JPH0458189B2 - - Google Patents

Info

Publication number
JPH0458189B2
JPH0458189B2 JP58130521A JP13052183A JPH0458189B2 JP H0458189 B2 JPH0458189 B2 JP H0458189B2 JP 58130521 A JP58130521 A JP 58130521A JP 13052183 A JP13052183 A JP 13052183A JP H0458189 B2 JPH0458189 B2 JP H0458189B2
Authority
JP
Japan
Prior art keywords
insulating substrate
board
sub
recess
semiconductor element
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP58130521A
Other languages
English (en)
Japanese (ja)
Other versions
JPS6022348A (ja
Inventor
Fumio Takeyama
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Rohm Co Ltd
Original Assignee
Rohm Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Rohm Co Ltd filed Critical Rohm Co Ltd
Priority to JP58130521A priority Critical patent/JPS6022348A/ja
Publication of JPS6022348A publication Critical patent/JPS6022348A/ja
Publication of JPH0458189B2 publication Critical patent/JPH0458189B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H10W70/657—
    • H10W44/00—
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/14—Structural association of two or more printed circuits
    • H05K1/141—One or more single auxiliary printed circuits mounted on a main printed circuit, e.g. modules, adapters
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/181—Printed circuits structurally associated with non-printed electric components associated with surface mounted components
    • H10W72/07551—
    • H10W72/50—
    • H10W72/536—
    • H10W72/5363—
    • H10W72/5522—
    • H10W74/00—
    • H10W90/754—
JP58130521A 1983-07-18 1983-07-18 半導体装置 Granted JPS6022348A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP58130521A JPS6022348A (ja) 1983-07-18 1983-07-18 半導体装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP58130521A JPS6022348A (ja) 1983-07-18 1983-07-18 半導体装置

Publications (2)

Publication Number Publication Date
JPS6022348A JPS6022348A (ja) 1985-02-04
JPH0458189B2 true JPH0458189B2 (cg-RX-API-DMAC10.html) 1992-09-16

Family

ID=15036282

Family Applications (1)

Application Number Title Priority Date Filing Date
JP58130521A Granted JPS6022348A (ja) 1983-07-18 1983-07-18 半導体装置

Country Status (1)

Country Link
JP (1) JPS6022348A (cg-RX-API-DMAC10.html)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6088574U (ja) * 1983-11-24 1985-06-18 日本電気株式会社 チツプキヤリア型パツケ−ジ接続構造
US5444296A (en) * 1993-11-22 1995-08-22 Sun Microsystems, Inc. Ball grid array packages for high speed applications
US5666272A (en) * 1994-11-29 1997-09-09 Sgs-Thomson Microelectronics, Inc. Detachable module/ball grid array package
US5825084A (en) * 1996-08-22 1998-10-20 Express Packaging Systems, Inc. Single-core two-side substrate with u-strip and co-planar signal traces, and power and ground planes through split-wrap-around (SWA) or split-via-connections (SVC) for packaging IC devices

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5146920Y2 (cg-RX-API-DMAC10.html) * 1971-06-30 1976-11-12

Also Published As

Publication number Publication date
JPS6022348A (ja) 1985-02-04

Similar Documents

Publication Publication Date Title
EP0144343A1 (en) Integrated circuit module and method of making same
JPH11233684A (ja) 半導体装置用基板、半導体装置及びその製造方法並びに電子機器
JPH0458189B2 (cg-RX-API-DMAC10.html)
JPS6227544B2 (cg-RX-API-DMAC10.html)
JPH05327249A (ja) 電子回路モジュール及びその製造方法
JPH0451064B2 (cg-RX-API-DMAC10.html)
JPH01143389A (ja) ハイブリッド集積回路装置
JPH0817960A (ja) Ｑｆｐ構造半導体装置
JP2541494B2 (ja) 半導体装置
JP2809191B2 (ja) 半導体チップの実装方法
JPH11307303A (ja) チップ部品
JPH10150065A (ja) チップサイズパッケージ
JP2879503B2 (ja) 面実装型電子回路装置
JP2544272Y2 (ja) 混成集積回路
JP2842013B2 (ja) 混成集積回路装置
JPH0519974Y2 (cg-RX-API-DMAC10.html)
JPH0528917B2 (cg-RX-API-DMAC10.html)
JPH041744Y2 (cg-RX-API-DMAC10.html)
JPH0451488Y2 (cg-RX-API-DMAC10.html)
JPH0739244Y2 (ja) 混成集積回路装置
JP2599290Y2 (ja) ハイブリッドｉｃ
JPH0558665B2 (cg-RX-API-DMAC10.html)
JPH04181792A (ja) 印刷配線板の接続装置
JPS6258160B2 (cg-RX-API-DMAC10.html)
JPH0521453U (ja) 混成集積回路