JPH0453630B2 - - Google Patents

Info

Publication number
JPH0453630B2
JPH0453630B2 JP60245739A JP24573985A JPH0453630B2 JP H0453630 B2 JPH0453630 B2 JP H0453630B2 JP 60245739 A JP60245739 A JP 60245739A JP 24573985 A JP24573985 A JP 24573985A JP H0453630 B2 JPH0453630 B2 JP H0453630B2
Authority
JP
Japan
Prior art keywords
laser
workpiece
spot
laser processing
processing apparatus
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP60245739A
Other languages
English (en)
Japanese (ja)
Other versions
JPS62104692A (ja
Inventor
Seiji Imamura
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fuji Electric Co Ltd
Original Assignee
Fuji Electric Corporate Research and Development Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fuji Electric Corporate Research and Development Ltd filed Critical Fuji Electric Corporate Research and Development Ltd
Priority to JP60245739A priority Critical patent/JPS62104692A/ja
Publication of JPS62104692A publication Critical patent/JPS62104692A/ja
Publication of JPH0453630B2 publication Critical patent/JPH0453630B2/ja
Granted legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
    • B23K26/066—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms by using masks
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/073—Shaping the laser spot
    • B23K26/0732—Shaping the laser spot into a rectangular shape
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/08—Devices involving relative movement between laser beam and workpiece
    • B23K26/083—Devices involving movement of the workpiece in at least one axial direction
    • B23K26/0853—Devices involving movement of the workpiece in at least in two axial directions, e.g. in a plane
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/362—Laser etching
    • B23K26/364—Laser etching for making a groove or trench, e.g. for scribing a break initiation groove
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/40—Removing material taking account of the properties of the material involved
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00—Materials to be soldered, welded or cut
    • B23K2103/16—Composite materials, e.g. fibre reinforced
    • B23K2103/166—Multilayered materials
    • B23K2103/172—Multilayered materials wherein at least one of the layers is non-metallic

Landscapes

  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • Laser Beam Processing (AREA)
JP60245739A 1985-11-01 1985-11-01 レ−ザ加工装置 Granted JPS62104692A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP60245739A JPS62104692A (ja) 1985-11-01 1985-11-01 レ−ザ加工装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP60245739A JPS62104692A (ja) 1985-11-01 1985-11-01 レ−ザ加工装置

Publications (2)

Publication Number Publication Date
JPS62104692A JPS62104692A (ja) 1987-05-15
JPH0453630B2 true JPH0453630B2 (zh) 1992-08-27

Family

ID=17138080

Family Applications (1)

Application Number Title Priority Date Filing Date
JP60245739A Granted JPS62104692A (ja) 1985-11-01 1985-11-01 レ−ザ加工装置

Country Status (1)

Country Link
JP (1) JPS62104692A (zh)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005509523A (ja) * 2001-11-17 2005-04-14 インステク インコーポレイテッド レーザークラッディングと直接金属造型技術において、イメージ撮影とイメージプロセッシングを利用したクラッディング層高さをリアルタイムでモニタリング及び制御するための方法及びそのシステム

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01306088A (ja) * 1988-06-01 1989-12-11 Nippei Toyama Corp 可変ビームレーザ加工装置
US6483074B2 (en) 2001-03-07 2002-11-19 International Business Machines Corporation Laser beam system for micro via formation
JP2005212364A (ja) * 2004-01-30 2005-08-11 Shibaura Mechatronics Corp 脆性材料の割断加工システム及びその方法
JP4615231B2 (ja) * 2004-02-02 2011-01-19 三星ダイヤモンド工業株式会社 スクライブ装置およびこの装置を用いたスクライブ方法
US20090314752A1 (en) * 2008-05-14 2009-12-24 Applied Materials, Inc. In-situ monitoring for laser ablation
JP5546924B2 (ja) * 2010-03-29 2014-07-09 ビアメカニクス株式会社 レーザ加工方法及びレーザ加工装置
KR20140037044A (ko) * 2011-01-13 2014-03-26 타마랙 사이언티픽 컴퍼니 인코포레이티드 전도성 시드 레이어를 레이저 제거하는 방법 및 장치
US9076860B1 (en) * 2014-04-04 2015-07-07 Applied Materials, Inc. Residue removal from singulated die sidewall
US20150287638A1 (en) * 2014-04-04 2015-10-08 Jungrae Park Hybrid wafer dicing approach using collimated laser scribing process and plasma etch

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5794482A (en) * 1980-12-05 1982-06-11 Hitachi Ltd Pattern forming device by laser

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59165787U (ja) * 1983-04-18 1984-11-07 日本電気株式会社 レ−ザ−トリミング装置の集塵用ノズル

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5794482A (en) * 1980-12-05 1982-06-11 Hitachi Ltd Pattern forming device by laser

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005509523A (ja) * 2001-11-17 2005-04-14 インステク インコーポレイテッド レーザークラッディングと直接金属造型技術において、イメージ撮影とイメージプロセッシングを利用したクラッディング層高さをリアルタイムでモニタリング及び制御するための方法及びそのシステム

Also Published As

Publication number Publication date
JPS62104692A (ja) 1987-05-15

Similar Documents

Publication Publication Date Title
US4734550A (en) Laser processing method
US4190759A (en) Processing of photomask
JP4408361B2 (ja) ウエーハの分割方法
KR900006586B1 (ko) 레이저 스크라이빙 장치와 방법
US20110132885A1 (en) Laser machining and scribing systems and methods
US20140206177A1 (en) Wafer processing method
KR102417323B1 (ko) 반도체 자재의 부분 차폐방법
JP2006319198A (ja) ウエーハのレーザー加工方法およびレーザー加工装置
CN1301178C (zh) 半导体中微结构的紫外线激光烧蚀的图案化
JPS6239539B2 (zh)
JPH0453630B2 (zh)
JP2004042140A (ja) 薄膜除去方法及び装置
KR101530390B1 (ko) 레이저 가공 장치
JP2006142556A (ja) 基板製造装置および基板製造方法
JP2005142303A (ja) シリコンウエーハの分割方法および分割装置
KR102537095B1 (ko) 레이저 가공 장치 및 레이저 가공 방법
JPS63215390A (ja) 光加工方法
JP2004098120A (ja) レーザ加工方法及びレーザ加工装置
JP2005150537A (ja) 板状物の加工方法および加工装置
JP7339031B2 (ja) レーザー加工装置
KR101507215B1 (ko) 유리 단차부 이물의 건식 세정 방법 및 장치
JP2616767B2 (ja) 光処理方法
JP2005152970A (ja) レーザー加工装置
JPS62168688A (ja) レ−ザ加工装置
JP3245988B2 (ja) レーザ加工方法

Legal Events

Date Code Title Description
R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

EXPY Cancellation because of completion of term