-702, for example, a thick resistive film is first formed on the upper surface of an insulating substrate by applying its material paste by screen printing, drying and firing, and then forming In addition, a manufacturing method is adopted in which the two electrode films are formed by applying a material paste by screen printing so as to partially overlap the resistance film, followed by drying and firing.

[0004]

However, in this manufacturing method in which a resistive film is formed first, and then both electrode films are formed on both ends of the resistive film as in this manufacturing method, the width of each of the electrode films is determined by the method disclosed in As described in, for example, FIG. 2 of JP-A-64-73702, among the printing shifts existing between the two electrode films and the resistive film, the printing shift in the width direction of the resistive film is taken into consideration. It is configured to be larger than the width dimension of the resistive film.
Since both ends of the resistive film are covered by the two electrode films that partially overlap the resistive film, the two ends of the resistive film cannot be recognized. Even if the overlap of one electrode film with one end of the resistive film is extremely small due to printing displacement in the length direction of the resistive film, it should be excluded from the manufacturing process. However, there is a problem that there is a high possibility that the above-mentioned defective product whose overlap is extremely small is mixed in the manufactured product without being transferred to the final process.

An object of the present invention is to provide a manufacturing method which solves this problem.

[0006]

In order to achieve this technical object, the present invention provides a method for manufacturing a semiconductor device comprising the steps of:
A resistive film is formed by applying the material paste, drying and firing, and then forming a pair of left and right electrode films having a larger width than the resistive film by applying the material paste and drying and firing. In the manufacturing method, a notch or a hole is provided in a portion where at least one of the two electrode films overlaps the resistance film when forming the two electrode films. It is characterized by. Is the thing.

[0007]

As described above, the two electrode films formed after the resistive film are cut or cut out at a portion where at least one of the two electrode films overlaps the resistive film. By forming the holes, even if both ends of the resistive film are covered by the two electrode films partially overlapping with each other, one end of the resistive film is formed by any one of the two electrode films covering the both ends. This can be seen in the notch or the hole formed in one of the electrode films, and as a result, the printing displacement in the longitudinal direction of the resistive film among the print displacements existing between the resistive film and the two electrodes can be reduced. The extent and, consequently, the quality of the printing deviation can be reliably recognized.

That is, according to the present invention, the degree of the printing shift along the length direction of the resistive film among the print shifts existing between the resistive film and the two electrode films, and furthermore, the quality of the print shift is determined. The chip type having a large printing displacement in the length direction can be reliably recognized by a notch or a hole provided in a portion where one of the two electrode films overlaps the resistance film. Since it can be excluded from the manufacturing process of the resistor, there is an effect that the possibility that a defective product having a small overlap is mixed in the product can be greatly reduced.

[0009]

Embodiments of the present invention will be described below with reference to the drawings. FIG. 1 shows a plurality of rectangular insulating substrates 1 having a length L and a width W constituting a single chip type resistor, which are arranged side by side in the vertical and horizontal directions and integrated with margins 3 and 4 around the periphery. 1 shows a material ceramic substrate 2 provided integrally.

In FIG. 1, reference numerals 5 and 6 are:
The figure shows a groove for breaking the material ceramic substrate 2 for each of the insulating substrates 1. As shown in FIG. 2, a thick film-shaped resistive film 7 having a width W1
Is formed by applying the material paste by screen printing, followed by drying and firing.

Next, as shown in FIG. 3, both electrode films 8 and 9 are applied to a portion of the upper surface of the material ceramic substrate 2 where the insulating substrate 1 is provided, and the material paste is applied to a resistive film 7.
It is formed by applying by screen printing so as to partially overlap, followed by drying and baking. In addition,
The width W2 of each of the electrode films 8, 9 is set to be larger than the width W1 of the previously formed resistive film 7 and approximate to the width W of the insulating substrate 1.

When the two electrode films 8 and 9 are formed, the notch portions 10 and 11 are formed in portions of the two electrode films 8 and 9 which overlap with the resistance film 7. . As described above, the two electrode films 8 and 9 formed later than the resistance film 7 are formed by providing the cutouts 10 and 11 in portions of the two electrode films 8 and 9 that overlap the resistance film 7. Thus, even if both ends of the resistive film 7 are covered by the two electrode films 8 and 9 partially overlapping the resist film 7, both ends of the resistive film 7 cover the two ends.
9 can be seen in the cutouts 10 and 11 provided in the resistive film 9, thereby printing in the longitudinal direction of the resistive film 7 in the printing displacement existing between the resistive film 7 and the electrodes 8 and 9. It is possible to reliably recognize the degree of the shift, and thus the quality of the print shift.

In the above-described embodiment, the notch 1 is formed in a portion of the two electrode films 8 and 9 which overlaps the resistance film 7.
Although the case where 0 and 11 are provided is shown, the notches 10 and 1 are provided.
1, the holes 10 ', 11' as shown in FIG.
May be configured. Instead of providing the cutouts 10 and 11 or the holes 10 ′ and 11 ′ in both the electrode films 8 and 9, the cutouts are formed only in one of the electrode films 8 and 9. Alternatively, by providing the holes, the degree of the printing shift in the length direction of the resistive film 7 among the print shifts existing between the resistive film 7 and the two electrodes 8 and 9, and further,
It is possible to reliably recognize the quality of the print misregistration.

As described above, after the formation of the two electrode films 8 and 9, a step of forming an undercoat of glass on the resistance film 7. A step of trimming adjustment to a predetermined value,
A step of forming a protective film on the upper surface of the insulating substrate 1, a step of breaking the material ceramic substrate 2 along a lateral groove 5 into a rod-shaped substrate in which a plurality of insulating substrates 1 are arranged in a horizontal direction,
A step of forming side electrode films on both end surfaces of each insulating substrate 1 in the rod-shaped substrate so as to be electrically connected to the two electrode films 8 and 9; Through a step of breaking for each insulating substrate 1, a chip-type resistor is completed.

[Brief description of the drawings]

FIG. 1 is a perspective view showing a part of a material ceramic substrate used in an embodiment of the present invention.

FIG. 2 is a perspective view showing a state in which a resistive film is formed on each insulating substrate in the material ceramic substrate.

FIG. 3 is a perspective view showing a state in which a pair of left and right electrode films is formed on each insulating substrate in the material ceramic substrate.

FIG. 4 is a perspective view showing another embodiment of the present invention.

[Explanation of symbols]

 REFERENCE SIGNS LIST 1 chip-type insulating substrate 2 ceramic substrate 7 resistive film 8, 9 electrode film 10, 11 cutout 10 ', 11' hole

Claims (1)

[Claims] A resistive film is first formed on an upper surface of a chip-type insulating substrate by applying a material paste thereof, drying and baking, and then forming a pair of left and right sides having a width larger than that of the resistive film. The electrode film is coated with the material paste and dried.
In the manufacturing method which is formed by firing, when forming the two electrode films, a notch or a hole is formed at a portion where at least one of the two electrode films overlaps the resistance film. A method for manufacturing a chip resistor, comprising: