JPH0299268A - 自動半田付け方法及び装置 - Google Patents

自動半田付け方法及び装置

Info

Publication number
JPH0299268A
JPH0299268A JP24840888A JP24840888A JPH0299268A JP H0299268 A JPH0299268 A JP H0299268A JP 24840888 A JP24840888 A JP 24840888A JP 24840888 A JP24840888 A JP 24840888A JP H0299268 A JPH0299268 A JP H0299268A
Authority
JP
Japan
Prior art keywords
board
soldering
circuit board
nozzle
molten solder
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP24840888A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0459070B2 (cs
Inventor
Senichi Yokota
横田　仙一
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
YOKOTA KIKAI KK
Original Assignee
YOKOTA KIKAI KK
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by YOKOTA KIKAI KK filed Critical YOKOTA KIKAI KK
Priority to JP24840888A priority Critical patent/JPH0299268A/ja
Publication of JPH0299268A publication Critical patent/JPH0299268A/ja
Publication of JPH0459070B2 publication Critical patent/JPH0459070B2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Molten Solder (AREA)
JP24840888A 1988-09-30 1988-09-30 自動半田付け方法及び装置 Granted JPH0299268A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP24840888A JPH0299268A (ja) 1988-09-30 1988-09-30 自動半田付け方法及び装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP24840888A JPH0299268A (ja) 1988-09-30 1988-09-30 自動半田付け方法及び装置

Publications (2)

Publication Number Publication Date
JPH0299268A true JPH0299268A (ja) 1990-04-11
JPH0459070B2 JPH0459070B2 (cs) 1992-09-21

Family

ID=17177670

Family Applications (1)

Application Number Title Priority Date Filing Date
JP24840888A Granted JPH0299268A (ja) 1988-09-30 1988-09-30 自動半田付け方法及び装置

Country Status (1)

Country Link
JP (1) JPH0299268A (cs)

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6113157U (ja) * 1984-06-26 1986-01-25 株式会社日立ホームテック 熱交換器

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6113157U (ja) * 1984-06-26 1986-01-25 株式会社日立ホームテック 熱交換器

Also Published As

Publication number Publication date
JPH0459070B2 (cs) 1992-09-21

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