JPH11204316A - Manufacture of chip-type resistor and structure of board used therefor - Google Patents

Abstract

PROBLEM TO BE SOLVED: To reduce the manufacturing cost of a chip-type resistor by making defective products mixed in conforming products easily sortable, when many chip-type resistors or multiple chip type resistors are manufactured from a single board. SOLUTION: When extra insulating substrates 2' which become defective products are integrally provided at both ends of bar-like boards in each of which a plurality of insulating substrates 2 are formed integrally side by side, of a board A, slit-like through-holes A6 are drilled through the board A between each bar-like board and through the parts of the extra insulating substrates 2'. Consequently, the formation of side-face electrodes constituting terminal electrodes 5 (upper electrodes 5a and side-face electrodes) of chip-type resistors (or multiple chip type resistors) on the side faces 2a and 2b' of the substrates 2' can be prevented.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

The present invention relates to a chip type resistor in which one resistive film is formed on one chip type insulating substrate, or a plurality of resistive films formed in one chip type insulating substrate. A method of manufacturing a series of chip resistors comprising:
Further, the present invention relates to a structure of a material substrate used for manufacturing the same.

[0002]

2. Description of the Related Art Generally, the above-mentioned chip type resistor 1 has
As shown in FIG. 1, one resistive film 3 and a black cover coat 4 covering the resistive film 3 are formed on the upper surface of a chip-type insulating substrate 2, while the resistive film 3 is formed on both left and right side portions of the insulating substrate 2. (The two terminal electrodes 5 are electrically conductive paste upper electrodes 5a formed on the upper surface of the insulating substrate 2 and the conductive paste upper electrodes 5a and 2b formed on the left and right side surfaces 2a and 2b of the insulating substrate 2). And a metal plating layer formed by forming a solder or tin plating layer with a nickel plating layer as a base on the surfaces of the upper surface electrode 5a and the side electrode 5b. .

In addition, the aforementioned multiple chip type resistors 11
As shown in FIG. 2, a plurality of resistive films 13 and a black cover coat 14 covering the resistive films 13 are formed on an upper surface of a chip-type insulating substrate 12, and the left and right side surfaces of the insulating substrate 12 A plurality of terminal electrodes 15 for both ends of each resistive film 13 (however, these two terminal electrodes 15 are electrically conductive paste upper surface electrodes 15 formed on the upper surface of the insulating substrate 12)
a, a side electrode 15b made of conductive paste formed on the left and right side surfaces 12a and 12b of the insulating substrate 12, and a solder or tin plating layer formed on the surface of the upper electrode 15a and the side electrode 15b with a nickel plating layer as a base. (Formed of a metal plating layer).

In the manufacture of the chip resistor 1, the following method has conventionally been employed (see Japanese Patent Application Laid-Open No. 56-148804). First, as shown in FIG. 15, a plurality of the insulating substrates 2 are arranged side by side in the horizontal direction and integrated to form a rod-shaped material substrate A1, and further, a plurality of the rod-shaped material substrates A1 are arranged and integrated. A substrate A is prepared.

[0005] Margins A2 and A3 are integrally provided around the material substrate A, and the material substrate A is provided on the surface of the material substrate A for each of the bar-shaped material substrates A1. A plurality of vertical break grooves A4 for breaking;
A plurality of horizontal break grooves A5 for breaking each rod-shaped material substrate A1 for each insulating substrate 2 are engraved.

Next, as shown in FIG. 16, a resistive film 3 is formed on the surface of the material substrate A on each of the insulating substrates 2.
Then, as shown in FIG. 17, an upper surface electrode 5a made of a conductive paste is formed. Further, after performing trimming adjustment for each of the resistance films 3 on a portion of each of the insulating substrates 2 on the surface of the material substrate A, as shown by a two-dot chain line in FIG. Black cover coat 4
To form

Then, after removing the blank portions A2 and A3 around the material substrate A, the material substrate A is broken along the vertical break grooves A4 for each bar-shaped material substrate A1 as shown in FIG. . And this rod-shaped material substrate A
As shown in FIG. 19, side electrodes 5b made of conductive paste are formed on both left and right long side surfaces in FIG. 1, that is, on both right and left side surfaces 2a and 2b of each insulating substrate 2 of the rod-shaped material substrate A1. The rod-shaped material substrate A1 is broken for each insulating substrate 2 along each horizontal break groove A5.

Next, by subjecting a large number of the insulating substrates 2 to a barrel plating process, a metal containing a nickel plating layer as a base is formed on the surface of both upper surface electrodes 5a and both side electrodes 5b of each insulating substrate 2. After forming a plating layer, the chip resistor 1 shown in FIG. 1 is obtained. Incidentally, both longitudinal side surfaces of the rod-shaped material substrate A1, that is, both right and left side surfaces 2 of each insulating substrate 2 of the rod-shaped material substrate A1.
In forming the side electrode 5b made of a conductive paste on a and 2b, conventionally, for example, Japanese Patent Publication No. 3-52201
As described in Japanese Patent Application Publication No.
1, that is, the rod-shaped material substrate A1
By pressing the left and right side surfaces 2a, 2b of each of the insulating substrates 2 into a long groove engraved on the surface of the roller and filled with a conductive paste, the two long side surfaces 2a, 2b are formed.
In this case, a method of applying a conductive paste for the side electrode 5b is adopted.

Further, as described above, the side electrodes 5b made of conductive paste are formed on the left and right longitudinal sides of the rod-shaped substrate A1, that is, on the left and right sides 2a and 2b of each insulating substrate 2 of the rod-shaped substrate A1. In this case, in addition to cranking both ends of the rod-shaped material substrate A1, the rod-shaped material substrate A1 is shifted in the axial direction of the roller with respect to the long groove in the roller,
In other words, the length of the conductive paste applied to the left and right long side surfaces 2a and 2b of the rod-shaped material substrate A1 along the longitudinal direction is shifted in the longitudinal direction of the left and right long side surfaces 2a and 2b. A situation in which the conductive paste for 5b cannot be applied uniformly to all the insulating substrates 2 in the rod-shaped material substrate A1, that is, the side electrodes 5b are completely applied to the insulating substrates 2 at both ends of the rod-shaped material substrate A1. A situation arises in that it is formed in a shape.

Therefore, conventionally, at least one discarded insulating substrate 2 'is integrally provided at each end of a rod-shaped material substrate A1 in which a plurality of the insulating substrates 2 are arranged side by side and integrated. The bar-shaped material substrate A1 is clamped by at least one waste insulating substrate 2 ', and the deviation of the applied length of the conductive paste along the longitudinal direction with respect to the two longitudinal side surfaces 2a and 2b is absorbed.

The discarded insulating substrate 2 'has a case where a black cover coat 4 is formed on its surface and a case where it is not formed at all.

[0012]

According to this conventional method, the discarded insulating substrates 2 'used at both ends of the rod-shaped material substrate A1 are defective. Means that the rod-shaped material substrate A1 is
After breaking each discarded insulating substrate 2 ', the rod-shaped material substrate A1 must be sorted so as to be distinguished from non-defective products by each insulating substrate 2.

The left and right longitudinal sides of the rod-shaped material substrate A1, ie, the insulating substrates of the rod-shaped material substrate A1, are applied to the side electrodes 5b formed on the left and right sides of the discarded insulating substrate 2 'which is defective. 2, the length of the conductive paste applied to the left and right side surfaces 2a and 2b along the longitudinal direction is shifted along the longitudinal direction of the left and right long side surfaces 2a and 2b. When the side electrode 5b is a defective product having a short side, the magnetic material contains a small amount of nickel in the magnetic material due to the metal plating process, while the non-defective product contains a large amount of the magnetic material nickel in both terminal electrodes 5. In addition, the defective product and the non-defective product can be efficiently and reliably sorted at a high speed at a high speed by a sorting device using a magnet.

However, on the other hand, in the case of a defective product in which the side electrode 5b is formed longer than the waste insulating substrate 2 ',
Since a large amount of nickel, which is a magnetic substance, is contained by the metal plating process, it is not possible to sort by a sorting device using a magnet, and all the insulating substrates 2 and the discarded insulating substrates 2 'are photographed one by one with a camera. By processing the image, it is necessary to make a selection so as to judge pass / fail, and it is not possible to select at a high speed, so that the cost required for manufacturing the chip type resistor is considerably increased by that much. In addition, there is a problem that the accuracy in sorting is low, and many defective products are mixed in non-defective components.

Also, a multiple chip type resistor 1 shown in FIG.
No. 1 was also manufactured by the same method as described above, and thus had the same problem. It is a technical object of the present invention to provide a manufacturing method which solves these problems and a structure of a material substrate used in the manufacturing method.

[0016]

In order to achieve this technical object, a manufacturing method according to the present invention comprises the steps of integrating a plurality of chip-type insulating substrates side by side and integrating at least one discarded insulating substrate at each of both ends. A plurality of rod-shaped material substrates integrally provided with each other are arranged in parallel with each other to form a material substrate, and a resistive film and a top electrode are formed on each insulating substrate on the surface of the material substrate. And forming a cover coat, the step of breaking the material substrate for each rod-shaped material substrate, and both longitudinal side surfaces of the rod-shaped material substrate, that is, side electrodes on both side surfaces of each insulating substrate of the rod-shaped material substrate. Forming a rod-shaped material substrate, breaking the rod-shaped material substrate for each of the insulating substrate and the discarded insulating substrate, and then performing a metal plating process. Prior to forming a resistive film or the like on the material substrate, a slit-shaped through hole is formed in a portion of the discarded insulating substrate between the respective bar-shaped material substrates so as to extend along the longitudinal direction of the bar-shaped material substrate. The structure of the material substrate in the present invention is as follows.
"A plurality of chip-shaped insulating substrates are arranged side by side and integrated, and a plurality of rod-shaped material substrates integrally provided with at least one discarded insulating substrate at each of both ends are arranged in parallel and integrated with each other. In the material substrate, a slit-shaped through hole is formed between the respective rod-shaped material substrates in the material substrate and in each of the discarded insulating substrates so as to extend along the longitudinal direction of the rod-shaped material substrate. ".

[0017]

As described above, before forming a resistive film or the like on the material substrate, a slit-shaped through hole is formed in the portion of the discarded insulating substrate between the respective rod-shaped material substrates in the longitudinal direction of the rod-shaped material substrate. When the material substrate is broken for each rod-shaped material substrate by drilling so as to extend along the direction, the left and right side surfaces of each discarded insulating substrate at both ends of the rod-shaped material substrate are each insulated in the rod-shaped material substrate. From the left and right side surfaces of the substrate, since it will be recessed by the amount provided with the slit-shaped through hole as described above, when forming side electrodes on both left and right long side surfaces of the rod-shaped material substrate,
For the left and right side surfaces of each discarded insulating substrate, the coating length of the conductive paste along the longitudinal direction with respect to the left and right long side surfaces of the rod-shaped substrate is shifted along the left and right long side surfaces. That is, it is possible to reliably prevent the side electrodes from being formed with a long length, in other words, it is possible to make the side electrodes formed on the left and right side surfaces of each of the waste insulating substrates extremely short.

In this case, as described in claim 4, by connecting one end of the slit-shaped through hole to a break groove between the insulating substrate and the waste insulating substrate, the left and right sides of each waste insulating substrate are formed. The formation of side electrodes on both side surfaces can be avoided at all, in other words, the side electrodes formed on the left and right side surfaces of each of the waste insulating substrates can be completely eliminated.

That is, according to the present invention, when the side electrodes are formed on the left and right longitudinal side surfaces of the rod-shaped material substrate, the side electrodes are formed on the side surfaces of the discarded insulating substrates at both ends of the rod-shaped material substrate. Can be avoided, or the formation of the side electrode can be avoided at all,
In addition, in the subsequent metal plating process, it is possible to minimize the amount of magnetic nickel contained in each of the discarded insulating substrates to a very small amount. When sorting from non-defective products by using an insulating substrate, the sorting device using magnets enables fast, efficient, reliable and high-precision sorting, thus reducing the manufacturing cost of chip-type resistors. In addition to this, there is an effect that it is possible to surely reduce the possibility that a defective part is mixed into a good part.

Further, as set forth in claim 3, by setting the width of the discarded insulating substrate equal to or substantially equal to the width of each of the insulating substrates, the rod-shaped material substrate is separated from each of the insulating substrates and each of the discarded substrates. When a break is performed for each insulating substrate, the frequency at which the width dimension of the insulating substrate adjacent to the waste insulating substrate among the insulating substrates becomes larger than a predetermined value is reduced, so that there is an advantage that the incidence of defective products can be reduced.

[0021]

Embodiments of the present invention will be described below with reference to the drawings. 3 to 11 show an embodiment in the case where the chip resistor shown in FIG. 1 is manufactured. In this drawing, reference numeral A denotes a ceramic material substrate, and this material substrate A, as shown in FIG. 3, lays a large number of insulating substrates 2 constituting the chip resistor 1 shown in FIG. The rod-shaped material substrate A1 is arranged and integrated in a direction, and a plurality of the rod-shaped material substrates A1 are further arranged and integrated. At least one waste insulating substrate 2 'having the same size as each insulating substrate 2 is integrally provided.

In addition, margins A2 and A3 are integrally provided around the material substrate A, and the material substrate A is provided on the surface of the material substrate A for each of the bar-shaped material substrates A1. A plurality of vertical break grooves A4 for breaking;
A plurality of horizontal break grooves A5 for breaking each rod-shaped material substrate A1 for each insulating substrate 2 and each discarded insulating substrate 2 'are engraved.

This material substrate A is manufactured by punching and pressing a ceramic green and then firing at a high temperature. By punching a portion of each waste insulating substrate 2 'between the material substrates A1 and a slit having a width S with a punch, a slit-shaped through hole A6 is formed in the portion.
Is formed so as to extend along the longitudinal direction of the rod-shaped material substrate A1.

Then, as shown in FIG. 4, a resistive film 3 is formed on each of the insulating substrates 2 on the surface of the material substrate A, and then, as shown in FIG. 5a is formed (the upper electrode 5a may be formed first, and the resistive film 3 may be formed later).
Further, after performing trimming adjustment on each of the resistance films 3 on the portion of each of the insulating substrates 2 on the surface of the material substrate A, as shown by a two-dot chain line in FIG. A black cover coat 4 for covering is formed.

Next, after removing the blank portions A2 and A3 around the material substrate A, each bar-shaped material substrate A is formed along each vertical break groove A4 as shown in FIG.
After each break, the left and right longitudinal sides of the rod-shaped substrate A1, that is, the left and right sides 2a and 2b of each insulating substrate 2 of the rod-shaped substrate A1,
As shown in FIG. 7, the side electrode 5b made of a conductive paste is formed by the same method as in the related art.

In this case, as described above, the slit-shaped through-holes A having a width S are provided between the respective bar-shaped material substrates A1 of the material substrate A and in the respective discarded insulating substrates 2 '.
6 is formed so as to extend along the longitudinal direction of the rod-shaped material substrate A1, so that the left and right side surfaces 2a 'and 2b' of each discarded insulating substrate 2 'at both ends of the rod-shaped material substrate A1.
Are longer than the left and right longitudinal sides of the rod-shaped material substrate A1, that is, both the left and right side surfaces 2a and 2b of the insulating substrate 2 of the rod-shaped material substrate A1.
Is inwardly recessed by half the dimension of the width S (S / 2) of the rod-shaped material substrate A1, for example, as described in Japanese Patent Publication No. 3-52201. By pressing the left and right side surfaces 2a and 2b of each insulating substrate 2 of the rod-shaped material substrate A1 into a long groove which is engraved on the surface of the roller and filled with a conductive paste, the both side surfaces of each insulating substrate 2 are formed. 2
When the conductive paste for the side electrode is applied to a and 2b, both ends of the rod-shaped material substrate A1 are clamped, and the rod-shaped material substrate A1 is displaced in the axial direction of the roller with respect to the long groove in the roller. In other words, in other words, even if the application length of the conductive paste along the longitudinal direction with respect to the left and right longitudinal sides of the rod-shaped material substrate is shifted along the longitudinal direction of both the left and right longitudinal sides, each of the waste insulating substrates 2 ′ It is possible to reliably prevent the side electrode 5b from being formed on the left and right side surfaces 2a 'and 2b' over a long length. In other words, the left and right side surfaces 2a 'and 2a'
The side electrode 5b formed in 2b 'can be made extremely short.

As described above, when the side electrodes 5b are formed on the rod-shaped raw material substrate A1, the rod-shaped raw material substrate A1 is divided into the respective insulating substrates 2 and the respective discarded insulating substrates 2 'along the horizontal break grooves A5. Break, then the insulating substrate 2
Are subjected to a nickel plating process using a barrel, and then a soldering or tin plating process is performed using a barrel, so that the surface of both upper surface electrodes 5a and both side surface electrodes 5b on each insulating substrate 2 is coated with nickel as a base. A metal plating layer including a plating layer is formed to obtain a finished product of the chip resistor 1.

By the way, in this finished product, defective products due to the discarded insulating substrate 2 'used at both ends of the rod-shaped material substrate A1 are mixed. Since the side electrode 5b is not formed over a long length, the nickel contained in the plating can be kept to a very small amount during the plating process. In the case of sorting from non-defective products according to 2, the sorting device using magnets can perform sorting quickly, efficiently, reliably and with high accuracy.

In this embodiment, the discarded insulating substrates provided integrally at both ends of the rod-shaped material substrate A1 are, as shown in FIG. 8, a first discarded insulating substrate 2 'and a second discarded insulating substrate 2 ". And a slit-shaped through-hole A6 is provided only in the first discarded insulating substrate 2 ', or as shown by a two-dot chain line, The through hole A6 "may be provided so as to extend over each of the plurality of discarded insulating substrates 2 ', 2".

According to the experiment of the present inventor, as shown in FIG. 10, the width W 'of the waste insulating substrate 2' is set to be larger or smaller than the width W of each insulating substrate 2. However, when the width W 'of the discarded insulating substrate 2' is larger or smaller than the width W of each insulating substrate 2, the rod-shaped material substrate A1 may be replaced with, for example, Japanese Utility Model 3-39745. As described in Japanese Unexamined Patent Application Publication No. Hei 6-44081, the paper is fed between a pair of large and small rollers, or as described in Japanese Utility Model Publication No. 6-44081. When each insulating substrate 2 and each discarded insulating substrate 2 'are broken along the break groove A5, the boundary between the insulating substrate 2 and each discarded insulating substrate 2' is broken as shown by a solid line B in FIG. Since the degree is increased, the width dimension W "
As a result, the incidence of defective products larger than the predetermined value W increases.

On the other hand, as shown in FIGS. 3 to 8, the width W 'of the waste insulating substrate 2' is equal to or substantially equal to the width W of each insulating substrate 2. In such a case, the rod-shaped material substrate A1 is, for example, as described in Japanese Utility Model Publication No. 3-39745 or the like.
By feeding between the pair of large and small rollers, each insulating substrate 2 and each discarded insulating substrate 2 ′ along the horizontal break groove A5.
When breaking each time, the boundary between the insulating substrate 2 and the discarded insulating substrate 2 ′ is broken almost straight from the lateral break groove A <b> 5 toward the back surface, and the frequency of breaking as shown by the solid line B in FIG. 10 is reduced. Therefore, it is possible to significantly reduce the occurrence of defective products whose width is increased beyond the predetermined value W.

Further, one end of the slit-shaped through hole A6 provided for the waste insulating substrate 2 'is
As shown in FIG. 5, by being configured to be continuous with the lateral break groove A5 between the insulating substrate 2 and the discarded insulating substrate 2 ', both left and right longitudinal side surfaces of the rod-shaped substrate A1, that is, each of the rod-shaped substrate A1 When forming the side electrodes 5b on the left and right side surfaces 2a, 2b of the insulating substrate 2,
The formation of the side electrodes 5b on the left and right side surfaces 2a 'and 2b' of the discarded insulating substrate 2 'can be eliminated.

FIGS. 12 to 14 show an embodiment of the multiple chip type resistor 11 shown in FIG. In FIG. 12, reference numeral A ′ denotes a material substrate used for manufacturing the multiple chip type resistor 11, and the material substrate A ′ is the same as the above-described embodiment. A large number of insulating substrates 12 constituting the chip-type resistor 11 are arranged side by side in the horizontal direction and integrated to form a rod-shaped material substrate A1 ', and furthermore, a plurality of the rod-shaped material substrates A1' are arranged and integrated. At least one discarded insulating substrate 12 'having the same size as each of the insulating substrates 12 is integrally provided on each of the left and right ends of each bar-shaped raw substrate A1' in the raw substrate A '. A ', a slit-shaped through-hole A is provided between each rod-shaped material substrate A1' and in each discarded insulating substrate 12 '.
6 'is provided so as to extend along the longitudinal direction of the rod-shaped material substrate A1'.

In addition, margins A2 'and A3' are integrally provided around the material substrate A ', and the material substrate A' is provided with A plurality of vertical break grooves A4 'for breaking each material substrate A1' and a plurality of horizontal break grooves A4 'for breaking each rod-shaped material substrate A1' for each insulating substrate 12 and each discarded insulating substrate 12 '. A break groove A5 'is engraved.

Then, in the same manner as in the above embodiment, a portion of each insulating substrate 12 on the upper surface of the material substrate A 'is
After each step of forming the resistive film 13, the upper electrode 15a and the cover coat 14, this material substrate A 'is
Breaking is performed for each bar-shaped material substrate A1 'along the vertical break groove A4'. Next, the left and right longitudinal sides of the rod-shaped material substrate A1 ', that is, the rod-shaped material substrate A1'
After the step of forming side electrodes 15b on the left and right side surfaces 12a and 12b of each insulating substrate 12, the rod-shaped material substrate A1 'is separated from each insulating substrate 12 and each waste insulating material along a horizontal break groove A5'. By breaking each substrate 12 'and applying a metal plating process, FIG.
Is a completed product of the multiple chip type resistor 11 shown in FIG.

Also in this case, a slit-shaped through-hole A6 'is formed between the rod-shaped material substrates A1' and the discarded insulating substrates 12 'in the material substrate A'. Is formed so as to extend along the longitudinal direction of the rod-shaped material substrate A1 ', that is, with respect to the left and right side surfaces 12a and 12b of the insulating substrate 12 of the rod-shaped material substrate A1'. When the side electrode 15b is formed, it is possible to reliably prevent the side electrode 15b from being formed on the left and right side surfaces 12a and 12b of each of the waste insulating substrates 12 over a long length.

In this embodiment, the discarded insulating substrates provided integrally at both ends of the rod-shaped material substrate A1 'are also used.
As shown in FIG. 13, the first discarded insulating substrate 12 'and the second
A plurality of discarded insulating substrates 12 ″ of the same type, and a slit-shaped through-hole A6 ′ is provided only in the first discarded insulating substrate 12 ′, or by a two-dot chain line. As shown, a slit-shaped through-hole may be provided over a plurality of discarded insulating substrates 12 ', 12 ".

Further, as shown in FIG. 14, by setting the width W1 of the waste insulating substrate 12 'equal to or substantially equal to the width W0 of the insulating substrate 12, the incidence of defective products can be reduced. Or to configure
Alternatively, one end of the slit-shaped through-hole A6 'provided for the discarded insulating substrate 12' is connected to a lateral break groove A5 'between the insulating substrate 12 and the discarded insulating substrate 12', whereby Needless to say, it is possible to completely eliminate the formation of the side electrode 5b on the left and right side surfaces 12a 'and 12b' of the discarded insulating substrate 12 '.

[Brief description of the drawings]

FIG. 1 is a perspective view showing a chip resistor.

FIG. 2 is a perspective view showing a multiple chip type resistor.

FIG. 3 is a perspective view of a material substrate used in manufacturing the chip resistor of FIG. 1 in the first embodiment of the present invention.

FIG. 4 is a perspective view showing a state in which an upper surface electrode is formed on the upper surface of the material substrate of FIG. 3;

FIG. 5 is a perspective view showing a state in which a resistive film and a cover coat are formed on the upper surface of the material substrate of FIG. 3;

FIG. 6 is a perspective view showing a state in which the material substrate of FIG. 3 is broken for each rod-shaped material substrate.

FIG. 7 is a perspective view showing a state in which side electrodes are formed on the rod-shaped material substrate of FIG. 6;

FIG. 8 is a plan view showing a modification of the material substrate used in the first embodiment of the present invention.

FIG. 9 is a plan view showing another modification of the material substrate used in the first embodiment of the present invention.

FIG. 10 is a sectional view taken along line XX of FIG. 9;

FIG. 11 is a plan view showing still another modification of the material substrate used in the first embodiment of the present invention.

FIG. 12 is a plan view of a material substrate used in manufacturing the multiple chip resistor of FIG. 2 in the second embodiment of the present invention.

FIG. 13 is a plan view showing a modification of the material substrate used in the second embodiment of the present invention.

FIG. 14 is a plan view showing another modification of the material substrate used in the second embodiment of the present invention.

FIG. 15 is a perspective view of a material substrate used for manufacturing the chip resistor of FIG. 1 in a conventional method.

FIG. 16 is a perspective view showing a state in which an upper surface electrode is formed on the upper surface of the material substrate of FIG. 15;

FIG. 17 is a perspective view showing a state in which a resistive film and a cover coat are formed on the upper surface of the material substrate of FIG. 15;

18 is a perspective view showing a state in which the material substrate of FIG. 15 is broken on a rod-shaped material substrate.

FIG. 19 is a perspective view showing a state in which side electrodes are formed on the rod-shaped material substrate of FIG. 18;

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Chip type resistor 2 Insulating substrate 2a, 2b Side surface of insulating substrate 3 Resistive film 4 Cover coat 5 Terminal electrode 5a Top electrode among terminal electrodes 5b Side electrode among terminal electrodes 11 Multiple chip resistors 12 Insulating substrate 12a , 12b Side surface of insulating substrate 13 Resistive film 14 Cover coat 15 Terminal electrode 15a Upper electrode among terminal electrodes 15b Side electrode among terminal electrodes A, A 'Material substrate A1, A1' Rod material substrate A4, A4 'Vertical break groove A5 , A5 'Horizontal break groove A6, A6' Slit-shaped through hole

Claims (4)

[Claims] 1. A plurality of chip-shaped insulating substrates are arranged side by side and integrated, and a plurality of rod-shaped material substrates integrally provided with at least one discarded insulating substrate at each end are arranged in parallel with each other and integrated. A step of forming a material substrate formed by forming, a step of forming a resistive film, a top electrode, and a cover coat on each insulating substrate on the surface of the material substrate; and forming the material substrate for each rod-shaped material substrate. Breaking process and both longitudinal side surfaces of the rod-shaped material substrate, that is,
A chip type comprising: a step of forming side electrodes on both side surfaces of each insulating substrate of the rod-shaped material substrate; and a step of performing a metal plating process after breaking the rod-shaped material substrate for each of the insulating substrates and the discarded insulating substrates. In the method of manufacturing a resistor, before forming a resistive film or the like on the material substrate, a slit-shaped through hole is formed in a portion of the discarded insulating substrate between the respective bar-shaped material substrates in a longitudinal direction of the bar-shaped material substrate. A method of manufacturing a chip-type resistor, wherein the chip-type resistor is provided so as to extend along the same. 2. A plurality of bar-shaped material substrates, each of which includes a plurality of chip-type insulating substrates arranged side by side and integrated with each other and at least one discarded insulating substrate integrally provided at each end thereof, is arranged in parallel with each other and integrated. In the raw material substrate, a slit-shaped through-hole extends along the longitudinal direction of the rod-shaped raw material substrate between the respective rod-shaped raw material substrates of the raw material substrate, and in each of the discarded insulating substrates. The structure of a material substrate used for manufacturing a chip type resistor characterized by being drilled. 3. A material substrate for use in the manufacture of a chip type resistor according to claim 2, wherein a lateral width of said waste insulating substrate is equal to or substantially equal to a lateral width of each insulating substrate. Construction. 4. A material substrate for use in the manufacture of a chip resistor according to claim 2, wherein one end of the slit-shaped through hole is continuous with a break groove between the insulating substrate and the discarded insulating substrate. Structure.