JPH0457100B2 - - Google Patents

Info

Publication number
JPH0457100B2
JPH0457100B2 JP60168854A JP16885485A JPH0457100B2 JP H0457100 B2 JPH0457100 B2 JP H0457100B2 JP 60168854 A JP60168854 A JP 60168854A JP 16885485 A JP16885485 A JP 16885485A JP H0457100 B2 JPH0457100 B2 JP H0457100B2
Authority
JP
Japan
Prior art keywords
capillary
bonding
wire
sample
speed
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP60168854A
Other languages
English (en)
Japanese (ja)
Other versions
JPS6230341A (ja
Inventor
Makoto Abe
Masao Kobayashi
Hidenori Pponma
Sadao Noitsushiki
Shitetsu Tamura
Koji Oomura
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujitsu Ltd
Miyachi Systems Co Ltd
Original Assignee
Fujitsu Ltd
Miyachi Systems Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujitsu Ltd, Miyachi Systems Co Ltd filed Critical Fujitsu Ltd
Priority to JP60168854A priority Critical patent/JPS6230341A/ja
Publication of JPS6230341A publication Critical patent/JPS6230341A/ja
Publication of JPH0457100B2 publication Critical patent/JPH0457100B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H10W72/0711—
    • H10W72/07141—
    • H10W72/075—
    • H10W72/07521—
    • H10W72/50—
    • H10W72/5522—

Landscapes

  • Wire Bonding (AREA)
JP60168854A 1985-07-31 1985-07-31 ワイヤボンデイング方法 Granted JPS6230341A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP60168854A JPS6230341A (ja) 1985-07-31 1985-07-31 ワイヤボンデイング方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP60168854A JPS6230341A (ja) 1985-07-31 1985-07-31 ワイヤボンデイング方法

Publications (2)

Publication Number Publication Date
JPS6230341A JPS6230341A (ja) 1987-02-09
JPH0457100B2 true JPH0457100B2 (cg-RX-API-DMAC10.html) 1992-09-10

Family

ID=15875781

Family Applications (1)

Application Number Title Priority Date Filing Date
JP60168854A Granted JPS6230341A (ja) 1985-07-31 1985-07-31 ワイヤボンデイング方法

Country Status (1)

Country Link
JP (1) JPS6230341A (cg-RX-API-DMAC10.html)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0388344A (ja) * 1989-08-31 1991-04-12 Seiko Epson Corp インナーリードのボンディング方法

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5129869A (cg-RX-API-DMAC10.html) * 1974-09-06 1976-03-13 Hitachi Ltd
JPS5563833A (en) * 1978-11-08 1980-05-14 Hitachi Ltd Wire bonding device
JPS5630735A (en) * 1979-08-21 1981-03-27 Nec Corp Wire-bonding device
JPS5651832A (en) * 1979-10-03 1981-05-09 Hitachi Ltd Method and apparatus for wire bonding
JPS5784143A (en) * 1980-11-14 1982-05-26 Toshiba Corp Controlling mechanism of bonder for z axial motion
JPS5758054A (en) * 1981-07-27 1982-04-07 Hitachi Ltd Terminal sealing of suction pipe
JPS5855663A (ja) * 1981-09-30 1983-04-02 株式会社日立製作所 ル−ムエアコン

Also Published As

Publication number Publication date
JPS6230341A (ja) 1987-02-09

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Legal Events

Date Code Title Description
EXPY Cancellation because of completion of term