JPH0459070B2 - - Google Patents

Info

Publication number
JPH0459070B2
JPH0459070B2 JP63248408A JP24840888A JPH0459070B2 JP H0459070 B2 JPH0459070 B2 JP H0459070B2 JP 63248408 A JP63248408 A JP 63248408A JP 24840888 A JP24840888 A JP 24840888A JP H0459070 B2 JPH0459070 B2 JP H0459070B2
Authority
JP
Japan
Prior art keywords
soldering
board
nozzle
solder
molten solder
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP63248408A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0299268A (ja
Inventor
Senichi Yokota
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
YOKOTA KIKAI KK
Original Assignee
YOKOTA KIKAI KK
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by YOKOTA KIKAI KK filed Critical YOKOTA KIKAI KK
Priority to JP24840888A priority Critical patent/JPH0299268A/ja
Publication of JPH0299268A publication Critical patent/JPH0299268A/ja
Publication of JPH0459070B2 publication Critical patent/JPH0459070B2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Molten Solder (AREA)
JP24840888A 1988-09-30 1988-09-30 自動半田付け方法及び装置 Granted JPH0299268A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP24840888A JPH0299268A (ja) 1988-09-30 1988-09-30 自動半田付け方法及び装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP24840888A JPH0299268A (ja) 1988-09-30 1988-09-30 自動半田付け方法及び装置

Publications (2)

Publication Number Publication Date
JPH0299268A JPH0299268A (ja) 1990-04-11
JPH0459070B2 true JPH0459070B2 (cs) 1992-09-21

Family

ID=17177670

Family Applications (1)

Application Number Title Priority Date Filing Date
JP24840888A Granted JPH0299268A (ja) 1988-09-30 1988-09-30 自動半田付け方法及び装置

Country Status (1)

Country Link
JP (1) JPH0299268A (cs)

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6113157U (ja) * 1984-06-26 1986-01-25 株式会社日立ホームテック 熱交換器

Also Published As

Publication number Publication date
JPH0299268A (ja) 1990-04-11

Similar Documents

Publication Publication Date Title
EP3183086B1 (en) Wave soldering nozzle system and method of wave soldering
JPH08507254A (ja) ガスナイフジェットを備えるはんだノズル
JPWO2011105034A1 (ja) 半田付け装置
US6364195B1 (en) Brazing Apparatus
US20020027157A1 (en) Solder dross removal apparatus and method
US6513702B2 (en) Automatic wave soldering apparatus and method
US20010030220A1 (en) Apparatus and methods for wave soldering
US6890430B2 (en) Solder dross removal apparatus and method
JPH0459070B2 (cs)
JPH0263679A (ja) 自動半田付け方法及び装置
EP0377336B1 (en) An automatic soldering method and the apparatus thereof
JP3917665B2 (ja) ろう付け装置
TW202320945A (zh) 焊料處理裝置
JP4414642B2 (ja) はんだ付け装置
US6817510B2 (en) Apparatus for increasing wave height of molten solder in solder bath
JP2003025063A (ja) 半田付け方法及び半田付け装置
JPH035069A (ja) 自動半田付け装置
JPH0469510B2 (cs)
JP2531122B2 (ja) 噴流式はんだ付け装置
JP4554748B2 (ja) ろう付け方法およびその装置
JP2938328B2 (ja) はんだ付け方法およびその装置
JP3725579B2 (ja) 噴流式はんだ付け装置
JP2815777B2 (ja) 噴流式半田付け装置
JP2004106028A (ja) はんだ付け装置
JPH06142903A (ja) 半田装置