JPH0459180U - - Google Patents
Info
- Publication number
- JPH0459180U JPH0459180U JP10064290U JP10064290U JPH0459180U JP H0459180 U JPH0459180 U JP H0459180U JP 10064290 U JP10064290 U JP 10064290U JP 10064290 U JP10064290 U JP 10064290U JP H0459180 U JPH0459180 U JP H0459180U
- Authority
- JP
- Japan
- Prior art keywords
- substrate
- recess
- electrode pattern
- conductive agent
- electronic component
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000000758 substrate Substances 0.000 claims description 8
- 239000006258 conductive agent Substances 0.000 claims 4
- 238000000034 method Methods 0.000 description 1
- 238000007649 pad printing Methods 0.000 description 1
Landscapes
- Manufacturing Of Printed Wiring (AREA)
Description
第１図は本考案の一実施例を示す概略斜視図、
第２図は第１図の基板を用いて形成された電極部
の拡大平面図、第３図は本考案の他の実施例を示
す概略断面図、第４図は電極パターンが形成され
た基板に電子部品を搭載した例を示す概略斜視図
、第５図及び第６図は、それぞれ、従来の基板を
用いたタンポ印刷工程を示す概略断面図、第７図
は、タンポ印刷により電極パターンが形成された
従来の電子部品の基板を示す概略斜視図である。
１，１１，２１……基板、２，１２，２２……
凹部、３，２３ａ，２３ｂ，２３ｃ，２３ｄ……
小孔部、１３……アール部。
FIG. 1 is a schematic perspective view showing an embodiment of the present invention;
FIG. 2 is an enlarged plan view of an electrode part formed using the substrate of FIG. 1, FIG. 3 is a schematic sectional view showing another embodiment of the present invention, and FIG. 4 is a substrate on which an electrode pattern is formed. 5 and 6 are respectively schematic cross-sectional views showing the pad printing process using a conventional board, and FIG. 7 is a schematic perspective view showing an example in which electronic components are mounted on a board. 1 is a schematic perspective view showing a conventional electronic component substrate formed; FIG. 1, 11, 21... board, 2, 12, 22...
Recessed portions, 3, 23a, 23b, 23c, 23d...
Small hole part, 13...R part.
Claims (1)
塗布された弾性体を基板の凹部に押圧し、前記導
電剤を転移させることにより、前記凹部に電極パ
ターンを形成する基板であつて、前記基板の凹部
のコーナー部またはその近傍に小孔部が形成され
ていることを特徴とする電子部品の基板。 ２ 電極パターンに対応して印刷可能な導電剤が
塗布された弾性体を基板の凹部に押圧し、前記導
電剤を転移させることにより、前記凹部に電極パ
ターンを形成する基板であつて、前記基板の凹部
のコーナー部がアールに形成されていることを特
徴とする電子部品の基板。[Claims for Utility Model Registration] 1. Forming an electrode pattern in the recess by pressing an elastic body coated with a printable conductive agent corresponding to the electrode pattern into the recess of the substrate and transferring the conductive agent. 1. A substrate for an electronic component, characterized in that a small hole is formed at or near a corner of a recessed portion of the substrate. 2. A substrate on which an electrode pattern is formed in the recess by pressing an elastic body coated with a printable conductive agent corresponding to the electrode pattern into the recess of the substrate and transferring the conductive agent. A board for an electronic component, characterized in that the corners of the concave portions are rounded.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1990100642U JP2504978Y2 (en) | 1990-09-25 | 1990-09-25 | Electronic component board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1990100642U JP2504978Y2 (en) | 1990-09-25 | 1990-09-25 | Electronic component board |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0459180U true JPH0459180U (en) | 1992-05-21 |
| JP2504978Y2 JP2504978Y2 (en) | 1996-07-24 |
Family
ID=31843435
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1990100642U Expired - Fee Related JP2504978Y2 (en) | 1990-09-25 | 1990-09-25 | Electronic component board |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2504978Y2 (en) |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6351397A (en) * | 1986-08-20 | 1988-03-04 | Rikagaku Kenkyusho | Lewis type-a glycolipid and production thereof |
| JPH0241189A (en) * | 1988-08-01 | 1990-02-09 | Kokusai Chiteki Shiyoyuuken Kenkyusho:Kk | Tile for combination game device |
-
1990
- 1990-09-25 JP JP1990100642U patent/JP2504978Y2/en not_active Expired - Fee Related
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6351397A (en) * | 1986-08-20 | 1988-03-04 | Rikagaku Kenkyusho | Lewis type-a glycolipid and production thereof |
| JPH0241189A (en) * | 1988-08-01 | 1990-02-09 | Kokusai Chiteki Shiyoyuuken Kenkyusho:Kk | Tile for combination game device |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2504978Y2 (en) | 1996-07-24 |
Similar Documents
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| LAPS | Cancellation because of no payment of annual fees |