JPH0459973U - - Google Patents

Info

Publication number
JPH0459973U
JPH0459973U JP10300190U JP10300190U JPH0459973U JP H0459973 U JPH0459973 U JP H0459973U JP 10300190 U JP10300190 U JP 10300190U JP 10300190 U JP10300190 U JP 10300190U JP H0459973 U JPH0459973 U JP H0459973U
Authority
JP
Japan
Prior art keywords
electrode
hole
circuit board
thick film
straddle
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP10300190U
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP10300190U priority Critical patent/JPH0459973U/ja
Publication of JPH0459973U publication Critical patent/JPH0459973U/ja
Pending legal-status Critical Current

Links

Landscapes

  • Structure Of Printed Boards (AREA)

Description

【図面の簡単な説明】[Brief explanation of the drawing]

第1図は本考案の一実施例の平面図、第2図は
第1図のA部分の平面図、第3図は第2図の−
断面斜視図、第4図は電極パターン形成装置の
縦断面概略図、第5図は従来例の第2図に相当す
るである。 1……厚膜回路基板、2……基板部、3……縁
部、4……分割用溝、6……スルーホール、9…
…周囲電極。
Fig. 1 is a plan view of an embodiment of the present invention, Fig. 2 is a plan view of part A in Fig. 1, and Fig. 3 is a plan view of the section A in Fig. 2.
4 is a cross-sectional perspective view, FIG. 4 is a schematic vertical cross-sectional view of the electrode pattern forming apparatus, and FIG. 5 corresponds to FIG. 2 of the conventional example. DESCRIPTION OF SYMBOLS 1... Thick film circuit board, 2... Substrate part, 3... Edge, 4... Dividing groove, 6... Through hole, 9...
...surrounding electrode.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 基板を分割するために形成した分割溝に跨がる
ように複数個のスルーホールを形成し、該スルー
ホールの上面周囲に位置した上部電極と内面に形
成されたスルーホール電極とが互いに導通一体化
した厚膜回路基板であつて、前記上面電極が分割
溝内に存在する電極部位で幅狭に形成されている
ことを特徴とする厚膜回路基板。
A plurality of through holes are formed so as to straddle the dividing grooves formed to divide the substrate, and the upper electrode located around the upper surface of the through hole and the through hole electrode formed on the inner surface are electrically connected to each other. 1. A thick film circuit board characterized in that the upper surface electrode is formed to have a narrow width at an electrode portion existing in the dividing groove.
JP10300190U 1990-09-28 1990-09-28 Pending JPH0459973U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP10300190U JPH0459973U (en) 1990-09-28 1990-09-28

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP10300190U JPH0459973U (en) 1990-09-28 1990-09-28

Publications (1)

Publication Number Publication Date
JPH0459973U true JPH0459973U (en) 1992-05-22

Family

ID=31847713

Family Applications (1)

Application Number Title Priority Date Filing Date
JP10300190U Pending JPH0459973U (en) 1990-09-28 1990-09-28

Country Status (1)

Country Link
JP (1) JPH0459973U (en)

Similar Documents

Publication Publication Date Title
JPH0459973U (en)
JPH0238161U (en)
JPS6331572U (en)
JPH0361372U (en)
JPS6398675U (en)
JPH0396065U (en)
JPH0348262U (en)
JPS61205175U (en)
JPH02127064U (en)
JPS61140569U (en)
JPS6357772U (en)
JPS6163863U (en)
JPS6280371U (en)
JPH03124675U (en)
JPS63105370U (en)
JPS6274335U (en)
JPH02138902U (en)
JPH04774U (en)
JPH0233471U (en)
JPH0390466U (en)
JPH03106741U (en)
JPS62191155U (en)
JPH02110174U (en)
JPH0470759U (en)
JPS6287478U (en)