JPH0365278U - - Google Patents
Info
- Publication number
- JPH0365278U JPH0365278U JP12683389U JP12683389U JPH0365278U JP H0365278 U JPH0365278 U JP H0365278U JP 12683389 U JP12683389 U JP 12683389U JP 12683389 U JP12683389 U JP 12683389U JP H0365278 U JPH0365278 U JP H0365278U
- Authority
- JP
- Japan
- Prior art keywords
- cream solder
- circuit board
- predetermined position
- spraying
- nozzle
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000006071 cream Substances 0.000 claims description 12
- 229910000679 solder Inorganic materials 0.000 claims description 12
- 238000005507 spraying Methods 0.000 claims 2
- 238000010586 diagram Methods 0.000 description 2
- 238000002347 injection Methods 0.000 description 1
- 239000007924 injection Substances 0.000 description 1
- 239000007921 spray Substances 0.000 description 1
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Description
第１図は本考案のクリーム半田塗布装置の実施
例を示す全体構成図、第２図は回路基板の配線パ
ターンの所定部分へのクリーム半田の塗布状態を
示す断面図、第３図は回路基板にチツプ部品が実
装される際のクリーム半田の塗布状態を示す断面
図、第４図は回路基板にリード線付部品が実装さ
れる際のクリーム半田の塗布状態を示す断面図、
第５図は従来例のクリーム半田の塗布状態を説明
する説明図である。
１０……基台、１１ａ，１１ｂ，１１ｃ……枠
部材、１２ａ，１２ｂ，１２ｃ……溝、１４……
マスク、１６……配線パターン群、１６ａ，１６
ｂ……部位、１９……クリーム半田噴射部、２０
……ノズル、２５……チツプ部品、Ｐ……貫通孔
群、Ｐｃ……回路基板、Ｓｄ……噴射クリーム半
田、Ｓｐ……クリーム半田。
Fig. 1 is an overall configuration diagram showing an embodiment of the cream solder applicator of the present invention, Fig. 2 is a sectional view showing the state of applying cream solder to a predetermined portion of the wiring pattern of a circuit board, and Fig. 3 is a circuit board FIG. 4 is a cross-sectional view showing the state of application of cream solder when a chip component is mounted on a circuit board; FIG.
FIG. 5 is an explanatory diagram illustrating the application state of cream solder in a conventional example. 10...Base, 11a, 11b, 11c...Frame member, 12a, 12b, 12c...Groove, 14...
Mask, 16...Wiring pattern group, 16a, 16
b...Part, 19...Cream solder injection part, 20
... Nozzle, 25 ... Chip parts, P ... Through hole group, Pc ... Circuit board, Sd ... Cream solder spray, Sp ... Cream solder.
Claims (1)
リーム半田が塗布される所定位置に対応した貫通
孔が形成されるマスクと、 前記貫通孔を介して回路基板の前記所定位置に
クリーム半田を塗布すべく、ノズルを介してクリ
ーム半田を噴射せしめるクリーム半田噴射手段と
、 を具備することを特徴とするクリーム半田塗布装
置。[Claims for Utility Model Registration] A mask disposed on the upper part of a circuit board, in which a through hole is formed corresponding to a predetermined position on the circuit board where cream solder is applied; A cream solder application device comprising: cream solder spraying means for spraying cream solder through a nozzle in order to apply cream solder to the predetermined position.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12683389U JPH0365278U (en) | 1989-10-30 | 1989-10-30 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12683389U JPH0365278U (en) | 1989-10-30 | 1989-10-30 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0365278U true JPH0365278U (en) | 1991-06-25 |
Family
ID=31674623
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP12683389U Pending JPH0365278U (en) | 1989-10-30 | 1989-10-30 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0365278U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2003102256A (en) * | 2001-09-28 | 2003-04-08 | Hasegawa Taiiku Shisetsu Corp | Method for creating natural turf surface |
| JP2007217898A (en) * | 2006-02-14 | 2007-08-30 | Toa Doro Kogyo Co Ltd | Greening pavement structure |
-
1989
- 1989-10-30 JP JP12683389U patent/JPH0365278U/ja active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2003102256A (en) * | 2001-09-28 | 2003-04-08 | Hasegawa Taiiku Shisetsu Corp | Method for creating natural turf surface |
| JP2007217898A (en) * | 2006-02-14 | 2007-08-30 | Toa Doro Kogyo Co Ltd | Greening pavement structure |