JPH0456460B2 - - Google Patents

Info

Publication number
JPH0456460B2
JPH0456460B2 JP18447383A JP18447383A JPH0456460B2 JP H0456460 B2 JPH0456460 B2 JP H0456460B2 JP 18447383 A JP18447383 A JP 18447383A JP 18447383 A JP18447383 A JP 18447383A JP H0456460 B2 JPH0456460 B2 JP H0456460B2
Authority
JP
Japan
Prior art keywords
hole
lead frame
punching
punch
stripper
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP18447383A
Other languages
English (en)
Japanese (ja)
Other versions
JPS6077449A (ja
Inventor
Satoru Kobayashi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Tokyo Shibaura Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokyo Shibaura Electric Co Ltd filed Critical Tokyo Shibaura Electric Co Ltd
Priority to JP18447383A priority Critical patent/JPS6077449A/ja
Publication of JPS6077449A publication Critical patent/JPS6077449A/ja
Publication of JPH0456460B2 publication Critical patent/JPH0456460B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the groups H01L21/18 - H01L21/326 or H10D48/04 - H10D48/07
    • H01L21/4814—Conductive parts
    • H01L21/4821—Flat leads, e.g. lead frames with or without insulating supports
    • H01L21/4842—Mechanical treatment, e.g. punching, cutting, deforming, cold welding

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Lead Frames For Integrated Circuits (AREA)
JP18447383A 1983-10-04 1983-10-04 半導体リ−ドフレ−ム用金型 Granted JPS6077449A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP18447383A JPS6077449A (ja) 1983-10-04 1983-10-04 半導体リ−ドフレ−ム用金型

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP18447383A JPS6077449A (ja) 1983-10-04 1983-10-04 半導体リ−ドフレ−ム用金型

Publications (2)

Publication Number Publication Date
JPS6077449A JPS6077449A (ja) 1985-05-02
JPH0456460B2 true JPH0456460B2 (en, 2012) 1992-09-08

Family

ID=16153776

Family Applications (1)

Application Number Title Priority Date Filing Date
JP18447383A Granted JPS6077449A (ja) 1983-10-04 1983-10-04 半導体リ−ドフレ−ム用金型

Country Status (1)

Country Link
JP (1) JPS6077449A (en, 2012)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2800243B2 (ja) * 1989-04-03 1998-09-21 松下電器産業株式会社 プレス加工装置
JP2003258183A (ja) * 2002-03-04 2003-09-12 Shinko Electric Ind Co Ltd リードフレームの製造方法

Also Published As

Publication number Publication date
JPS6077449A (ja) 1985-05-02

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