JPH04592B2 - - Google Patents
Info
- Publication number
- JPH04592B2 JPH04592B2 JP23768983A JP23768983A JPH04592B2 JP H04592 B2 JPH04592 B2 JP H04592B2 JP 23768983 A JP23768983 A JP 23768983A JP 23768983 A JP23768983 A JP 23768983A JP H04592 B2 JPH04592 B2 JP H04592B2
- Authority
- JP
- Japan
- Prior art keywords
- lead frame
- guide rail
- lead
- movable
- inner guide
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 210000000078 claw Anatomy 0.000 claims description 35
- 238000000465 moulding Methods 0.000 claims description 25
- 239000004065 semiconductor Substances 0.000 claims description 7
- 239000011347 resin Substances 0.000 claims description 4
- 229920005989 resin Polymers 0.000 claims description 4
- 238000007789 sealing Methods 0.000 claims description 4
- 238000004519 manufacturing process Methods 0.000 description 7
- 238000000034 method Methods 0.000 description 5
- 238000010586 diagram Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000012423 maintenance Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Specific Conveyance Elements (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP23768983A JPS60130128A (ja) | 1983-12-16 | 1983-12-16 | リ−ドフレ−ム供給装置 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP23768983A JPS60130128A (ja) | 1983-12-16 | 1983-12-16 | リ−ドフレ−ム供給装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS60130128A JPS60130128A (ja) | 1985-07-11 |
JPH04592B2 true JPH04592B2 (ko) | 1992-01-08 |
Family
ID=17019048
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP23768983A Granted JPS60130128A (ja) | 1983-12-16 | 1983-12-16 | リ−ドフレ−ム供給装置 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS60130128A (ko) |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6197835U (ko) * | 1984-11-30 | 1986-06-23 | ||
US5264002A (en) * | 1990-04-23 | 1993-11-23 | Mitsubishi Danki Kabushiki Kaisha | Method for conveying semiconductor lead frame strip with an apparatus having vertically movable guide rails |
JPH0770550B2 (ja) * | 1990-04-23 | 1995-07-31 | 三菱電機株式会社 | 半導体フレームの搬送装置および搬送方法 |
-
1983
- 1983-12-16 JP JP23768983A patent/JPS60130128A/ja active Granted
Also Published As
Publication number | Publication date |
---|---|
JPS60130128A (ja) | 1985-07-11 |
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